JPS6418583U - - Google Patents
Info
- Publication number
- JPS6418583U JPS6418583U JP11252987U JP11252987U JPS6418583U JP S6418583 U JPS6418583 U JP S6418583U JP 11252987 U JP11252987 U JP 11252987U JP 11252987 U JP11252987 U JP 11252987U JP S6418583 U JPS6418583 U JP S6418583U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- airtight terminal
- nickel
- outer ring
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910000531 Co alloy Inorganic materials 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
第１図は本考案に係る気密端子の一実施例の要
部断面図、第２図は本考案の他の実施例の気密端
子の要部断面図である。第３図は従来例の気密端
子の断面図である。
１……金属外環、２……ソーダガラス、３……
リード線、４……Ｎｉメツキ、５……半田メツキ
。
FIG. 1 is a sectional view of a main part of an embodiment of an airtight terminal according to the present invention, and FIG. 2 is a sectional view of a main part of an airtight terminal of another embodiment of the invention. FIG. 3 is a sectional view of a conventional airtight terminal. 1...Metal outer ring, 2...Soda glass, 3...
Lead wire, 4...Ni plating, 5...Solder plating.
Claims (1)
封止されると共に、前記リード線に半田メツキが
施された気密端子において、 前記リード線が、鉄・ニツケル・コバルト合金
で形成され、かつガラス封止部分に予めニツケル
メツキが施された構造であることを特徴とする気
密端子。[Claims for Utility Model Registration] An airtight terminal in which a lead wire is compressed and sealed in a metal outer ring via an insulating glass, and the lead wire is solder-plated, wherein the lead wire is made of iron, nickel, or An airtight terminal characterized by being made of cobalt alloy and having a structure in which nickel plating is applied in advance to the glass sealing part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11252987U JPS6418583U (en) | 1987-07-21 | 1987-07-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11252987U JPS6418583U (en) | 1987-07-21 | 1987-07-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6418583U true JPS6418583U (en) | 1989-01-30 |
Family
ID=31351549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11252987U Pending JPS6418583U (en) | 1987-07-21 | 1987-07-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6418583U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001028726A1 (en) * | 1998-04-20 | 2001-04-26 | Senju Metal Industry Co., Ltd. | Solder coating material and production method therefor |
| JP2010114132A (en) * | 2008-11-04 | 2010-05-20 | Nec Schott Components Corp | Plating method for airtight terminal |
-
1987
- 1987-07-21 JP JP11252987U patent/JPS6418583U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001028726A1 (en) * | 1998-04-20 | 2001-04-26 | Senju Metal Industry Co., Ltd. | Solder coating material and production method therefor |
| JP2010114132A (en) * | 2008-11-04 | 2010-05-20 | Nec Schott Components Corp | Plating method for airtight terminal |
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