JPS5899847U

JPS5899847U - tape carrier

Info

Publication number: JPS5899847U
Application number: JP19819081U
Authority: JP
Inventors: 正俊太田
Original assignee: 株式会社リコー
Priority date: 1981-12-25
Filing date: 1981-12-25
Publication date: 1983-07-07

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of drawings]

第１図は一般的なテープキャリヤの平面図、第２Ａは従
来のテープキャリヤのアウターリードの導体パターンへ
の接着状態を示す側面図、第２図Ｂは第２図Ａの平面図
、第３図Ａ１第４図Ａ１第５図Ａ、第６図、第７図、第
８図はまれぞれ本考案に係るテープキャリヤの実施例を
示すアウターリードの平面図、第３図Ｂ、　Ｃは第３図
Ａの半田の溶融状態を示す平面図および端面図、第４図
Ｂ。Ｃは第４図Ａの半田の溶融状態を示す平面図および端面
図、第５図Ｂは第５図Ａの半田溶融状態を示す平面図で
ある。１・・・フィルム、２・・・開口、３・・・導ＩＥ路、
４・・・インナーリード、５・・・アラターリ４−ド、
７・・・導電路、８・・・導体パターン、１０・・・接
着剤誘導路。Fig. 1 is a plan view of a general tape carrier, Fig. 2A is a side view showing how the outer leads of a conventional tape carrier are bonded to the conductor pattern, Fig. 2B is a plan view of Fig. 2A, and Fig. 3 Figure A1 Figure 4 A1 Figure 5 A, Figure 6, Figure 7, and Figure 8 are plan views of outer leads showing embodiments of the tape carrier according to the present invention, and Figures 3 B and C are respectively A plan view and an end view showing the melted state of the solder in FIG. 3A, and FIG. 4B. 5C is a plan view and an end view showing the molten state of the solder in FIG. 4A, and FIG. 5B is a plan view showing the molten state of the solder in FIG. 5A. 1... Film, 2... Opening, 3... Guide IE path,
4...Inner lead, 5...Arata lead 4-de,
7... Conductive path, 8... Conductor pattern, 10... Adhesive guiding path.

Claims

[Scope of utility model registration request]

An opening for mounting an IC chip is formed in the film, and a conductive path with an inner lead and an outer lead is formed on the film surface, the inner lead is connected to the IC chip, and the outer lead is connected to the substrate. In a tape carrier adapted to be connected to a conductor pattern of a conductive path, the length of the edge of the overlapping end of the overlapping range is substantially increased at the overlapping end of the outer lead to the conductor pattern. A tape carrier characterized in that an adhesive guide portion is formed.