JPS61194853A - Package for semiconductor ic - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a package for a semiconductor integrated circuit comprising a base body and leads.

Various types of packages for conventional semiconductor integrated circuits are already known, such as DIP 14 pins, QIP 14 pins, L)
IC1' (bin, Q I P, SOT, S I
It is well known by the names such as P.

It is usually printed on the top surface of the package to display the name and other information of the semiconductor integrated circuit.

In the case of conventional printing methods, the completed printed package is dried before being placed in a case. This drying process prevents the print from being damaged while the printing ink has not yet hardened.

However, this conventional printing method, which is mostly an offset printing method, has the following drawbacks. That is, production rates are hindered and excessive drying temperatures may lead to variations in the electrical parameters of the integrated circuit.

Problems to be Solved by the Present Invention An object of the present invention is to enable a printing process for semiconductor integrated circuits to be carried out effectively without the above-mentioned difficulties.

A means to solve problems The present invention solved this problem as follows.

In other words, the upper surface of the base provided for printing is formed to be lower than the edge of the upper surface.

According to one embodiment, the border on the upper surface is formed in the form of a tape, a rectangular parallelepiped, or a bead.

With this configuration of the top surface of the substrate, the traditional disadvantageous properties of printing inks, namely long pot times and drying times, which hinder or delay the production process, are no longer present.

This gives you the advantage of

Yet another advantage of the present invention is that the required printing can be done quickly. That is, there is no need to consider a long drying time, and any inconvenient direct or indirect heating of the package can be avoided. In this case, the ratio between the pot time and drying time of the printing ink is a parameter with little hindrance. It is desirable that the ink can be stored in the pot for as long as possible without losing its properties and consistency, and that it can be fixed or dried immediately after printing.

Embodiment Next, the present invention will be described in detail according to the embodiment shown in the drawings: The package for a semiconductor integrated circuit shown in FIG. It can be made into a standard package as mentioned and the material can be plastic or ceramic. Lead 1 extends from both sides. This package is L)lP
It is a true in-line package with 16 bins, namely 16 bins.

On the upper surface 2a, a rimming portion 1a is formed along the outer edge symmetrically with respect to the longitudinal axis and parallel to each other,
Both of these edge portions 1a are higher than the upper surface 2a. The height in this case is a few tenths of a millimeter. This value is also the width of the border portion 1a.

For example, a pad printing method similar to offset printing is suitable for printing on the upper surface 2a.

Another example of a border is shown in FIG.

The base body 3 and leads 4 are the same as in the example of FIG. The upper surface 2b is limited by rectangular parallelepiped edge portions lb formed at four corners.

The border 1b is raised by a few tenths of a millimeter compared to the upper surface 2b and has a width of the same value.

FIG. 4 shows in a perspective view the shape of the upper surface 2a in the case where the border IC is formed without an acute transition edge.

In this case, the cross-section of the base body 3 forms a cap at the upper edge.

In FIG. 3, a printed semiconductor integrated circuit package is shown housed in a case 5. As shown in FIG.

Due to the fact that the printed upper surfaces 2a, zb are lower than the border, no wear of the upper surfaces 2a, 2b on the inner surface 6 of the case 5 occurs due to undesired contact.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a first embodiment of the 1) IP l 6-bin package according to the present invention, Fig. 2 is a perspective view of a second embodiment of the package, and Fig. 3 is a state in which the package is housed in the case. FIG. 4 is a perspective view of a fourth embodiment of the package. l a , 1 b , I C - edging part, 2 a
, 2b. 2c...Top surface, 3...Base, 4...Lead, 5...
...Case, 6...Inner surface

Claims (1)

[Claims] 1. A package for a semiconductor integrated circuit consisting of a base (3) and leads (4), the upper surface for printing display marks (
2a, 2b, 2c) are the edges (1a, 1b, 1c)
), the semiconductor integrated circuit package 2 is characterized by being configured to have a height lower than that of the base body (3), and the edge portions (1a, 1b, 1c) on the top surface are lower than the base body (3).
In the semiconductor integrated circuit package 3 according to claim 1, the edging portions (1a, 1b, 1c) are formed on the upper surface (2a, 2b, 2c) symmetrically with respect to the vertical axis of the semiconductor integrated circuit package 3. Top surface (2a, 2b
2c), the semiconductor integrated circuit package 4 according to claim 1 or 2, which is formed in a centrally symmetrical shape, the edge portions (1a, 1b) having a prismatic shape, a striped shape,
The semiconductor integrated circuit package 5 according to any one of claims 1 to 3, which is formed in a rectangular parallelepiped shape or a bead shape, and the upper surface (2c) of the base (3) is the upper surface. A package for a semiconductor integrated circuit according to claim 1, which is formed in a shape.