JPS61204953A - ハ−メチツクシ−ルカバ−及びその製造方法 - Google Patents

ハ−メチツクシ−ルカバ−及びその製造方法

Info

Publication number
JPS61204953A
JPS61204953A JP60045935A JP4593585A JPS61204953A JP S61204953 A JPS61204953 A JP S61204953A JP 60045935 A JP60045935 A JP 60045935A JP 4593585 A JP4593585 A JP 4593585A JP S61204953 A JPS61204953 A JP S61204953A
Authority
JP
Japan
Prior art keywords
cover
seal ring
sealing ring
gold
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60045935A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365897B2 (enExample
Inventor
Akio Miyoshi
三好　明男
Akira Fukami
深見　明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP60045935A priority Critical patent/JPS61204953A/ja
Priority to US06/836,493 priority patent/US4640436A/en
Publication of JPS61204953A publication Critical patent/JPS61204953A/ja
Publication of JPH0365897B2 publication Critical patent/JPH0365897B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating

Landscapes

  • Ceramic Products (AREA)
  • Fuses (AREA)
JP60045935A 1985-03-08 1985-03-08 ハ−メチツクシ−ルカバ−及びその製造方法 Granted JPS61204953A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60045935A JPS61204953A (ja) 1985-03-08 1985-03-08 ハ−メチツクシ−ルカバ−及びその製造方法
US06/836,493 US4640436A (en) 1985-03-08 1986-03-05 Hermetic sealing cover and a method of producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60045935A JPS61204953A (ja) 1985-03-08 1985-03-08 ハ−メチツクシ−ルカバ−及びその製造方法

Publications (2)

Publication Number Publication Date
JPS61204953A true JPS61204953A (ja) 1986-09-11
JPH0365897B2 JPH0365897B2 (enExample) 1991-10-15

Family

ID=12733124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60045935A Granted JPS61204953A (ja) 1985-03-08 1985-03-08 ハ−メチツクシ−ルカバ−及びその製造方法

Country Status (2)

Country Link
US (1) US4640436A (enExample)
JP (1) JPS61204953A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63305534A (ja) * 1987-06-05 1988-12-13 Sumitomo Metal Mining Co Ltd ハ−メチックシ−ルカバ−の製造方法

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4835120A (en) * 1987-01-12 1989-05-30 Debendra Mallik Method of making a multilayer molded plastic IC package
US4769272A (en) * 1987-03-17 1988-09-06 National Semiconductor Corporation Ceramic lid hermetic seal package structure
JPH0793393B2 (ja) * 1988-02-22 1995-10-09 株式会社東芝 半導体装置の金属製シェル
FR2648275A1 (fr) * 1989-06-09 1990-12-14 Thomson Csf Procede et dispositif d'encapsulation de modules hyperfrequence
US5036584A (en) * 1989-06-13 1991-08-06 Texas Instruments Incorporated Method of manufacture of copper cored enclosures for hybrid circuits
US5258576A (en) * 1989-06-15 1993-11-02 Cray Research, Inc. Integrated circuit chip carrier lid
US5122620A (en) * 1989-06-15 1992-06-16 Cray Research Inc. Chip carrier with terminating resistive elements
US5155067A (en) * 1991-03-26 1992-10-13 Micron Technology, Inc. Packaging for a semiconductor die
US5266833A (en) * 1992-03-30 1993-11-30 Capps David F Integrated circuit bus structure
US5280413A (en) * 1992-09-17 1994-01-18 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
WO1994024702A1 (en) * 1993-04-13 1994-10-27 Johnson Matthey Electronics, Inc. Metal cover for ceramic package and method of making same
US5532513A (en) * 1994-07-08 1996-07-02 Johnson Matthey Electronics, Inc. Metal-ceramic composite lid
WO1996002941A1 (en) * 1994-07-19 1996-02-01 Johnson Matthey Electronics, Inc. Metal cover for ceramic package and method of making same
US5639014A (en) * 1995-07-05 1997-06-17 Johnson Matthey Electronics, Inc. Integral solder and plated sealing cover and method of making same
EP0794616B1 (en) * 1996-03-08 2003-01-29 Matsushita Electric Industrial Co., Ltd. An electronic part and a method of production thereof
US6390353B1 (en) 1998-01-06 2002-05-21 Williams Advanced Materials, Inc. Integral solder and plated sealing cover and method of making the same
JP2001176999A (ja) * 2000-11-27 2001-06-29 Tanaka Kikinzoku Kogyo Kk 電子部品の気密封止方法
US6627987B1 (en) * 2001-06-13 2003-09-30 Amkor Technology, Inc. Ceramic semiconductor package and method for fabricating the package
US20080063889A1 (en) * 2006-09-08 2008-03-13 Alan Duckham Reactive Multilayer Joining WIth Improved Metallization Techniques
US9624137B2 (en) * 2011-11-30 2017-04-18 Component Re-Engineering Company, Inc. Low temperature method for hermetically joining non-diffusing ceramic materials
JP6097959B2 (ja) * 2012-02-27 2017-03-22 コーニング インコーポレイテッド 密閉封止用途のための低Ｔｇガラスガスケット
US10014189B2 (en) * 2015-06-02 2018-07-03 Ngk Spark Plug Co., Ltd. Ceramic package with brazing material near seal member
US11362020B2 (en) * 2020-11-16 2022-06-14 Texas Instruments Incorporated Flipchip package with an IC having a covered cavity comprising metal posts

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3874549A (en) * 1972-05-26 1975-04-01 Norman Hascoe Hermetic sealing cover for a container for a semiconductor device
US3946190A (en) * 1972-05-26 1976-03-23 Semi-Alloys Incorporated Method of fabricating a sealing cover for an hermetically sealed container
US3823468A (en) * 1972-05-26 1974-07-16 N Hascoe Method of fabricating an hermetically sealed container
US4560084A (en) * 1981-09-02 1985-12-24 Burr-Brown Corporation Heater preform for sealing a closure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63305534A (ja) * 1987-06-05 1988-12-13 Sumitomo Metal Mining Co Ltd ハ−メチックシ−ルカバ−の製造方法

Also Published As

Publication number Publication date
US4640436A (en) 1987-02-03
JPH0365897B2 (enExample) 1991-10-15

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees