JPS6410364U - - Google Patents
Info
- Publication number
- JPS6410364U JPS6410364U JP10559987U JP10559987U JPS6410364U JP S6410364 U JPS6410364 U JP S6410364U JP 10559987 U JP10559987 U JP 10559987U JP 10559987 U JP10559987 U JP 10559987U JP S6410364 U JPS6410364 U JP S6410364U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- enlarged sectional
- showing
- recess
- insertion part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims 1
- 230000002265 prevention Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図はこの考案が適用された半田タレ防止用
キヤツプの第１実施例を示す拡大断面図、第２図
は第１図に示す半田タレ防止用キヤツプの使用例
を示す部分拡大断面図、第３図はこの考案の第２
実施例を示す第１図同様の拡大断面図、第４図は
この考案の第３実施例を示す第３図同様の拡大断
面図、第５図はこの考案の第４実施例を示す第３
図同様の拡大断面図、第６図はこの考案の第５実
施例を示す部分拡大断面図、第７図及び第８図は
各々従来の半田付けの状態を示す部分拡大断面図
である。
図面における主要な符号の説明、３，２３，３
６，４２：凹部、４，２４，３０：リード線挿入
孔（リード線挿入部）、１０，５１：リード線、
１１，５０：電子部品。
FIG. 1 is an enlarged sectional view showing a first embodiment of a cap for preventing solder sag to which this invention is applied, and FIG. 2 is a partially enlarged sectional view showing an example of the use of the cap for preventing solder sag shown in FIG. 1. Figure 3 is the second version of this idea.
FIG. 4 is an enlarged sectional view similar to FIG. 1 showing a third embodiment of the invention; FIG. 5 is an enlarged sectional view similar to FIG. 3 showing a third embodiment of the invention; FIG.
FIG. 6 is a partially enlarged sectional view showing a fifth embodiment of the invention, and FIGS. 7 and 8 are partially enlarged sectional views showing conventional soldering. Explanation of main symbols in the drawings, 3, 23, 3
6, 42: recess, 4, 24, 30: lead wire insertion hole (lead wire insertion part), 10, 51: lead wire,
11,50: Electronic parts.
Claims (1)
を有し、電子部品のリード線に装着される半田タ
レ防止用キヤツプ。 A solder sag prevention cap made of an insulating material, having a recess and a lead wire insertion part, and is attached to the lead wire of an electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10559987U JPH0543983Y2 (en) | 1987-07-09 | 1987-07-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10559987U JPH0543983Y2 (en) | 1987-07-09 | 1987-07-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6410364U true JPS6410364U (en) | 1989-01-19 |
| JPH0543983Y2 JPH0543983Y2 (en) | 1993-11-08 |
Family
ID=31338357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10559987U Expired - Lifetime JPH0543983Y2 (en) | 1987-07-09 | 1987-07-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543983Y2 (en) |
-
1987
- 1987-07-09 JP JP10559987U patent/JPH0543983Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0543983Y2 (en) | 1993-11-08 |
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