JPS6059372U - brazing structure - Google Patents
brazing structureInfo
- Publication number
- JPS6059372U JPS6059372U JP15097683U JP15097683U JPS6059372U JP S6059372 U JPS6059372 U JP S6059372U JP 15097683 U JP15097683 U JP 15097683U JP 15097683 U JP15097683 U JP 15097683U JP S6059372 U JPS6059372 U JP S6059372U
- Authority
- JP
- Japan
- Prior art keywords
- outer ring
- metal outer
- brazing structure
- lead wire
- silver solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のロウ付は構体の断面図である。
第２図はこの考案の前提となるロウ付は構体の断面図で
ある。第３図はこの考案の一実施例のロウ〒−：：：Ｆ
、ニー＊□、４−ユ。９、 ・・１２・・・・・・無声
端子、１３・・・・・・金属外環、１４・・曲ガラス、
１５・・・・・・リード線。FIG. 1 is a sectional view of a conventional brazing structure. FIG. 2 is a sectional view of the brazing structure, which is the premise of this invention. Figure 3 shows a row of an embodiment of this invention.
, Knee*□, 4-U. 9,...12...Silent terminal, 13...Metal outer ring, 14...Curved glass,
15...Lead wire.
Claims (1)
線を気密かつ絶縁して封着した気密端子を、高膨張係数
を有する板状部材の透孔に銀ロウを介して固着してなる
ロウ付は構体において、前記金属外環の板状部材からの
突出寸法を、銀ロウの濡れ寸法よりも大きくしたことを
特徴とする口゛つ付は構体。 ２ 前記金属外環およびリード線が鉄・ニッケル・コバ
ルト合金よりなる、実用新案登録請求の範囲第１項記載
のロウ付は構体。[Scope of Claim for Utility Model Registration] 1. An airtight terminal in which a lead wire is hermetically and insulated sealed inside a metal outer ring via borosilicate glass is inserted into a through hole of a plate member having a high coefficient of expansion with silver solder. 1. A brazing structure in which a protruding dimension of the metal outer ring from the plate-like member is made larger than a wetting dimension of the silver solder. 2. The brazing structure according to claim 1, wherein the metal outer ring and the lead wire are made of an iron-nickel-cobalt alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15097683U JPS6059372U (en) | 1983-09-28 | 1983-09-28 | brazing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15097683U JPS6059372U (en) | 1983-09-28 | 1983-09-28 | brazing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6059372U true JPS6059372U (en) | 1985-04-25 |
Family
ID=30334693
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15097683U Pending JPS6059372U (en) | 1983-09-28 | 1983-09-28 | brazing structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6059372U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013021774A1 (en) * | 2011-08-08 | 2013-02-14 | タイコエレクトロニクスジャパン合同会社 | Connector |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5611477B2 (en) * | 1977-09-06 | 1981-03-14 |
-
1983
- 1983-09-28 JP JP15097683U patent/JPS6059372U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5611477B2 (en) * | 1977-09-06 | 1981-03-14 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013021774A1 (en) * | 2011-08-08 | 2013-02-14 | タイコエレクトロニクスジャパン合同会社 | Connector |
| JP2013037890A (en) * | 2011-08-08 | 2013-02-21 | Tyco Electronics Japan Kk | Connector |
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