JPS58153473U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS58153473U
JPS58153473U JP5001282U JP5001282U JPS58153473U JP S58153473 U JPS58153473 U JP S58153473U JP 5001282 U JP5001282 U JP 5001282U JP 5001282 U JP5001282 U JP 5001282U JP S58153473 U JPS58153473 U JP S58153473U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
copper foil
soldering
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5001282U
Other languages
Japanese (ja)
Inventor
裕隆 遠藤
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP5001282U priority Critical patent/JPS58153473U/en
Publication of JPS58153473U publication Critical patent/JPS58153473U/en
Pending legal-status Critical Current

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Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aは面実装用部品を示す図、同図すは従来のプリ
ント配線基板を示す要部上面図、第2図は本考案の一実
施例を示す要部上面図である。 1・・・・・・面実装用部品、2・・・・・・リード部
、3・・・・・・プリント配線基板、4・・・・・・銅
箔、5,5′・・・・・・銅箔部、6・・曲ソルダーレ
ジスト。
FIG. 1a is a diagram showing a surface mount component, the same figure is a top view of the main part showing a conventional printed wiring board, and FIG. 2 is a top view of the main part showing an embodiment of the present invention. 1...Surface mounting parts, 2...Lead portion, 3...Printed wiring board, 4...Copper foil, 5, 5'... ...Copper foil part, 6...Curved solder resist.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] (1)一定間隔をもって複数の接続用のリード部を有す
る面実装用部品を半田付けするプリント配線基板であっ
て、そのプリント配線基板の半田付は用銅箔部を略菱形
状に形成してなるプリン1−   ト配線基板。
(1) A printed wiring board to which surface mount components are soldered, which has a plurality of connection lead parts at regular intervals, and the soldering of the printed wiring board is performed by forming the copper foil part into a substantially diamond shape. A printed wiring board.
(2)複数の半田付は用銅箔部のうち外側の銅箔部を中
間部における銅箔部の巾よりも外側方向に大きくしたこ
とを特徴とする実用新案登録請求の範囲第1項記載のプ
リント配線基板。
(2) Utility model registration claim 1, characterized in that the outer copper foil portion of the plurality of soldering copper foil portions is made wider in the outward direction than the width of the copper foil portion in the middle portion. printed wiring board.
JP5001282U 1982-04-06 1982-04-06 printed wiring board Pending JPS58153473U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5001282U JPS58153473U (en) 1982-04-06 1982-04-06 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5001282U JPS58153473U (en) 1982-04-06 1982-04-06 printed wiring board

Publications (1)

Publication Number Publication Date
JPS58153473U true JPS58153473U (en) 1983-10-14

Family

ID=30060822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5001282U Pending JPS58153473U (en) 1982-04-06 1982-04-06 printed wiring board

Country Status (1)

Country Link
JP (1) JPS58153473U (en)

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