JPS602873U - Soldering structure of surface mount transistor - Google Patents
Soldering structure of surface mount transistorInfo
- Publication number
- JPS602873U JPS602873U JP9544283U JP9544283U JPS602873U JP S602873 U JPS602873 U JP S602873U JP 9544283 U JP9544283 U JP 9544283U JP 9544283 U JP9544283 U JP 9544283U JP S602873 U JPS602873 U JP S602873U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electrode pattern
- surface mount
- pattern
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図乃至第５図は従来例に係り、第１図ａ。
ｂ、 ｃは夫々面実装トランジスタの側面図と上面図
と裏面図、第２図は基板上の電極パターンを概略的に示
す図、第３図は面実装トランジスタの半田付けを示す図
でありａは平面図、ｂは側面図である。第４図は、半田
クリームの表面張力により面実装トランジスタの位置が
ズした状態を表わす、−図、第５図は面実装トランジス
タの位置ズレを防ぐ従来例を示す図、第６図乃至第８図
は本考案の一実施例に係り、第６図は本考案の電極パタ
ーンを概略的に示す図、第７図は本考案の半田付は構造
を示す平面図、第８図は本考案の半田付は構造を示す側
面図である。
１・・・・・・面実装トランジスタ、２・・・・・・コ
レクタ電極（ヘッダ部）、３・・・・・・ベース電極、
４・・・・・・エミッタ電極、５・・・・・・第１のｔ
ｔ電極パターン６・・・・・・第２の電極パターン、７
・・・・・・第３の電極パターン、７ａ・・・・・・第
３の電極パターンの端部、７ｂ・・・・・・突出部、８
・・・・・・基板。1 to 5 relate to a conventional example, and FIG. 1a shows a conventional example. b, c are a side view, top view, and back view of a surface mount transistor, respectively, FIG. 2 is a diagram schematically showing the electrode pattern on the board, and FIG. 3 is a diagram showing soldering of the surface mount transistor. is a plan view, and b is a side view. Figure 4 shows a state in which the position of a surface-mounted transistor has shifted due to the surface tension of the solder cream. The figures relate to an embodiment of the present invention, FIG. 6 is a diagram schematically showing the electrode pattern of the present invention, FIG. 7 is a plan view showing the soldering structure of the present invention, and FIG. 8 is a diagram showing the soldering structure of the present invention. Soldering is a side view showing the structure. 1...Surface mount transistor, 2...Collector electrode (header part), 3...Base electrode,
4... Emitter electrode, 5... First t
t-electrode pattern 6...Second electrode pattern, 7
......Third electrode pattern, 7a...End of third electrode pattern, 7b...Protrusion, 8
······substrate.
Claims (1)
較的大きなコレクタ電極を備える面実装トランジスタと
、前記ベース電極が半田付けされる第１の電極パターン
と、前記エミッタ電極が半田付けされる第２の電極パタ
ーンと、前記ベース電極及びエミッタ電極とは反対側の
位置に形成されたコレクタ電極が半田付けされる比較的
大きな第３の電極パターンと、前記３つの電極パターン
が配された基板より成る面実装トランジスタの半田付は
構造に於いて、前記第３の電極パターンの前記第１の電
極パターン及び第２の電極パターンより最も遠方に位置
する端部に、前記第３の電極パターンの端部から前記第
１の電極パターン及び前記第２の電極パターンと反対方
向に延びる幅狭の突出部を設けたことを特徴とする面実
装トランジスタの半田付は構造。A surface mount transistor includes a base electrode, an emitter electrode, and a relatively large collector electrode that also serves as a heat dissipation fin, a first electrode pattern to which the base electrode is soldered, and a second electrode pattern to which the emitter electrode is soldered. a surface consisting of an electrode pattern, a relatively large third electrode pattern to which a collector electrode formed at a position opposite to the base electrode and emitter electrode is soldered, and a substrate on which the three electrode patterns are arranged; In the structure, soldering of the mounted transistor is performed from the end of the third electrode pattern to the end of the third electrode pattern that is located farthest from the first electrode pattern and the second electrode pattern. A soldering structure for a surface mount transistor, characterized in that a narrow protrusion extending in a direction opposite to the first electrode pattern and the second electrode pattern is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9544283U JPS602873U (en) | 1983-06-20 | 1983-06-20 | Soldering structure of surface mount transistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9544283U JPS602873U (en) | 1983-06-20 | 1983-06-20 | Soldering structure of surface mount transistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS602873U true JPS602873U (en) | 1985-01-10 |
Family
ID=30227921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9544283U Pending JPS602873U (en) | 1983-06-20 | 1983-06-20 | Soldering structure of surface mount transistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS602873U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0317016A (en) * | 1989-05-19 | 1991-01-25 | F Hoffmann La Roche Ag | Treating agent for neurotic condition of disease |
| JP5017472B1 (en) * | 2011-03-16 | 2012-09-05 | 株式会社東芝 | Electronics |
| WO2019012849A1 (en) * | 2017-07-11 | 2019-01-17 | 日立オートモティブシステムズ株式会社 | Electronic circuit board |
-
1983
- 1983-06-20 JP JP9544283U patent/JPS602873U/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0317016A (en) * | 1989-05-19 | 1991-01-25 | F Hoffmann La Roche Ag | Treating agent for neurotic condition of disease |
| JP5017472B1 (en) * | 2011-03-16 | 2012-09-05 | 株式会社東芝 | Electronics |
| US8605446B2 (en) | 2011-03-16 | 2013-12-10 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| WO2019012849A1 (en) * | 2017-07-11 | 2019-01-17 | 日立オートモティブシステムズ株式会社 | Electronic circuit board |
| JPWO2019012849A1 (en) * | 2017-07-11 | 2020-04-02 | 日立オートモティブシステムズ株式会社 | Electronic circuit board |
| US11096285B2 (en) | 2017-07-11 | 2021-08-17 | Hitachi Automotive Systems, Ltd. | Electronic circuit substrate |
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