JPS60163753U - heat dissipation minibus - Google Patents
heat dissipation minibusInfo
- Publication number
- JPS60163753U JPS60163753U JP5157784U JP5157784U JPS60163753U JP S60163753 U JPS60163753 U JP S60163753U JP 5157784 U JP5157784 U JP 5157784U JP 5157784 U JP5157784 U JP 5157784U JP S60163753 U JPS60163753 U JP S60163753U
- Authority
- JP
- Japan
- Prior art keywords
- minibus
- heat dissipation
- integrated circuit
- insulator
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のミニバスを示す図で、イは分離した形で
示す斜視図口は断面図であり、第２図は本考案の一実施
例の図でイは分離した形で示す斜視図口は断面図、第３
図は他の実施例の放熱板の斜視図である。
図中１は集積回路、２は信号端子、２Ａはアース端子、
２Ｂは電源端子、３はプリント板、４Ａ、４Ｂはミニバ
ス用スルーホール、５は信号端子用スルーホール、５Ａ
はアース端子用スルーホール、５Ｂは電源端子用スルー
ホール、６はミニバス、７は絶縁紙、８は電源導体板、
９はアース導体板、１０は放熱型ミニバス、１１．１２
は放熱板をそれぞれ示す。Fig. 1 is a diagram showing a conventional minibus, A is a perspective view shown in separated form, and Fig. 2 is a diagram of one embodiment of the present invention, A is a perspective view shown in separated form. Mouth is cross-sectional view, 3rd
The figure is a perspective view of a heat sink of another embodiment. In the figure, 1 is an integrated circuit, 2 is a signal terminal, 2A is a ground terminal,
2B is a power terminal, 3 is a printed board, 4A, 4B are through holes for minibus, 5 is a through hole for signal terminals, 5A
is the through hole for the ground terminal, 5B is the through hole for the power terminal, 6 is the mini bus, 7 is the insulating paper, 8 is the power conductor plate,
9 is a ground conductor plate, 10 is a heat dissipation type minibus, 11.12
indicates a heat sink, respectively.
Claims (1)
装される集積回路において、該ミニバスの最上層の絶縁
体上に積層されて該絶縁体と該集積回路のパッケージの
底面の間に密着した、熱伝達率の良い材料よりなるほぼ
短冊板状の放熱板が′ 具備されてなることを特徴と
する放熱型ミニバス。In an integrated circuit in which the bottom surface of the package is mounted in close contact with a substrate via a minibus, the integrated circuit is laminated on the top layer of the insulator of the minibus and is in close contact between the insulator and the bottom surface of the package of the integrated circuit. A heat dissipation type minibus characterized by being equipped with a substantially rectangular heat dissipation plate made of a material with good heat transfer coefficient.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5157784U JPS60163753U (en) | 1984-04-09 | 1984-04-09 | heat dissipation minibus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5157784U JPS60163753U (en) | 1984-04-09 | 1984-04-09 | heat dissipation minibus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60163753U true JPS60163753U (en) | 1985-10-30 |
Family
ID=30570752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5157784U Pending JPS60163753U (en) | 1984-04-09 | 1984-04-09 | heat dissipation minibus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60163753U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014212195A (en) * | 2013-04-18 | 2014-11-13 | 三菱電機株式会社 | Wiring board unit |
| JP2021035197A (en) * | 2019-08-27 | 2021-03-01 | シンフォニアテクノロジー株式会社 | Current auxiliary member, print circuit board, and power conversion device |
-
1984
- 1984-04-09 JP JP5157784U patent/JPS60163753U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014212195A (en) * | 2013-04-18 | 2014-11-13 | 三菱電機株式会社 | Wiring board unit |
| JP2021035197A (en) * | 2019-08-27 | 2021-03-01 | シンフォニアテクノロジー株式会社 | Current auxiliary member, print circuit board, and power conversion device |
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