JPS61203523U - - Google Patents
Info
- Publication number
- JPS61203523U JPS61203523U JP8853385U JP8853385U JPS61203523U JP S61203523 U JPS61203523 U JP S61203523U JP 8853385 U JP8853385 U JP 8853385U JP 8853385 U JP8853385 U JP 8853385U JP S61203523 U JPS61203523 U JP S61203523U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- casing
- housing
- metal plate
- cooling pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims 1
- 230000035515 penetration Effects 0.000 description 1
Landscapes
- Transformer Cooling (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図〜第５図は本考案による電気機器の冷却
装置の実施例に係り、第１図はその要部を示す斜
視図、第２図は変圧器の断面図、第３図は筐体に
対する冷却管の貫通部近傍を示す断面図、第４図
は筐体への金属板の取付状態を示す断面図、第５
図は冷却管の破断図である。
１……変圧器本体、２……筐体、３……冷却装
置、４……金属板、５……冷却管、１２……絶縁
油。
Figures 1 to 5 relate to an embodiment of the cooling device for electrical equipment according to the present invention, in which Figure 1 is a perspective view showing the main parts, Figure 2 is a sectional view of the transformer, and Figure 3 is a housing. FIG. 4 is a cross-sectional view showing the vicinity of the cooling pipe penetration part, FIG. 4 is a cross-sectional view showing how the metal plate is attached to the housing, and FIG.
The figure is a cutaway view of the cooling pipe. 1... Transformer body, 2... Housing, 3... Cooling device, 4... Metal plate, 5... Cooling pipe, 12... Insulating oil.
Claims (1)
れるとともに該筐体内に絶縁媒体が充填された電
気機器の冷却装置において、冷却媒体を流すため
の冷却管を前記筐体の内部へ導入するとともに前
記筐体内の冷却管を金属板に固着し、該金属板を
前記筐体の内側に取り付けたことを特徴とする電
気機器の冷却装置。 In a cooling device for an electrical device in which an electrical device main body is housed inside a sealed casing and the casing is filled with an insulating medium, a cooling pipe for flowing a cooling medium is introduced into the inside of the casing. A cooling device for electrical equipment, characterized in that the cooling pipe in the housing is fixed to a metal plate, and the metal plate is attached to the inside of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8853385U JPS61203523U (en) | 1985-06-12 | 1985-06-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8853385U JPS61203523U (en) | 1985-06-12 | 1985-06-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61203523U true JPS61203523U (en) | 1986-12-22 |
Family
ID=30641764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8853385U Pending JPS61203523U (en) | 1985-06-12 | 1985-06-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61203523U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593548U (en) * | 1982-06-30 | 1984-01-11 | 富士通株式会社 | Packages for semiconductor devices |
-
1985
- 1985-06-12 JP JP8853385U patent/JPS61203523U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS593548U (en) * | 1982-06-30 | 1984-01-11 | 富士通株式会社 | Packages for semiconductor devices |
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