JPS6191870U - - Google Patents
Info
- Publication number
- JPS6191870U JPS6191870U JP17784784U JP17784784U JPS6191870U JP S6191870 U JPS6191870 U JP S6191870U JP 17784784 U JP17784784 U JP 17784784U JP 17784784 U JP17784784 U JP 17784784U JP S6191870 U JPS6191870 U JP S6191870U
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- airtight terminal
- lead
- glass
- outer ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第1図はこの考案の一実施例の気密端子の平面
図で、第2図は第1図の−線に沿う断面図で
ある。第3図は従来の気密端子の平面図で第4図
は第3図の−線に沿う断面図である。第5図
はこの考案の背景となる小型気密端子の平面図で
、第6図は第5図の−線に沿う断面図、第7
図は第5図の気密端子の問題点について説明する
ための気密端子の正面図である。
10……金属外環、11……ガラス、12……
リード線、13……半田メツキ層。
FIG. 1 is a plan view of an airtight terminal according to an embodiment of this invention, and FIG. 2 is a sectional view taken along the line - in FIG. FIG. 3 is a plan view of a conventional airtight terminal, and FIG. 4 is a sectional view taken along the line - in FIG. Fig. 5 is a plan view of a small hermetic terminal which is the background of this invention, Fig. 6 is a sectional view taken along the - line in Fig. 5, and Fig.
This figure is a front view of the airtight terminal for explaining the problems of the airtight terminal shown in FIG. 10...Metal outer ring, 11...Glass, 12...
Lead wire, 13...Solder plating layer.
Claims (1)
気密絶縁的に封着してなる気密端子において、 前記リード線の直径をA、リード線間の間隔寸
法をBとするとき、1.0≧B/Aの関係式を満
足するようにA,Bを設定し、リード線に半田メ
ツキ層を形成したことを特徴とする気密端子。[Claims for Utility Model Registration] An airtight terminal in which two lead wires are hermetically and insulatively sealed within a metal outer ring through glass, wherein the diameter of the lead wires is A, and the distance between the lead wires is An airtight terminal characterized in that A and B are set so as to satisfy the relational expression 1.0≧B/A, where B is 1.0≧B/A, and a solder plating layer is formed on the lead wire.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17784784U JPH0414861Y2 (en) | 1984-11-21 | 1984-11-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17784784U JPH0414861Y2 (en) | 1984-11-21 | 1984-11-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6191870U true JPS6191870U (en) | 1986-06-14 |
JPH0414861Y2 JPH0414861Y2 (en) | 1992-04-03 |
Family
ID=30735420
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17784784U Expired JPH0414861Y2 (en) | 1984-11-21 | 1984-11-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0414861Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008059823A (en) * | 2006-08-30 | 2008-03-13 | Kyocera Corp | Airtight terminal |
-
1984
- 1984-11-21 JP JP17784784U patent/JPH0414861Y2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008059823A (en) * | 2006-08-30 | 2008-03-13 | Kyocera Corp | Airtight terminal |
Also Published As
Publication number | Publication date |
---|---|
JPH0414861Y2 (en) | 1992-04-03 |
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