JPS61103920U - - Google Patents
Info
- Publication number
- JPS61103920U JPS61103920U JP18790684U JP18790684U JPS61103920U JP S61103920 U JPS61103920 U JP S61103920U JP 18790684 U JP18790684 U JP 18790684U JP 18790684 U JP18790684 U JP 18790684U JP S61103920 U JPS61103920 U JP S61103920U
- Authority
- JP
- Japan
- Prior art keywords
- metal substrate
- glass
- holes
- hole
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000005219 brazing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図はこの考案の一実施例のステムを示し、
第１図Ａはセラミツク基板の一部を切り欠いた平
面図、第１図Ｂは第１図ＡのＩＢ―ＩＢ線に対応
する断面図である。第２図は従来のステムのセラ
ミツク基板の一部を切り欠いた平面図で、第３図
は第２図の―線に沿う断面図である。
１……金属基板、３……リード線封着用の透孔
、４……リード線ロウ付け用の透孔、５……ガラ
ス、６，７……リード線、８……銀ロウ、９……
セラミツク基板、１０……透孔、１１……透孔、
１２……突出状ガラス。
FIG. 1 shows a stem of an embodiment of this invention,
FIG. 1A is a partially cutaway plan view of the ceramic substrate, and FIG. 1B is a sectional view taken along line IB--IB in FIG. 1A. FIG. 2 is a partially cutaway plan view of a ceramic substrate of a conventional stem, and FIG. 3 is a sectional view taken along the line -- in FIG. 1...Metal substrate, 3...Through hole for lead wire sealing, 4...Through hole for lead wire brazing, 5...Glass, 6, 7...Lead wire, 8...Silver solder, 9... …
Ceramic substrate, 10... through hole, 11... through hole,
12... protruding glass.
Claims (1)
介してリード線を気密かつ絶縁して封着し、前記
リード線のケース内方側にセラミツク基板を固着
してなるシステムにおいて、 金属基板に他の透孔を形成し、この透孔にガラ
スをその上端が金属基板の上面より突出するよう
に気密に封着したことを特徴とするステム。[Claims for Utility Model Registration] Lead wires are hermetically and insulated sealed to the through holes of a metal substrate having a plurality of through holes through glass, and a ceramic substrate is fixed to the inside of the case of the lead wires. 1. A system comprising: a metal substrate having another through hole formed therein, and a glass hermetically sealed in the through hole so that its upper end protrudes from the upper surface of the metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18790684U JPS61103920U (en) | 1984-12-10 | 1984-12-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18790684U JPS61103920U (en) | 1984-12-10 | 1984-12-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61103920U true JPS61103920U (en) | 1986-07-02 |
Family
ID=30745378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18790684U Pending JPS61103920U (en) | 1984-12-10 | 1984-12-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61103920U (en) |
-
1984
- 1984-12-10 JP JP18790684U patent/JPS61103920U/ja active Pending
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