JPS5878693U - Circuit board with wire bonding - Google Patents
Circuit board with wire bondingInfo
- Publication number
- JPS5878693U JPS5878693U JP17418481U JP17418481U JPS5878693U JP S5878693 U JPS5878693 U JP S5878693U JP 17418481 U JP17418481 U JP 17418481U JP 17418481 U JP17418481 U JP 17418481U JP S5878693 U JPS5878693 U JP S5878693U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- circuit board
- wire bonding
- holes
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の回路板の斜視図、第２図は本考案に用い
るチップ部品及び基板の斜視図、第３図は本考案による
回路板の一実施例を示す断面図である。
７・・・・・・チップ部品、７ａ、 ７ｂ・・・・・
・電極部、７ｃ・・・・・・中間部、８・・・・・・基
板、９・・・・・・穴、１０・・・・・・線材。FIG. 1 is a perspective view of a conventional circuit board, FIG. 2 is a perspective view of a chip component and a board used in the present invention, and FIG. 3 is a sectional view showing an embodiment of the circuit board according to the present invention. 7... Chip parts, 7a, 7b...
- Electrode part, 7c... Middle part, 8... Substrate, 9... Hole, 10... Wire.
Claims (1)
ップ部品と、該チップ部品の外径に適合する穴を多数設
けた基板とを備え、前記穴にチップ部品を圧入または固
定し、該チップ部品の電極部に直接ワイヤポンディング
して所望の回路を構成したことを特徴とするワイヤポン
ディングによる回路板。 ２ 金属性電極間の中間部を絶縁体で形成したチップ部
品を用いたことを特徴とする実用新案登録請求の範囲第
１項記載のワイヤポンディングによる回路板。[Claims for Utility Model Registration] 1. A cylindrical or cylindrical chip component having metal electrodes at both ends, and a substrate provided with a number of holes that match the outer diameter of the chip component, with the chip component being inserted into the holes. 1. A circuit board formed by wire bonding, characterized in that a desired circuit is constructed by press-fitting or fixing a chip component and directly wire bonding it to an electrode portion of the chip component. 2. A wire-bonded circuit board according to claim 1, characterized in that a chip component is used in which the intermediate portion between the metal electrodes is formed of an insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17418481U JPS5878693U (en) | 1981-11-25 | 1981-11-25 | Circuit board with wire bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17418481U JPS5878693U (en) | 1981-11-25 | 1981-11-25 | Circuit board with wire bonding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5878693U true JPS5878693U (en) | 1983-05-27 |
Family
ID=29966147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17418481U Pending JPS5878693U (en) | 1981-11-25 | 1981-11-25 | Circuit board with wire bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5878693U (en) |
-
1981
- 1981-11-25 JP JP17418481U patent/JPS5878693U/en active Pending
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