JPH0540582Y2 - - Google Patents

Description

[Detailed explanation of the invention] (Field of industrial application) This invention is mainly used for surface-mount electronic components, which are used mainly in IC cards, etc., whose demand has rapidly increased due to the miniaturization of electronic devices in recent years. This field relates to the structure of a package for surface-mounted electronic components such as crystal resonators of 1 mm or less.

(Prior Art) Conventionally, there have been packages in which a part of the package is provided with a through hole for taking out an electrode terminal, or a package that is overprinted by thick film conductor printing.

(Problem that the invention is trying to solve) In the conventional case where a through hole is provided in a part of the package to take out the electrode terminal, when processing the through hole, it is difficult to process the through hole. When etching is used to form holes with a uniform diameter of 0.2 millimeters, the thickness of the substrate is theoretically limited to the same size or less as the hole diameter. Additionally, laser processing has the disadvantage that it is prone to cracks and is difficult to mass produce. Furthermore, when a mold is formed on an alumina ceramic substrate before sintering, dimensional errors occur due to expansion and contraction of the substrate due to sintering.

There is an excess or deficiency in the amount of silver conductor paste filled into the through-hole, and the volume of the conductor paste decreases by nearly 50% during the firing process of the conductor paste, which tends to create gaps in the through-hole. There was a drawback that removal of the product and hermetic sealing of the package were incomplete, resulting in a decrease in product yield due to poor hermetic sealing.

In the case of a board with a thickness of about 0.15 mm that uses alumina ceramics for the package, the presence of through holes significantly reduces the strength and has the disadvantage of making it more likely to break at the through holes.

In addition, in the overprinting type using thick film conductor printing,
Approximately 0.04 mm on the package surface due to the thickness of the conductor part
There was a drawback that millimeter bulges were formed, making hermetic sealing difficult, and the product yield decreased due to poor hermetic sealing.

The purpose of this invention is to provide a through-hole in a part of a conventional package to take out an electrode terminal, and a surface-mount type electronic component package using normal thick-film conductor printing. It solves these problems and has good airtight sealing.
By providing a surface-mount electronic component package that maintains the strength of the product, allows the product to be made even thinner, and when through-hole processing is performed by etching, the process of aligning the front and back photomasks can be reduced. Furthermore, if the crossover glass is printed not only on the grooved part but also on the entire area between the annular hermetic sealing electrode conductor and the alumina ceramic substrate, the adhesion of the annular hermetic sealing electrode conductor to the package will be reduced. It is an object of the present invention to provide a surface-mounted electronic component package which is further strengthened, has improved hermetic sealing accuracy, and improves product yield.

(Means for solving the problem) In order to achieve this purpose, this invention has the following structure.

In other words, a fine ceramic sintered substrate and an electrode drawer that is processed by etching or the like on a part of the upper surface of the fine ceramic sintered substrate to draw out the electrode wire to be used as a terminal to connect the element and the external electrode. an electrode conductor formed by printing a thick film conductor using silver conductor paste or copper conductor paste in the electrode extraction groove;
A glass insulator is printed on the surface of the electrode conductor to fill the groove with crossover glass as an insulator to make the package surface flat, and further a silver conductor paste or a copper conductor paste is applied on the glass insulator. and an annular hermetic sealing electrode conductor printed with a thick film conductor.

(Example) An example of this invention will be described with reference to the drawings.

First Embodiment A first embodiment of this invention will be described with reference to FIGS. 1 to 5.

Reference numeral 5 denotes a fine ceramic sintered substrate with a thickness of 1 mm or less, and a portion of one side of the sintered substrate 5 is etched by etching or the like to form a recess 6 with a width of 0.1 mm to simultaneously form a terminal to be connected to the element and external electrode. An electrode lead-out groove 1 of approximately 0.05 mm in depth is formed, and then the inner edge upper surface 21 of the electrode lead-out groove 1 and the electrode lead-out groove 1 are printed using a thick film conductor printing method using silver conductor paste or copper conductor paste. An electrode connecting portion 7, an etched groove conductor 2, and an external electrode connecting terminal 8 are formed on the outer edge upper surface 22 and outer end surface 23 of the electrode extraction groove 1, respectively, to connect to the electrodes of the element included in the package.

Furthermore, the glass insulator 3 is embedded in the electrode extraction groove by printing the crossover glass. At this time, the upper surface of the glass insulator 3, the inner edge upper surface 21 of the electrode extraction groove 1, and the outer edge upper surface 22 of the electrode extraction groove 1 are made to be on the same plane. (See Figure 1C). The above glass insulator 3
An annular hermetic sealing electrode conductor 4 is formed on the upper surface of the electrode conductor 4 by thick film conductor printing means using silver conductor paste or copper conductor paste. At this time, the inner peripheral edge and outer peripheral edge of the annular hermetic sealing electrode conductor 4 are made not to connect with the ends of the electrode connecting portion 7 and the external electrode connecting terminal 8. Note that 6 is a recess formed by etching.

Second Embodiment A second embodiment of this invention will be described with reference to FIGS. 6 to 8.

In the second embodiment, a glass insulator 3 is embedded in the electrode lead-out groove 1 and the conductor 2 in the etched groove by printing the crossover glass.
At this time, the upper surface of the glass insulator 3 is buried so as to be flush with the upper surfaces of the electrode connecting portion 7 and the external electrode connecting terminal 8, and is made of alumina ceramic sintered material on which the annular hermetic sealing electrode conductor 4 is printed. It is printed on the entire outer peripheral area of the upper surface of the circuit board. Therefore, the annular hermetic sealing electrode conductor 4 is further printed on the upper surface of the printing area of the annular glass insulator 3. If the second embodiment is used, when the crossover glass is printed on the entire area between the annular hermetic sealing electrode conductor and the fine ceramic substrate, the annular hermetic sealing electrode conductor will not adhere to the package. It is further strengthened, the precision of hermetic sealing is even better, and the yield of the product is further improved.

(Effects) As mentioned above, this idea consists of a sintered fine ceramic substrate and a part of the upper surface of the fine ceramic sintered substrate that is etched to form a terminal for connecting to an element and an external electrode. An electrode conductor formed by printing a thick film conductor using a silver conductor paste or a copper conductor paste within the electrode conductor groove, and an insulator on the surface of the electrode conductor. A glass insulator is printed to fill the groove with crossover glass to make the package surface flat, and a thick film conductor is printed on the glass insulator using silver conductor paste or copper conductor paste. It consists of an annular hermetic sealing electrode conductor,
There is no need for through-hole processing, which allows for greater processing accuracy, and there is less occurrence of defects in the hermetic sealing of the package due to removal of electrode terminals, improving product yield.

Furthermore, since there is no through-hole portion, there is no reduction in product strength due to this, and leakage of hermetic sealing due to insufficient filling in the through-holes cannot occur.

In the conventional model, the thick film conductor was overprinted without groove processing, resulting in a raised part on a part of the hermetic sealing electrode, and when the upper plate was assembled, the upper plate and the surface-mount electronic component package were Air leakage occurred in the airtight seal between the parts, but in the present invention, the electrode terminals are taken out by cutting grooves, so the surface of the package becomes flat, the precision of the airtight seal is improved, and the product yield is improved. improves.

Since the number of times of thick film conductor printing is reduced, the total thickness of the product can be further reduced. Moreover, since there is no through-hole part, the photomask can be manufactured by etching from one side, so only one photomask is required, and the process of aligning the front and back photomasks can be reduced. Furthermore, since there is no need to open small through holes, even slight variations in etching can be handled without regard to the performance of the package, resulting in excellent effects such as improved product yield.

[Brief explanation of the drawing]

The drawings show embodiments of this invention. Fig. 1 is a sectional view showing the manufacturing process of a surface-mounted electronic component package showing the first embodiment of this invention, and Fig. 2 shows the first embodiment of this invention. Partially enlarged sectional view showing 3rd
Figure 4 is a sectional view taken along line A-A in Figure 3, Figure 5 is a sectional view taken along line B-B in Figure 3, and Figure 6 is a plan view showing the first embodiment of this invention. Sectional view shown, No. 7
The figure is a plan view showing the second embodiment, and Figure 8 is Figure 7C.
-C line sectional view. DESCRIPTION OF SYMBOLS 1... Groove for electrode extraction, 2... Conductor in etched groove, 3... Glass insulator, 4... Annular electrode conductor for airtight sealing, 5... Sintered fine ceramics substrate, 6... Recess , 7... Electrode connection part, 8
... External electrode connection terminal, 21 ... Inner edge upper surface, 22
...Outer edge top surface, 23...Outer end surface.

Claims (1)

[Scope of utility model registration request] A sintered substrate of fine ceramics, and a groove for drawing out an electrode, which is formed by etching or the like on a part of the upper surface of the sintered substrate of fine ceramics, for drawing out an electrode wire to serve as a terminal for connecting to an element and an external electrode. Then, an electrode conductor is formed by printing a thick film conductor using silver conductor paste or copper conductor paste in this electrode lead-out groove, and a package is formed by filling the groove with crossover glass as an insulator on the surface of the electrode conductor. Consists of a glass insulator printed with a flat surface, and a ring-shaped electrode conductor for airtight sealing made by printing a thick film conductor on the glass insulator using silver conductor paste or copper conductor paste. A surface-mounted electronic component package characterized by: