JPH03101554U - - Google Patents
Info
- Publication number
- JPH03101554U JPH03101554U JP922290U JP922290U JPH03101554U JP H03101554 U JPH03101554 U JP H03101554U JP 922290 U JP922290 U JP 922290U JP 922290 U JP922290 U JP 922290U JP H03101554 U JPH03101554 U JP H03101554U
- Authority
- JP
- Japan
- Prior art keywords
- glass
- sealing hole
- lead wire
- lead
- dielectric component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Sensors (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示す要部断面を含む
正面図、第２図は第１図の気密端子の平面図、第
３図は第１図の気密端子の要部の拡大断面図、第
４図は第１図の気密端子のガラス封着時の部分拡
大断面図である。
１……金属外環、２……リード封着穴、３……
リード線、４……ガラス、５……誘電体部品。
Fig. 1 is a front view including a cross section of the main part showing an embodiment of the present invention, Fig. 2 is a plan view of the airtight terminal shown in Fig. 1, and Fig. 3 is an enlarged sectional view of the main part of the airtight terminal shown in Fig. 1. , FIG. 4 is a partially enlarged sectional view of the airtight terminal of FIG. 1 when sealed with glass. 1...Metal outer ring, 2...Lead sealing hole, 3...
Lead wire, 4...Glass, 5...Dielectric component.
Claims (1)
に挿通したリード線を、リード線に外挿されてリ
ード封着穴にロウ付けされる高誘電率の誘電体部
品と、ガラスとをリード軸線方向に沿つて層状に
配して、上記誘電体部品とガラスとで気密封止し
たことを特徴とする気密端子。 A lead wire is inserted through a lead sealing hole formed by penetrating the metal outer ring, and a high dielectric constant dielectric component that is inserted into the lead wire and brazed into the lead sealing hole is connected to the glass. An airtight terminal characterized in that the terminal is arranged in layers along the axial direction and hermetically sealed with the dielectric component and glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP922290U JPH03101554U (en) | 1990-01-31 | 1990-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP922290U JPH03101554U (en) | 1990-01-31 | 1990-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03101554U true JPH03101554U (en) | 1991-10-23 |
Family
ID=31512826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP922290U Pending JPH03101554U (en) | 1990-01-31 | 1990-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03101554U (en) |
-
1990
- 1990-01-31 JP JP922290U patent/JPH03101554U/ja active Pending