JPH0272553U - - Google Patents
Info
- Publication number
- JPH0272553U JPH0272553U JP15206688U JP15206688U JPH0272553U JP H0272553 U JPH0272553 U JP H0272553U JP 15206688 U JP15206688 U JP 15206688U JP 15206688 U JP15206688 U JP 15206688U JP H0272553 U JPH0272553 U JP H0272553U
- Authority
- JP
- Japan
- Prior art keywords
- pedestal
- stem
- semiconductor element
- sealed
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 239000005394 sealing glass Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂはそれぞれ本考案の一実施例によ
るステムに半導体素子が載置されたボンデイング
された状態を示す平面図及び断面図、第２図は本
考案による他の実施例を示す断面図、第３図ａ，
ｂはそれぞれ従来例を示す平面図及び断面図であ
る。
１……ステム台座、２ａ，２ｂ……絶縁リード
線、３……リード線、４……封着ガラス、５……
絶縁リード線端部、６……半導体素子、７ａ，７
ｂ，７ｃ……金属細線、８……ステム。
1A and 1B are a plan view and a sectional view showing a bonded state in which a semiconductor element is mounted on a stem according to one embodiment of the present invention, and FIG. 2 is a sectional view showing another embodiment of the present invention. Figure 3a,
b is a plan view and a sectional view showing a conventional example, respectively. 1... Stem pedestal, 2a, 2b... Insulated lead wire, 3... Lead wire, 4... Sealing glass, 5...
Insulated lead wire end, 6... semiconductor element, 7a, 7
b, 7c...Thin metal wire, 8...Stem.
Claims (1)
に設けられた穴を貫通し、前記台座と絶縁性ガラ
スにより封着固定された金属リードを有する半導
体装置用ステムにおいて、前記台座と前記絶縁性
ガラスにより封着されている前記金属リードが前
記半導体素子を載置する前記台座面より突出した
端部が断面Ｔ字形のヘツデイング部を有した形状
で、前記リード端面と台座面との距離が０．１〜
０．３mmであることを特徴とするステム。 A stem for a semiconductor device having a metal lead that passes through a hole vertically provided in an outer circumference of a pedestal on which a semiconductor element is mounted and is sealed and fixed to the pedestal with insulating glass, wherein the pedestal and the insulating The metal lead sealed with glass has a shape in which an end portion protruding from the pedestal surface on which the semiconductor element is placed has a heading portion having a T-shaped cross section, and the distance between the lead end surface and the pedestal surface is 0. .1～
A stem characterized by a diameter of 0.3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15206688U JPH0272553U (en) | 1988-11-21 | 1988-11-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15206688U JPH0272553U (en) | 1988-11-21 | 1988-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0272553U true JPH0272553U (en) | 1990-06-01 |
Family
ID=31426664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15206688U Pending JPH0272553U (en) | 1988-11-21 | 1988-11-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0272553U (en) |
-
1988
- 1988-11-21 JP JP15206688U patent/JPH0272553U/ja active Pending