JPS58170842U - microwave integrated circuit - Google Patents
microwave integrated circuitInfo
- Publication number
- JPS58170842U JPS58170842U JP6654082U JP6654082U JPS58170842U JP S58170842 U JPS58170842 U JP S58170842U JP 6654082 U JP6654082 U JP 6654082U JP 6654082 U JP6654082 U JP 6654082U JP S58170842 U JPS58170842 U JP S58170842U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- microwave integrated
- metal piece
- dielectric substrate
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半田付部の側面図、第２図は銅、アルミ
ナの温度対線膨張の関係を示す線図第３図′は本考案の
一実施例を示す分解図、第４図は第３図の実施例を説明
する側面図、第５図、第□６図１ま本考案の他の実施例
を示す分解図である。
１、 １６． １７・・・誘電体基板、２． １１．
１８・・・金属片（キャリアプレート）、３・・・半田
、４・・・アルミナの熱膨張曲線、５・・！銅の熱膨張
曲線、７・・・５０Ωストリツプライン、８・・・トリ
ミングパターン、９・・・マイクロ波素子、１０・・・
チップキャリア、１１・・・キャリアプレート、１２．
１３・・・溝、１９・・・孔、２０・・・切欠き部。Fig. 1 is a side view of a conventional soldering part, Fig. 2 is a diagram showing the relationship between temperature and linear expansion of copper and alumina, Fig. 3' is an exploded view showing an embodiment of the present invention, and Fig. 4 3 is a side view illustrating the embodiment of the present invention, and FIGS. 5 and 6 are exploded views showing other embodiments of the present invention. 1, 16. 17...dielectric substrate, 2. 11.
18...Metal piece (carrier plate), 3...Solder, 4...Thermal expansion curve of alumina, 5...! Thermal expansion curve of copper, 7...50Ω strip line, 8...Trimming pattern, 9...Microwave element, 10...
Chip carrier, 11... carrier plate, 12.
13... Groove, 19... Hole, 20... Notch.
Claims (4)
配設された誘電体基板を金属片に半田付して構成される
マイクロ波集積回路において、前記誘電体基板が半田付
される前記金属片の表面に四部を形成し半田付面を減少
させたことを特徴とするマイクロ波集積回路。(1) In a microwave integrated circuit configured by soldering a dielectric substrate on which at least strip lines and microwave elements are arranged to a metal piece, the dielectric substrate is attached to the surface of the metal piece to which the dielectric substrate is soldered. A microwave integrated circuit characterized by forming four parts and reducing the soldering surface.
であることを特徴とする実用新案登録請求の範囲第（１
）項記載のマイクロ波集積回路。(2) Utility model registration claim No. 1, characterized in that the recess is a groove formed across the top surface of the metal piece.
Microwave integrated circuit described in ).
特徴とする実用新案登録請求の範囲第（１）項記載のマ
イクロ波集積回路。(3) The microwave integrated circuit according to claim (1), wherein the recess is a hole formed in the upper surface of the metal piece.
ことを特徴とする実用新案登録請求の範囲第（１）項記
載のマイクロ波集積回路。(4) The microwave integrated circuit according to claim 1, wherein the recesses are notches formed at the four corners of the metal piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6654082U JPS58170842U (en) | 1982-05-10 | 1982-05-10 | microwave integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6654082U JPS58170842U (en) | 1982-05-10 | 1982-05-10 | microwave integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58170842U true JPS58170842U (en) | 1983-11-15 |
Family
ID=30076406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6654082U Pending JPS58170842U (en) | 1982-05-10 | 1982-05-10 | microwave integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58170842U (en) |
-
1982
- 1982-05-10 JP JP6654082U patent/JPS58170842U/en active Pending
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