JPH03250701A - Manufacture of chip resistor - Google Patents
Manufacture of chip resistorInfo
- Publication number
- JPH03250701A JPH03250701A JP4758190A JP4758190A JPH03250701A JP H03250701 A JPH03250701 A JP H03250701A JP 4758190 A JP4758190 A JP 4758190A JP 4758190 A JP4758190 A JP 4758190A JP H03250701 A JPH03250701 A JP H03250701A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- paste
- printing
- film
- chip resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000007639 printing Methods 0.000 claims abstract description 19
- 239000011521 glass Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims description 22
- 238000007747 plating Methods 0.000 claims description 12
- 238000010304 firing Methods 0.000 claims description 8
- 239000002003 electrode paste Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000010408 film Substances 0.000 abstract description 11
- 239000010409 thin film Substances 0.000 abstract description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 4
- 238000009966 trimming Methods 0.000 abstract description 4
- 229910001925 ruthenium oxide Inorganic materials 0.000 abstract description 3
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 2
- 239000011230 binding agent Substances 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 229910052763 palladium Inorganic materials 0.000 abstract description 2
- YJVFFLUZDVXJQI-UHFFFAOYSA-L palladium(ii) acetate Chemical compound [Pd+2].CC([O-])=O.CC([O-])=O YJVFFLUZDVXJQI-UHFFFAOYSA-L 0.000 abstract description 2
- 150000003304 ruthenium compounds Chemical class 0.000 abstract description 2
- 238000005979 thermal decomposition reaction Methods 0.000 abstract description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、チップ抵抗体の製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a chip resistor.
従来の技術
近年、チップ抵抗体は小型軽量化がすすみ電子回路の高
密度実装化に大いに貢献しているが、小型軽量化に伴い
より高性能なチップ抵抗体が産業界より強く要望されて
いる。Conventional technology In recent years, chip resistors have become smaller and lighter, and have greatly contributed to the high-density packaging of electronic circuits.However, as chip resistors become smaller and lighter, there is a strong demand from industry for higher performance chip resistors. .
以下に従来のチップ抵抗体の製造方法について述べる。A conventional method for manufacturing a chip resistor will be described below.
先ず、従来の工程は、第３図に示すように、電極を印刷
・焼成により形成した後（工程ム）、抵抗体を形成する
ために抵抗材料を印刷し焼成する抵抗体印刷焼成工程（
工程Ｂ）が行われ、続いて上記抵抗体をガラス等により
被覆し保護するためのオーバーコート印刷焼成工程（工
程Ｃ，Ｄ）を経て、レーザによる抵抗値修正工程（工程
Ｘ）が行われる。そして、捺印文字を形成するための厚
膜白色捺印ペースト印刷焼成工程（工程Ｆ、Ｇ）が行わ
れ、さらに端面電極形成するための端面電極ペースト印
刷焼成工程（工程Ｈ）の後、電極及び端面電極上に半田
付は性の信頼性を維持するためにメッキ膜を形成するメ
ッキ工程（工程Ｘ）が実施され、検査等が行われて完成
品とされている（工程Ｊ）。First, as shown in FIG. 3, in the conventional process, after electrodes are formed by printing and firing (step M), there is a resistor printing and firing step (step M) in which a resistive material is printed and fired to form a resistor.
Step B) is performed, followed by an overcoat printing and baking step (steps C and D) for covering and protecting the resistor with glass or the like, and then a resistance value correction step using a laser (step X). Then, a thick film white sealing paste printing and firing step (steps F and G) is performed to form the stamped characters, and an end electrode paste printing and firing step (step H) is performed to form the end electrode. In order to maintain the reliability of soldering on the electrodes, a plating process (process X) is carried out to form a plating film, and inspection and the like are performed to produce a finished product (process J).
発明が解決しようとする課題
しかしながら、上記従来の方法では、レーザによる抵抗
値修正を行ったのち、捺印ペースト印刷焼成工程及び端
面電極印刷焼成工程を行うので抵抗値が大きくドリフト
するという問題点を有していた。Problems to be Solved by the Invention However, in the conventional method described above, after the resistance value is corrected using a laser, the stamp paste printing and baking process and the end face electrode printing and baking process are performed, so there is a problem that the resistance value drifts significantly. Was.
また、厚膜ペーストの印刷焼成により形成される捺印文
字により抵抗体表面に凹凸が生じるので、自動実装時の
吸着ミスが発生するという問題点も有していた。本発明
は上記従来の問題点を解決するためのものである。Furthermore, since the stamped characters formed by printing and firing the thick film paste create irregularities on the surface of the resistor, there is also the problem that suction errors occur during automatic mounting. The present invention is intended to solve the above-mentioned conventional problems.
課題を解決するための手段
この問題を解決するために本発明によるチップ抵抗体の
製造方法は、抵抗体をガラス被覆し保護するためのガラ
ス印刷焼成工程と、チップ抵抗体素子の表面に文字を形
成するためのメッキ核を形成するための捺印ペースト印
刷焼成工程と、上記抵抗体の特性をそろえるための抵抗
値修正工程と。Means for Solving the Problem In order to solve this problem, the method for manufacturing a chip resistor according to the present invention includes a glass printing and baking process to cover and protect the resistor with glass, and a process for printing characters on the surface of the chip resistor element. a stamping paste printing and baking step for forming plating nuclei for forming the resistor; and a resistance value correction step for aligning the characteristics of the resistor.
端面電極を形成するための端面電極ペーストの印刷焼成
工程と、端面電極の半田濡れ性を改善するとともに捺印
文字を形成するためのメッキ工程とを備えた方法である
。This method includes a printing and baking process of an end electrode paste to form an end electrode, and a plating process to improve the solder wettability of the end electrode and to form a stamp.
作用
この構成により、捺印ペースト印刷焼成工程の後にレー
ザトリミングを行い、メッキ工程を経ることにより捺印
文字が形成され、抵抗値修正後の焼成工程による抵抗値
ドリフトの値が小さくなるとともに、抵抗体表面の凹凸
がなくなるため、自動実装時の吸着ミスも改善され、環
境特性の優れた抵抗体が得られることになる。Effect: With this configuration, the marking paste is printed and fired, followed by laser trimming, and then the plating process is performed to form the marking characters.The resistance value drift caused by the firing process after the resistance value correction is reduced, and the resistor surface is Since the unevenness of the resistor is eliminated, suction errors during automatic mounting are also reduced, and a resistor with excellent environmental characteristics can be obtained.
実施例
以下、本発明の一実施例について、図面を参照しながら
説明する。第１図は本発明の一実施例におけるチップ抵
抗体の製造工程を示す図、第２図はその工程により得ら
れるチップ抵抗体を示す図である。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a manufacturing process of a chip resistor according to an embodiment of the present invention, and FIG. 2 is a diagram showing a chip resistor obtained by the process.
まず、アンダーグレーズ処理による層２を施した９６％
アルミナ基板１上に有機ルテニウム化合物の熱分解によ
る酸化ルテニウム薄膜の抵抗体３を形成する（工程ム）
。この上に、電極４を形成した後（工程Ｂ）、上記抵抗
体３を保護するガラス膜６を形成するためにオーバーコ
ート印刷しく工程Ｃ）、つづいてパラジウムアセテート
にバインダーとしてロジンを添加した捺印ペーストを印
刷する（工程Ｄ）。次に、このチップ抵抗体を焼成する
（工程Ｅ）。ここで、本実施例における捺印ペーストは
焼成するとパラジウムメッキ核のみ形成されるため、透
明になるのでオーバーコートのガラス膜６に外見上の変
化を与えず、次段階のレーザートリミングによる抵抗値
修正（工程Ｆ）では、ガラス膜５に影響を与えることな
く抵抗体３のみをトリミングすることができる。First, 96% with layer 2 of underglaze treatment.
Forming a resistor 3 of a ruthenium oxide thin film on an alumina substrate 1 by thermal decomposition of an organic ruthenium compound (process step)
. After forming the electrode 4 thereon (step B), an overcoat is printed to form a glass film 6 that protects the resistor 3 (step C), and then a stamp is made by adding rosin as a binder to palladium acetate. Print the paste (Step D). Next, this chip resistor is fired (step E). Here, when the marking paste in this example is fired, only palladium plating nuclei are formed, so it becomes transparent and does not change the appearance of the glass film 6 of the overcoat. In step F), only the resistor 3 can be trimmed without affecting the glass film 5.
次に、電極４に接続されるように端面電極６を銀ペース
トの印刷・焼成により形成した後（工程Ｇ）、無電解銅
メッキや無電解ニッケルメッキ液に浸漬して１図に示す
ように絶縁性のアルミナ基板１０表面に形成された抵抗
体３の端面の端面電極６の表面に金属層７を析出させる
と同時に、捺印ペーストにより形成されたメッキ核上に
捺印文字８を形成させる（工程Ｈ）。Next, after forming an end electrode 6 by printing and firing a silver paste so as to be connected to the electrode 4 (Step G), it is immersed in an electroless copper plating or electroless nickel plating solution to form the end electrode 6 as shown in Figure 1. A metal layer 7 is deposited on the surface of the end face electrode 6 of the end face of the resistor 3 formed on the surface of the insulating alumina substrate 10, and at the same time, a stamp character 8 is formed on the plating core formed by the stamp paste (step H).
その後、検査等を行うことにより完成品とされる（工程
工）。After that, it is made into a finished product by performing inspection etc. (processing).
なお、本実施例において、抵抗体として酸化ルテニウム
を用いたが、金属薄膜、他の金属酸化物薄膜、金属窒化
物薄膜、ホウ化物薄膜であっても良いことは言うまでも
ない。In this example, ruthenium oxide was used as the resistor, but it goes without saying that a metal thin film, another metal oxide thin film, a metal nitride thin film, or a boride thin film may be used.
発明の効果 以上のように本発明は、捺印ペーストを用い。Effect of the invention As described above, the present invention uses a stamp paste.
捺印ペースト印刷焼成後にレーザトリミングを行うこと
により、抵抗値ドリフトを小さくすることができ、また
メッキ膜による捺印なので抵抗体表面の凹凸が小さく優
れたチップ抵抗体を実現できるものである。By performing laser trimming after printing and baking the marking paste, it is possible to reduce the resistance value drift, and since the marking is made of a plating film, it is possible to realize an excellent chip resistor with small irregularities on the surface of the resistor.
第１図は本発明の一実施例によるチップ抵抗体の製造方
法における製造工程図、第２図ａ、ｂは同方法により得
られたチップ抵抗体を示す上面図および断面図、第３図
は従来のチップ抵抗体の製造方法における製造工程図で
ある。
３・・・・・・抵抗体、６・・・・・・ガラス膜、６・
・・・・・端面電極、７・・・・・・金属層、８・・・
・・・捺印文字。FIG. 1 is a manufacturing process diagram of a method for manufacturing a chip resistor according to an embodiment of the present invention, FIGS. FIG. 3 is a manufacturing process diagram in a conventional method for manufacturing a chip resistor. 3...Resistor, 6...Glass film, 6.
...End face electrode, 7...Metal layer, 8...
...Sealed characters.
Claims (1)
工程と、チップ抵抗体素子の表面に文字を形成するため
のメッキ核を形成するための捺印ペースト印刷焼成工程
と、上記抵抗体の特性をそろえるための抵抗値修正工程
と、端面電極を形成するための端面電極ペーストの印刷
焼成工程と、端面電極の半田濡れ性を改善するとともに
捺印文字を形成するためのメッキ工程とを備えたことを
特徴とするチップ抵抗体の製造方法。A glass printing and baking process to cover and protect the resistor with glass, a printing paste printing and baking process to form plating nuclei for forming characters on the surface of the chip resistor element, and matching the characteristics of the resistor. A process of printing and firing an end electrode paste to form an end electrode, and a plating process to improve the solder wettability of the end electrode and form a stamp. A method for manufacturing a chip resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4758190A JPH03250701A (en) | 1990-02-28 | 1990-02-28 | Manufacture of chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4758190A JPH03250701A (en) | 1990-02-28 | 1990-02-28 | Manufacture of chip resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03250701A true JPH03250701A (en) | 1991-11-08 |
Family
ID=12779220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4758190A Pending JPH03250701A (en) | 1990-02-28 | 1990-02-28 | Manufacture of chip resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03250701A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0786003A (en) * | 1993-09-14 | 1995-03-31 | Rohm Co Ltd | Method of manufacturing chip resistor |
| WO2011090061A1 (en) * | 2010-01-22 | 2011-07-28 | 荒川化学工業株式会社 | Easily thermally decomposable binder resin, binder resin composition and use of said composition |
-
1990
- 1990-02-28 JP JP4758190A patent/JPH03250701A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0786003A (en) * | 1993-09-14 | 1995-03-31 | Rohm Co Ltd | Method of manufacturing chip resistor |
| WO2011090061A1 (en) * | 2010-01-22 | 2011-07-28 | 荒川化学工業株式会社 | Easily thermally decomposable binder resin, binder resin composition and use of said composition |
| US8829077B2 (en) | 2010-01-22 | 2014-09-09 | Arakawa Chemical Industries, Ltd. | Easily thermally decomposable binder resin, binder resin composition and use of said composition |
| JP5664875B2 (en) * | 2010-01-22 | 2015-02-04 | 荒川化学工業株式会社 | Easily decomposable binder resin, binder resin composition and use of the composition |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20090322468A1 (en) | Chip Resistor and Manufacturing Method Thereof | |
| JPH03250701A (en) | Manufacture of chip resistor | |
| JP3231370B2 (en) | Manufacturing method of square chip resistor | |
| US4694568A (en) | Method of manufacturing chip resistors with edge around terminations | |
| JPH0521204A (en) | Square-shaped chip resistor and manufacture thereof | |
| JP3111823B2 (en) | Square chip resistor with circuit inspection terminal | |
| JPH1092601A (en) | Terminal electrode for surface mount electronic parts and its manufacture | |
| EP0398572A1 (en) | Method of manufacturing a thick film resistor element | |
| JP2741762B2 (en) | Temperature sensitive resistor and method of manufacturing the same | |
| JP2775718B2 (en) | Chip resistor and manufacturing method thereof | |
| JP2939425B2 (en) | Surface mount type resistor and its manufacturing method | |
| JPH04372101A (en) | Square-shaped chip resistor and its manufacture | |
| JPH0127565B2 (en) | ||
| JPH08236325A (en) | Chip resistor manufacturing method | |
| JP3561635B2 (en) | Network resistor and manufacturing method thereof | |
| JPS6015323Y2 (en) | CR composite electronic parts | |
| JPH0513201A (en) | Square chip resistance | |
| JP3159440B2 (en) | Square chip resistors | |
| JPH0445263Y2 (en) | ||
| JP2718178B2 (en) | Manufacturing method of square plate type thin film chip resistor | |
| JP2866808B2 (en) | Manufacturing method of chip resistor | |
| JP2000003801A (en) | Surface mount resistor and production method thereof | |
| JPH087615Y2 (en) | Chip type electronic parts | |
| JPS62169301A (en) | Temperature coefficient regulation of thick film resistance element | |
| JP2002231505A (en) | Chip resistor and its manufacturing method |