JPH0356153U - - Google Patents
Info
- Publication number
- JPH0356153U JPH0356153U JP11598689U JP11598689U JPH0356153U JP H0356153 U JPH0356153 U JP H0356153U JP 11598689 U JP11598689 U JP 11598689U JP 11598689 U JP11598689 U JP 11598689U JP H0356153 U JPH0356153 U JP H0356153U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- insulating substrate
- outer lead
- lead portion
- independent electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図Ａは本考案のリードフレームに用いられ
る絶縁性基板または絶縁性フイルムの一実施例を
示す平面図、第１図Ｂはその絶縁性基板または絶
縁性フイルムが貼り付けられるリードフレームの
一例を示す平面図、第２図は従来のリードフレー
ムを示し、Ａはその平面図、ＢはＡにおけるＢ
−Ｂ線に沿つた断面図、第３図は多ピン化を可
能にするため一例として考えられる絶縁性基板ま
たは絶縁性フイルムが貼り付けられたリードフレ
ームを示し、Ａはその平面図、ＢはＡにおける
Ｂ−Ｂ線に沿つた断面図、第４図はそのリード
フレームに取り付けられた半導体素子、インナー
リード及び中間パツドの連結状態を示す図、第５
図はリードフレームと絶縁性基板または絶縁性フ
イルムとの組合せを説明する図であり、Ａはその
平面図、ＢはＡにおけるＢ−Ｂ線に沿つた断
面図、第６図は絶縁性基板または絶縁性フイルム
が貼り付けられたリードフレームの製造過程の説
明図である。
１０１……リードフレーム、１０２……アウタ
ーリード部、１０３……インナーリード部、１０
４……ダイパツド部、１０６……絶縁性基板また
は絶縁性フイルム、１０７……中間パツド（独立
電極）。
FIG. 1A is a plan view showing an example of an insulating substrate or insulating film used in the lead frame of the present invention, and FIG. 1B is an example of a lead frame to which the insulating substrate or insulating film is attached. 2 shows a conventional lead frame, A is a plan view thereof, and B is a B in A.
-A is a cross-sectional view taken along line B, and FIG. 3 shows a lead frame to which an insulating substrate or an insulating film is pasted, which can be considered as an example to enable multi-pins, A is a plan view thereof, and B is a FIG. 4 is a cross-sectional view taken along the line B-B at A, FIG.
The figures are diagrams illustrating a combination of a lead frame and an insulating substrate or an insulating film, where A is a plan view thereof, B is a sectional view taken along the line B-B in A, and FIG. FIG. 3 is an explanatory diagram of the manufacturing process of a lead frame to which an insulating film is attached. 101... Lead frame, 102... Outer lead part, 103... Inner lead part, 10
4... Die pad portion, 106... Insulating substrate or insulating film, 107... Intermediate pad (independent electrode).
Claims (1)
極が形成されている絶縁性基板または絶縁性フイ
ルムが貼り付けられたダイパツド部と、前記アウ
ターリード部から延長形成されると共に他端が前
記独立電極とワイヤーにより接続されるインナー
リード部とを備えたリードフレームであつて、 前記絶縁性基板または絶縁性フイルムは、互い
にとなりあう辺と辺との間の角部が鈍角となるよ
うな形状に形成されていることを特徴とするリー
ドフレーム。[Claims for Utility Model Registration] An outer lead portion connected to a circuit, a die pad portion to which an insulating substrate or insulating film is pasted on which an independent electrode is formed, and an outer lead portion extending from the outer lead portion. and an inner lead part whose other end is connected to the independent electrode by a wire, wherein the insulating substrate or the insulating film has an obtuse angle between adjacent sides. A lead frame characterized by being formed in a shape such that.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11598689U JPH0356153U (en) | 1989-10-02 | 1989-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11598689U JPH0356153U (en) | 1989-10-02 | 1989-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0356153U true JPH0356153U (en) | 1991-05-30 |
Family
ID=31664295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11598689U Pending JPH0356153U (en) | 1989-10-02 | 1989-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0356153U (en) |
-
1989
- 1989-10-02 JP JP11598689U patent/JPH0356153U/ja active Pending