JPH0127565B2 - - Google Patents
Info
- Publication number
- JPH0127565B2 JPH0127565B2 JP14916980A JP14916980A JPH0127565B2 JP H0127565 B2 JPH0127565 B2 JP H0127565B2 JP 14916980 A JP14916980 A JP 14916980A JP 14916980 A JP14916980 A JP 14916980A JP H0127565 B2 JPH0127565 B2 JP H0127565B2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic electronic
- electronic component
- ceramic
- display
- display mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 40
- 239000000758 substrate Substances 0.000 claims description 15
- 229910052573 porcelain Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000010304 firing Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】
本発明は、主として、チツプ状のセラミツク電
子部品に関し、更に詳しくはチツプ状のセラミツ
ク電子部品に表示マークを付する技術に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention mainly relates to chip-shaped ceramic electronic components, and more particularly to a technique for attaching display marks to chip-shaped ceramic electronic components.
チツプ状のセラミツク電子部品は、小型大容量
で絶縁性が高いこと、高い周波数まで優れた周波
数特性を示すこと、一般にモノリシツクな防湿構
造となるので外装なしに使用できること、平面状
の導体パターンに直接ボンデイングが可能である
こと、高信頼性であること等々の特長があり、回
路の厚膜IC化やモジユール化の一端を担う重要
部品として、電子計算機、通信機、テレビ受像
機、ラジオ受信機、電子時計、電卓などの各種の
電子機器に広く利用されつつある。 Chip-shaped ceramic electronic components are small, large-capacity, highly insulating, exhibit excellent frequency characteristics up to high frequencies, generally have a monolithic moisture-proof structure and can be used without an exterior, and can be directly attached to a flat conductor pattern. It has features such as being bondable and highly reliable, and is an important component that plays a part in thick film IC and modularization of circuits, such as computers, communication devices, television receivers, radio receivers, etc. It is becoming widely used in various electronic devices such as electronic watches and calculators.
ところで、此種のセラミツク電子部品に製品区
分またはその他の識別表示マークを付する場合、
従来は、その表面にゴムスタンプもしくは転写ロ
ーラ等により着色塗料を捺印、転写するか、また
は色識別のためのカラーペイント付着させ、その
後焼付処理を行なつて硬化定着させていた。しか
しながら、この従来方法では、セラミツク電子部
品の製造工程と、表示マークの捺印転写工程およ
び焼付工程とが別工程となるため、工数増大によ
る生産性、量産性の低下、コストアツプ等を招く
欠点があつた。 By the way, when attaching a product classification or other identification mark to this type of ceramic electronic component,
Conventionally, a colored paint was stamped or transferred onto the surface using a rubber stamp or a transfer roller, or a colored paint for color identification was attached to the surface, and then a baking process was performed to harden and fix. However, in this conventional method, the manufacturing process of ceramic electronic components and the sealing transfer process and printing process of the display mark are separate processes, which has the disadvantage of reducing productivity and mass production due to increased man-hours, and increasing costs. Ta.
また、セラミツク電子部品として既に完成した
ものに、個別的に表示マークを付して行かなけれ
ばならず、多量同時印刷が困難で、量産性に欠け
る欠点もあつた。特にチツプ状のものは、その平
面積が例えば1.6×3.2ｍ／ｍと非常に小さいた
め、個別的な取扱いが非常に困難で、量産性に欠
け、コストダウンの大きな障害となつていた。 In addition, markings had to be individually attached to already completed ceramic electronic components, making it difficult to print in large quantities at the same time, resulting in a lack of mass productivity. In particular, chips in the form of chips have a very small surface area of, for example, 1.6 x 3.2 m/m, making it extremely difficult to handle them individually, lacking mass production, and posing a major obstacle to cost reduction.
更に、捺印、転写の場合、押印の肩ずれ、にじ
みを生じたり、または部分的もしくは全面的に消
えたりして表示が不鮮明になり易い。また色別表
示マークの場合は、これに盛り込める識別のため
の情報量が少なくなる欠点がある。 Furthermore, in the case of imprinting or transfer, the imprint tends to shift, bleed, or disappear partially or completely, making the display unclear. Furthermore, in the case of color-coded display marks, there is a drawback that the amount of information that can be included for identification is small.
本発明は、セラミツク電子部品の製造工程内で
多量同時印刷が可能で、しかも表示が消失したり
不鮮明になつたりすることのない表示マークを有
するセラミツク電子部品を提供することを目的と
する。 An object of the present invention is to provide a ceramic electronic component that can be printed in large quantities simultaneously during the manufacturing process of the ceramic electronic component and has a display mark that does not disappear or become unclear.
上記目的を達成するため、本発明に係るセラミ
ツク電子部品は、磁器基板の面上に、磁器の凸パ
ターンによる表示マークを一体焼結させたことを
特徴とする。 In order to achieve the above object, the ceramic electronic component according to the present invention is characterized in that a display mark in the form of a convex pattern of ceramic is integrally sintered on the surface of a ceramic substrate.
以下実施例たる添付図面を参照し、本発明の内
容を具体的に説明する。第１図は本発明に係るセ
ラミツク電子部品の斜視図、第２図は同じく正面
断面図である。この実施例では、平板矩形状に形
成された誘電体磁器基板１の厚み方向に、一対の
内部電極２，３を層状に埋設すると共に、該内部
電極２，３の相反する一端縁を、基板１の相対向
する両端部に設けた端部電極４，５に各別に導通
接続した内部電極構造のチツプ状磁器コンデンサ
を示している。 DESCRIPTION OF THE PREFERRED EMBODIMENTS The content of the present invention will be specifically described below with reference to the accompanying drawings, which are examples. FIG. 1 is a perspective view of a ceramic electronic component according to the present invention, and FIG. 2 is a front sectional view thereof. In this embodiment, a pair of internal electrodes 2 and 3 are embedded in a layered manner in the thickness direction of a dielectric ceramic substrate 1 formed into a flat rectangular shape, and one opposite end edge of the internal electrodes 2 and 3 is connected to the substrate. 1 shows a chip-shaped porcelain capacitor having an internal electrode structure in which end electrodes 4 and 5 are respectively electrically connected to opposite ends of a chip.
誘電体磁器基板１の厚み方向の両面には、磁器
の凸パターンより成る表示マーク６，６を一体に
焼結させてある。このような表示マーク６，６
は、従来の表示マークと違つて、消えたり或は不
鮮明になつたりすることがなく、半永久的に、安
定した識別表示機能を発揮する。 On both sides of the dielectric ceramic substrate 1 in the thickness direction, display marks 6, 6 made of a convex pattern of ceramic are sintered together. Such display marks 6,6
Unlike conventional display marks, it does not disappear or become unclear, and exhibits a stable identification display function semi-permanently.
また、表示マーク６，６を形成する場合、焼成
前の誘電体磁器基板１の表面上に、磁器ペースト
を所定の表示マークパターンとなるように印刷塗
布し、誘電体磁器基板１の焼成時に、表示マーク
パターンをも同時に焼成焼結させて表示マーク
６，６を形成することができるから、表示マーク
６，６の形成工程がセラミツク電子部品の製造工
程内に吸収され、量産性が著るしく向上すること
となる。 In addition, when forming the display marks 6, 6, a ceramic paste is printed and coated on the surface of the dielectric ceramic substrate 1 before firing so as to form a predetermined display mark pattern, and when the dielectric ceramic substrate 1 is fired, Since the display marks 6, 6 can be formed by firing and sintering the display mark pattern at the same time, the process of forming the display marks 6, 6 can be incorporated into the manufacturing process of ceramic electronic components, significantly improving mass productivity. It will improve.
更に、この種のセラミツク電子部品は、第３図
に示すように、一枚の広い誘電体磁器基板１上に
多数個のセラミツク電子部品要素Q1〜Qoを格子
状に配列した集合体を一担製造し、この集合体か
らセラミツク電子部品Q1〜Qoを個別的に分割し
て取出す工程を経るのが一般的であり、本発明の
場合、この集合体の状態で各セラミツク電子部品
要素Q1〜Qoに表示マーク６を同時に印刷形成す
ることができるから、量産性が一層向上すること
となる。 Furthermore, as shown in FIG. 3, this type of ceramic electronic component is an assembly in which a large number of ceramic electronic component elements Q 1 to Q o are arranged in a lattice shape on a single wide dielectric ceramic substrate 1. Generally, the ceramic electronic components Q 1 to Q o are manufactured in one stage and then separated and taken out individually from this assembly.In the case of the present invention, each ceramic electronic component is Since the display marks 6 can be printed and formed on the elements Q 1 to Q o at the same time, mass productivity is further improved.
表示マーク６は、誘電体磁器基板１と同質の誘
電体磁器材料によつて構成することが望ましい。
表示マーク６と誘電体磁器基板１との縮率が等し
くなり、縮率の差による悪影響を生じる余地がな
くなり、また表示マーク６を形成する場合に、誘
電体磁器基板１用の誘電体磁器ペーストをそのま
ま使用し、製造工程を簡素化し、量産性を向上さ
せることができるからである。 It is desirable that the display mark 6 is made of the same dielectric ceramic material as the dielectric ceramic substrate 1.
The shrinkage ratios of the display mark 6 and the dielectric ceramic substrate 1 are equal, and there is no room for an adverse effect due to the difference in shrinkage ratio. This is because it can be used as is, simplifying the manufacturing process and improving mass productivity.
また、表示マーク６の高さH1は、端部電極４，
５の高さH2と同等（H1≒H2）かまたはそれ以上
に設定することが望ましい。このような構造であ
ると、当該セラミツク電子部品の実質的な表面
が、表示マーク６の表面に沿つたフラツトな平面
S1となり、端部電極４，５の厚み方向の端縁４
ａ，５ａが平面S1より低くなるから、端部電極
４，５の損傷や、自動装着機のマガジンに積層し
て挿入した場合にしばしば起る端部電極同志の付
着等を、有効に防止することができる。 In addition, the height H 1 of the display mark 6 is the same as that of the end electrode 4,
It is desirable to set the height to be equal to or higher than the height H 2 of No. 5 (H 1 ≈H 2 ). With such a structure, the substantial surface of the ceramic electronic component is a flat plane along the surface of the display mark 6.
S 1 , and the edge 4 of the end electrodes 4 and 5 in the thickness direction
Since a and 5a are lower than the plane S1 , it effectively prevents damage to the end electrodes 4 and 5 and adhesion of the end electrodes to each other, which often occurs when stacked and inserted into the magazine of an automatic placement machine. can do.
上記の実施例では、内部電極構造がチツプ状磁
器コンデンサを例にとつて説明したが、本発明は
磁器基板を使用する各種のセラミツク電子部品に
広く適用し得るものである。 In the above embodiment, the internal electrode structure was explained using a chip-shaped ceramic capacitor as an example, but the present invention can be widely applied to various ceramic electronic components using a ceramic substrate.
以上述べたように、本発明は、磁器基板の面上
に、磁器の凸パターンによる表示マークを一体焼
結させたことを特徴とするから、セラミツク電子
部品の製造工程内で多量同時印刷が可能で量産性
に富み、しかも表示が消失したり不鮮明になつた
りすることなく、安定した識別表示機能を発揮す
る表示マークを有するセラミツク電子部品を提供
することができる。 As described above, the present invention is characterized by integrally sintering the display mark in the form of a convex pattern of porcelain on the surface of the porcelain substrate, so that it is possible to simultaneously print a large number of ceramic electronic components in the manufacturing process. It is possible to provide a ceramic electronic component having a display mark that is easy to mass-produce and exhibits a stable identification display function without the display disappearing or becoming unclear.
第１図は本発明に係るセラミツク電子部品の斜
視図、第２図は同じくその正面断面図、第３図は
同じくその製造方法を説明する図。
１……誘電体磁器基板、４，５……端部電極、
６……表示マーク。
FIG. 1 is a perspective view of a ceramic electronic component according to the present invention, FIG. 2 is a front sectional view thereof, and FIG. 3 is a diagram illustrating a manufacturing method thereof. 1... Dielectric ceramic substrate, 4, 5... End electrode,
6...Display mark.
Claims (1)
表示マークを一体焼結させたことを特徴とするセ
ラミツク電子部品。 ２ 前記表示マークは、前記磁器基板と同質の磁
器によつて形成したことを特徴とする特許請求の
範囲第１項に記載のセラミツク電子部品。 ３ 前記磁器基板は、相対向する両端部にそれぞ
れ端部電極を有することを特徴とする特許請求の
範囲第１項または第２項に記載のセラミツク電子
部品。 ４ 前記表示マークは、その高さが前記端部電極
と同等もしくはそれ以上であることを特徴とする
特許請求の範囲第３項に記載のセラミツク電子部
品。[Scope of Claims] 1. A ceramic electronic component characterized in that a display mark in the form of a convex pattern of porcelain is integrally sintered on the surface of a ceramic substrate. 2. The ceramic electronic component according to claim 1, wherein the display mark is made of porcelain of the same quality as the ceramic substrate. 3. The ceramic electronic component according to claim 1 or 2, wherein the ceramic substrate has end electrodes at opposite ends thereof, respectively. 4. The ceramic electronic component according to claim 3, wherein the display mark has a height equal to or greater than that of the end electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14916980A JPS5772313A (en) | 1980-10-24 | 1980-10-24 | Ceramic electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14916980A JPS5772313A (en) | 1980-10-24 | 1980-10-24 | Ceramic electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5772313A JPS5772313A (en) | 1982-05-06 |
| JPH0127565B2 true JPH0127565B2 (en) | 1989-05-30 |
Family
ID=15469299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14916980A Granted JPS5772313A (en) | 1980-10-24 | 1980-10-24 | Ceramic electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5772313A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58159731U (en) * | 1982-04-19 | 1983-10-25 | 株式会社村田製作所 | electronic components |
| JPS60105212A (en) * | 1983-11-11 | 1985-06-10 | 松下電器産業株式会社 | Method of producing laminated ceramic condenser |
| JPS6092818U (en) * | 1983-11-30 | 1985-06-25 | 日本電気株式会社 | Chip type electronic components |
| CN102969302B (en) * | 2012-11-21 | 2015-08-26 | 华中科技大学 | Based on the electron beam overlay mark and preparation method thereof of hafnium oxide |
| JP5772808B2 (en) * | 2012-12-25 | 2015-09-02 | 株式会社村田製作所 | Multilayer ceramic electronic components |
-
1980
- 1980-10-24 JP JP14916980A patent/JPS5772313A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5772313A (en) | 1982-05-06 |
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