JPS60106370U - Mounting structure of external lead terminal - Google Patents
Mounting structure of external lead terminalInfo
- Publication number
- JPS60106370U JPS60106370U JP20029083U JP20029083U JPS60106370U JP S60106370 U JPS60106370 U JP S60106370U JP 20029083 U JP20029083 U JP 20029083U JP 20029083 U JP20029083 U JP 20029083U JP S60106370 U JPS60106370 U JP S60106370U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- external lead
- mounting structure
- head
- tapered surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体パッケージの断面図、第２図は従
来の外部リード端子の取付構造を示す断面図、第３図は
本考案の外部リード端子の取付構造を示す要部拡大断面
図、第４図は本考案の他の実施例を示す要部拡大断面図
、第５図は本考案の他の実施例を示す要部拡大断面図で
ある。
２．３０・・・外部リード端子、６，１６・・・メタラ
イズ＆７．１７・・・ロウ材、２０・・・テーパ一部。FIG. 1 is a sectional view of a conventional semiconductor package, FIG. 2 is a sectional view showing a conventional external lead terminal mounting structure, and FIG. 3 is an enlarged sectional view of main parts showing the external lead terminal mounting structure of the present invention. FIG. 4 is an enlarged sectional view of a main part showing another embodiment of the present invention, and FIG. 5 is an enlarged sectional view of a main part showing another embodiment of the invention. 2.30... External lead terminal, 6, 16... Metallized & 7.17... Brazing material, 20... Part of taper.
Claims (3)
ド端子をロウ材によりロウ材して成る外部リード端子の
取付構造において、前記外部リード端子の一端に裾広が
り状のテーパー面を有する頭部を形成するとともに、該
テーパー面の少なくとも一部をロウ材で被覆したことを
特徴とする外部リード端子の取付構造。(1) In an external lead terminal mounting structure in which an external lead terminal is brazed with a soldering material to a metallized portion formed on an insulating base, a head portion having a tapered surface that widens at one end of the external lead terminal. 1. A mounting structure for an external lead terminal, characterized in that the tapered surface is formed with a brazing material and at least a portion of the tapered surface is covered with a brazing material.
ことを特徴とする実用新案登録請求の範囲第１項記載の
外部リード端子の取付構造。(2) The mounting structure for an external lead terminal according to claim 1, wherein a recess is formed in the top surface of the head of the external lead terminal.
成したことを特徴とする実用新案登録請求の範囲第１項
記載の外部リード端子の取付構造。(3) The external lead terminal mounting structure according to claim 1, wherein a convex portion is formed on the top surface of the head of the external lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20029083U JPS60106370U (en) | 1983-12-26 | 1983-12-26 | Mounting structure of external lead terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20029083U JPS60106370U (en) | 1983-12-26 | 1983-12-26 | Mounting structure of external lead terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60106370U true JPS60106370U (en) | 1985-07-19 |
Family
ID=30760998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20029083U Pending JPS60106370U (en) | 1983-12-26 | 1983-12-26 | Mounting structure of external lead terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60106370U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61237947A (en) * | 1985-04-12 | 1986-10-23 | Matsushita Seiko Co Ltd | Ventilating fan |
| JPS63285961A (en) * | 1987-05-18 | 1988-11-22 | Ibiden Co Ltd | Semiconductor mounting substrate |
| JPS63285960A (en) * | 1987-05-18 | 1988-11-22 | Ibiden Co Ltd | Conductor pin for semiconductor mounting substrate and manufacture thereof |
| JP2001143805A (en) * | 1999-10-14 | 2001-05-25 | Berg Technol Inc | Electrical connector having continuous thin leaf terminals |
-
1983
- 1983-12-26 JP JP20029083U patent/JPS60106370U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61237947A (en) * | 1985-04-12 | 1986-10-23 | Matsushita Seiko Co Ltd | Ventilating fan |
| JPS63285961A (en) * | 1987-05-18 | 1988-11-22 | Ibiden Co Ltd | Semiconductor mounting substrate |
| JPS63285960A (en) * | 1987-05-18 | 1988-11-22 | Ibiden Co Ltd | Conductor pin for semiconductor mounting substrate and manufacture thereof |
| JP2001143805A (en) * | 1999-10-14 | 2001-05-25 | Berg Technol Inc | Electrical connector having continuous thin leaf terminals |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS60106370U (en) | Mounting structure of external lead terminal | |
| JPS60106375U (en) | Mounting structure of external lead terminal | |
| JPS60106350U (en) | Mounting structure of external lead terminal | |
| JPS60141129U (en) | Terminal structure of leadless chip carrier | |
| JPS602873U (en) | Soldering structure of surface mount transistor | |
| JPS6117751U (en) | Tape carrier semiconductor device | |
| JPS59135861U (en) | brazing structure | |
| JPS6410364U (en) | ||
| JPS6033456U (en) | semiconductor equipment | |
| JPS58188911U (en) | contact | |
| JPS60167347U (en) | semiconductor equipment | |
| JPS59171350U (en) | Semiconductor element mounting structure | |
| JPS6061740U (en) | Hybrid integrated circuit device | |
| JPS62112144U (en) | ||
| JPS59107157U (en) | GaAs semiconductor device | |
| JPS6020171U (en) | Terminal member mounting structure | |
| JPS5844842U (en) | semiconductor equipment | |
| JPS5987114U (en) | electronic components | |
| JPS60166150U (en) | Lead frame for integrated circuit devices | |
| JPS619843U (en) | Leadless chip carrier | |
| JPS58148963U (en) | package parts | |
| JPH0247058U (en) | ||
| JPS6037240U (en) | hybrid integrated circuit | |
| JPS60130584U (en) | IC socket | |
| JPS6054340U (en) | integrated circuit |