JPS593548U - Packages for semiconductor devices - Google Patents
Packages for semiconductor devicesInfo
- Publication number
- JPS593548U JPS593548U JP9830682U JP9830682U JPS593548U JP S593548 U JPS593548 U JP S593548U JP 9830682 U JP9830682 U JP 9830682U JP 9830682 U JP9830682 U JP 9830682U JP S593548 U JPS593548 U JP S593548U
- Authority
- JP
- Japan
- Prior art keywords
- base
- metal frame
- metal
- metallized film
- packages
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Waveguides (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来例の要部切断斜面図、第2図は要部切断側
面図、第3図も要部切断側面図、第4図は本考案−実施
例の要部切断側面図、第5図は他の実施例の要部切断側
面図である。・
図に於いて、1は銅製基台、2は銅製フレーム、3はサ
ファイア板、4は電気端子、4Aは電気端子4を構成す
るアルミナ基体、4Bは電気端子4を構成するアルミナ
駒体、5はメタライズ膜のラミネート部分、6.7はス
トリップ線路、8はサファイア板上に形成されたストリ
ップ線路、9はストリップ線路7とストリップ線路9と
を結ぶ金のリボン、10は蓋体、11はストリップ線路
6゜6を結ぶ金のリボツー、12.13は蓋体である。Fig. 1 is a cutaway side view of the main part of the conventional example, Fig. 2 is a cutaway side view of the main part, Fig. 3 is a cutaway side view of the main part, and Fig. 4 is a cutaway side view of the main part of the present invention-embodiment. FIG. 5 is a cutaway side view of a main part of another embodiment. - In the figure, 1 is a copper base, 2 is a copper frame, 3 is a sapphire plate, 4 is an electrical terminal, 4A is an alumina base that makes up the electrical terminal 4, 4B is an alumina piece that makes up the electrical terminal 4, 5 is a laminated part of a metallized film, 6.7 is a strip line, 8 is a strip line formed on a sapphire plate, 9 is a gold ribbon connecting the strip line 7 and the strip line 9, 10 is a lid body, and 11 is a The gold ribs connecting the strip lines 6°6 and 12.13 are the lids.
Claims (1)
の内導体となるメタライズ膜のラミネート部分及び該ラ
ミネート部分の両端から延在するストリップ線路が形成
された誘電体基体とその基体に於ける前記メタライズ膜
の゛ラミネート部分近傍に設けられ前記基体と一体化さ
れた誘電体駒体とを有し前記金属フレーム及び金属基台
に形成された切欠き或いは穴等の貫通部に嵌挿固着され
た電気端子と、前記金属フレーム上表面に固着され゛
中央以外の周縁部分が低く形成された凸形蓋体とを備
えてなる事を特徴とする半導体装置用パッケージ。A metal base having a metal frame, a dielectric base on which a laminated portion of a metallized film that becomes an inner conductor of a pseudo-coaxial line, and strip lines extending from both ends of the laminated portion are formed; A dielectric piece is provided near the laminate part of the metallized film and is integrated with the base body, and is inserted and fixed into a through part such as a notch or hole formed in the metal frame and the metal base. An electrical terminal is fixed to the upper surface of the metal frame.
1. A package for a semiconductor device, comprising a convex lid whose peripheral edge portion other than the center is formed low.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9830682U JPS593548U (en) | 1982-06-30 | 1982-06-30 | Packages for semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9830682U JPS593548U (en) | 1982-06-30 | 1982-06-30 | Packages for semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS593548U true JPS593548U (en) | 1984-01-11 |
JPS629732Y2 JPS629732Y2 (en) | 1987-03-06 |
Family
ID=30233468
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9830682U Granted JPS593548U (en) | 1982-06-30 | 1982-06-30 | Packages for semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS593548U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61203523U (en) * | 1985-06-12 | 1986-12-22 |
-
1982
- 1982-06-30 JP JP9830682U patent/JPS593548U/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61203523U (en) * | 1985-06-12 | 1986-12-22 |
Also Published As
Publication number | Publication date |
---|---|
JPS629732Y2 (en) | 1987-03-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS593548U (en) | Packages for semiconductor devices | |
JPS5858342U (en) | hybrid integrated circuit | |
JPS60163753U (en) | heat dissipation minibus | |
JPS6037241U (en) | Electronics | |
JPS6054340U (en) | integrated circuit | |
JPS58138352U (en) | Lead terminal for semiconductor package | |
JPS5872847U (en) | electronic equipment | |
JPS5920632U (en) | semiconductor equipment | |
JPS58109254U (en) | Chip carrier for face-down connected chips | |
JPS6078139U (en) | Hybrid integrated circuit device | |
JPS6027454U (en) | semiconductor equipment | |
JPS5970347U (en) | integrated circuit device | |
JPS5899841U (en) | semiconductor equipment | |
JPS6045446U (en) | semiconductor equipment | |
JPS5944066U (en) | metal package | |
JPS58111959U (en) | semiconductor equipment | |
JPS60112089U (en) | Socket for semiconductor device | |
JPS594642U (en) | Hybrid integrated circuit board encapsulation | |
JPS59180438U (en) | Semiconductor integrated circuit device | |
JPS59101425U (en) | electronic components | |
JPS5998692U (en) | Hybrid integrated circuit device | |
JPS58182438U (en) | semiconductor equipment | |
JPS593544U (en) | Packages for semiconductor devices | |
JPS59176154U (en) | Hybrid integrated circuit device | |
JPS5811252U (en) | Packages for semiconductor devices |