JPS593548U - Packages for semiconductor devices - Google Patents

Packages for semiconductor devices

Info

Publication number
JPS593548U
JPS593548U JP9830682U JP9830682U JPS593548U JP S593548 U JPS593548 U JP S593548U JP 9830682 U JP9830682 U JP 9830682U JP 9830682 U JP9830682 U JP 9830682U JP S593548 U JPS593548 U JP S593548U
Authority
JP
Japan
Prior art keywords
base
metal frame
metal
metallized film
packages
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9830682U
Other languages
Japanese (ja)
Other versions
JPS629732Y2 (en
Inventor
日高 紀雄
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP9830682U priority Critical patent/JPS593548U/en
Publication of JPS593548U publication Critical patent/JPS593548U/en
Application granted granted Critical
Publication of JPS629732Y2 publication Critical patent/JPS629732Y2/ja
Granted legal-status Critical Current

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  • Waveguides (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来例の要部切断斜面図、第2図は要部切断側
面図、第3図も要部切断側面図、第4図は本考案−実施
例の要部切断側面図、第5図は他の実施例の要部切断側
面図である。・ 図に於いて、1は銅製基台、2は銅製フレーム、3はサ
ファイア板、4は電気端子、4Aは電気端子4を構成す
るアルミナ基体、4Bは電気端子4を構成するアルミナ
駒体、5はメタライズ膜のラミネート部分、6.7はス
トリップ線路、8はサファイア板上に形成されたストリ
ップ線路、9はストリップ線路7とストリップ線路9と
を結ぶ金のリボン、10は蓋体、11はストリップ線路
6゜6を結ぶ金のリボツー、12.13は蓋体である。
Fig. 1 is a cutaway side view of the main part of the conventional example, Fig. 2 is a cutaway side view of the main part, Fig. 3 is a cutaway side view of the main part, and Fig. 4 is a cutaway side view of the main part of the present invention-embodiment. FIG. 5 is a cutaway side view of a main part of another embodiment. - In the figure, 1 is a copper base, 2 is a copper frame, 3 is a sapphire plate, 4 is an electrical terminal, 4A is an alumina base that makes up the electrical terminal 4, 4B is an alumina piece that makes up the electrical terminal 4, 5 is a laminated part of a metallized film, 6.7 is a strip line, 8 is a strip line formed on a sapphire plate, 9 is a gold ribbon connecting the strip line 7 and the strip line 9, 10 is a lid body, and 11 is a The gold ribs connecting the strip lines 6°6 and 12.13 are the lids.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属フレームを有する金属基台と、表面に擬似同軸線路
の内導体となるメタライズ膜のラミネート部分及び該ラ
ミネート部分の両端から延在するストリップ線路が形成
された誘電体基体とその基体に於ける前記メタライズ膜
の゛ラミネート部分近傍に設けられ前記基体と一体化さ
れた誘電体駒体とを有し前記金属フレーム及び金属基台
に形成された切欠き或いは穴等の貫通部に嵌挿固着され
た電気端子と、前記金属フレーム上表面に固着され゛ 
 中央以外の周縁部分が低く形成された凸形蓋体とを備
えてなる事を特徴とする半導体装置用パッケージ。
A metal base having a metal frame, a dielectric base on which a laminated portion of a metallized film that becomes an inner conductor of a pseudo-coaxial line, and strip lines extending from both ends of the laminated portion are formed; A dielectric piece is provided near the laminate part of the metallized film and is integrated with the base body, and is inserted and fixed into a through part such as a notch or hole formed in the metal frame and the metal base. An electrical terminal is fixed to the upper surface of the metal frame.
1. A package for a semiconductor device, comprising a convex lid whose peripheral edge portion other than the center is formed low.
JP9830682U 1982-06-30 1982-06-30 Packages for semiconductor devices Granted JPS593548U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9830682U JPS593548U (en) 1982-06-30 1982-06-30 Packages for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9830682U JPS593548U (en) 1982-06-30 1982-06-30 Packages for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS593548U true JPS593548U (en) 1984-01-11
JPS629732Y2 JPS629732Y2 (en) 1987-03-06

Family

ID=30233468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9830682U Granted JPS593548U (en) 1982-06-30 1982-06-30 Packages for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS593548U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61203523U (en) * 1985-06-12 1986-12-22

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61203523U (en) * 1985-06-12 1986-12-22

Also Published As

Publication number Publication date
JPS629732Y2 (en) 1987-03-06

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