JPS60166150U - Lead frame for integrated circuit devices - Google Patents
Lead frame for integrated circuit devicesInfo
- Publication number
- JPS60166150U JPS60166150U JP5200584U JP5200584U JPS60166150U JP S60166150 U JPS60166150 U JP S60166150U JP 5200584 U JP5200584 U JP 5200584U JP 5200584 U JP5200584 U JP 5200584U JP S60166150 U JPS60166150 U JP S60166150U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- integrated circuit
- brazing
- circuit devices
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来形状のリードフレームがろう付けされたフ
ラットパッケージの平面図、第２図Ａは第１図に示すリ
ードフレームのろう付は部の拡大平面図、第２図Ｂはそ
の断面図、第３図は本考案のリードフレームがセラミッ
ク基板へろう付けされたろう付は部の拡大平面図、第４
図Ａｔ Ｂｙ Ｃは本考案のリードフレームのろう付は
部の異なる他の具体例奔示す平面図である。
１．１２・・・リードフレーム、２．１０・・・配線基
板、３・・・リード、３’、１２ａ・・・リードろう付
は部、４．１１・・・メタライズ部、５・・・銀ろう、
１２ｂ・・・ろう付は部以外のフレーム部。Fig. 1 is a plan view of a flat package to which a conventionally shaped lead frame is brazed, Fig. 2 A is an enlarged plan view of the brazed portion of the lead frame shown in Fig. 1, and Fig. 2 B is a cross-sectional view thereof. , Figure 3 is an enlarged plan view of the brazing part where the lead frame of the present invention is brazed to the ceramic substrate, Figure 4
Figures At By C are plan views showing other embodiments of the present invention in which the brazing part of the lead frame is different. 1.12... Lead frame, 2.10... Wiring board, 3... Lead, 3', 12a... Lead brazing part, 4.11... Metallized part, 5... silver wax,
12b... Brazing is done on frame parts other than the parts.
Claims (1)
は部以外のフレーム部より構成される集積回路装置用リ
ードフレームに於いて、該リードフレームのろう付は部
をフレーム部より細い形状としたことを特徴とする集積
回路装置用リードフレーム。 ２ リードフレームのろう付は部を先端部はど細い形状
とした実用新案登録請求の範囲第１項記載の集積回路装
置用リードフレーム。 ３ リードフレームのろう付は部を両側テーパー形状と
した実用新案登録請求の範囲第２項記載の集積回路装置
用リードフレーム。[Scope of Claim for Utility Model Registration] 1. In a lead frame for an integrated circuit device consisting of a brazing section and a frame section other than the brazing section for brazing to a wiring board, the brazing of the lead frame A lead frame for an integrated circuit device, characterized in that a part is thinner than a frame part. 2. A lead frame for an integrated circuit device according to claim 1, wherein the brazing portion of the lead frame has a narrow tip end. 3. A lead frame for an integrated circuit device according to claim 2, wherein the brazing portion of the lead frame is tapered on both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5200584U JPS60166150U (en) | 1984-04-11 | 1984-04-11 | Lead frame for integrated circuit devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5200584U JPS60166150U (en) | 1984-04-11 | 1984-04-11 | Lead frame for integrated circuit devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60166150U true JPS60166150U (en) | 1985-11-05 |
| JPH0442934Y2 JPH0442934Y2 (en) | 1992-10-12 |
Family
ID=30571563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5200584U Granted JPS60166150U (en) | 1984-04-11 | 1984-04-11 | Lead frame for integrated circuit devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60166150U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5391578A (en) * | 1977-09-28 | 1978-08-11 | Nec Corp | Container for electronic part |
| JPS53118464U (en) * | 1977-02-25 | 1978-09-20 |
-
1984
- 1984-04-11 JP JP5200584U patent/JPS60166150U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53118464U (en) * | 1977-02-25 | 1978-09-20 | ||
| JPS5391578A (en) * | 1977-09-28 | 1978-08-11 | Nec Corp | Container for electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442934Y2 (en) | 1992-10-12 |
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