GB2171359A - Printing component casing for integrating semiconductor circuit and inserting in storage magazine - Google Patents

Printing component casing for integrating semiconductor circuit and inserting in storage magazine Download PDF

Info

Publication number
GB2171359A
GB2171359A GB8604332A GB8604332A GB2171359A GB 2171359 A GB2171359 A GB 2171359A GB 8604332 A GB8604332 A GB 8604332A GB 8604332 A GB8604332 A GB 8604332A GB 2171359 A GB2171359 A GB 2171359A
Authority
GB
United Kingdom
Prior art keywords
edge zone
casing
delimitation means
printing
storage magazine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB8604332A
Other versions
GB8604332D0 (en
Inventor
Fritz Kielwein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Electronic GmbH
Original Assignee
Telefunken Electronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Electronic GmbH filed Critical Telefunken Electronic GmbH
Publication of GB8604332D0 publication Critical patent/GB8604332D0/en
Publication of GB2171359A publication Critical patent/GB2171359A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54473—Marks applied to semiconductor devices or parts for use after dicing
    • H01L2223/54486—Located on package parts, e.g. encapsulation, leads, package substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Packaging Frangible Articles (AREA)
  • Drying Of Solid Materials (AREA)
  • Printing Methods (AREA)
  • Die Bonding (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The casing and inserting in storage magazine comprising a body 3 is provided with a surface 2a which is arranged to be printed, the surface having projections 1a at its edges to prevent the still wet printing ink from being rubbed off by the internal wall of a magazine (5, Figure 3) in which the component is immediately accommodated. The projections can be elongate, as shown, or can comprise four corner projections (1b, Figure 2). Alternatively the surface 2a may be concave between its edge regions. <IMAGE>

Description

SPECIFICATION Component casing The present invention relates to a casing and more particularly to a component casing for integrated semiconductor circuits consisting of a base body and terminal contacts.
Component casings for integrated semiconductor circuits are manufactured in a very wide range of designs. The most common of these are standardized and known under designations such as, for example, DIP 14 pole, DIP 14 pole, DIC 18 pole, DIP, SOT or SIP, etc.
The integrated semiconductor circuits are usually indentified by an inscription being printed on one surface side.
In the hitherto employed printing processes, the printed, finished component casing is subjected to a drying procedure before it is accommodated in magazines. This measure prevents the printed inscription from becoming damaged so long as the printing ink can still be rubbed off.
The known printing processes (an offset printing process is used in most cases) have the disadvantage that the production speed is impaired by this and too high a drying temperature may, under certain circumstances, result in a change in the electric parameters of the integrated circuits (contact lifting devices, etc.).
The present invention seeks to render the process of inscribing integrated semiconductor circuits more effective.
According to a first aspect of the present invention there is provided a casing for integrated semiconductor circuitry comprising a body and terminal contacts wherein a surface of the body has edge zone delimitation means and a part of the surface arranged for inscription is of sunken configuration in relation to the edge zone delimitation means.
In a preferred arrangement the edge zone delimitation means are arranged on said surface symmet ricallyto the longitudinal axis of the body and preferably symmetrically of the mid-point thereof.
The edge zone delimitation means may be of prismatic, strip-shaped, block-shaped or beadshaped contruction.
The part of the surface arranged for inscription may be of concave construction.
According to a second aspect of the present invention there is provided a method of manufacturing and storing a printed body comprising providing a surface of an unprinted body with edge zone delimitation means so that the remaining part of the surface is of relatively sunken configuration, printing an inscription on said remaining part, and before the printing medium is dry inserting the printed body into a storage magazine.
An advantage of the invention is that hitherto disturbing characteristics of the printing inks, namely long storage or pot life and drying times, no longer impede or delay the manufacturing process.
Preferred embodiments of the present invention will now be described, by way of example only, with reference to the accompanying drawings of which: Figure 1 shows a casing of an integrated semiconductor circuit in a DIP 16 casing with strip-shaped edge zone delimitations in accordance with a first embodiment of the present invention; Figure 2 shows a casing of an integrated semicon ductorcircuit in a DIP 16 casing with blocked-shaped edge zone delimitations in accordance with a second embodiment of the present invention; Figure 3 shows a casing of an integrated semiconductor circuit in accordance with the present invention accommodated in a magazine; and Figure 4 shows a casing with a concave surface in accordance with a further embodiment of the present invention.
Referring to the drawings, Figure 1 shows a component casing for integrated semiconductor circuits. The component casing consists of a blockshaped base body 3 which in its external dimensions may correspond to the standardized casings mentioned above and is made of a plastics or ceramic material. Terminal contacts 4 extend from it.
At the outside edges of the surface side 2a, symmetrically to the longitudinal axis, and parallel to each other, there are arranged strip-shaped edge zone delimitations 1a which are raised in relation to the surface side 2a. The difference in height in relation to the surface side is in the order of magnitude of a few tenths of a millimeter. The strip width of the edge zone delimitations la is also of this order of magnitude.
The tampon printing process which is very similar to the offset printing process is, for example, suitable for printing the surface side 2a.
A further edge zone delimitation possibility is shown in Figure 2. The base body 3 and the terminal contacts 4 are constructed as in Figure 1. In this case, however, the surface side 2b is delimited at the corner points 1 b by block-shaped edge zone delimitations which are raised in relation to the surface side 2b in the order of magnitude of a few tenths of a millimeter and exhibit width dimensions of the same order of magnitude.
In Figure 4, the design of the surface side of the base body 3 is such that the edge zone delimitations do not exhibit sharp transition edges. A crosssection through the base body in Figure 4 would then be of concave configuration at the uppermost sectional edge.
After completion of the printing, the accommodation in a magazine 5 of the integrated circuits in the casing 3 with the edge zone delimitations is illustrated in Figure 3.
On account of the printed surface side 2a, 2b being of sunken configuration in relation to the edge zone delimitations, harmful rubbing off against the inside surface side of the magazine 5 cannot occur at the contact surface 6.
A further advantage of the above-described arrangements is that quicker printing is permitted since prolonged drying times need not be taken into consideration and any harmful direct or indirect heating up of the casing is eliminated. The ratio of the pot life to the drying time of the printing ink is a less troublesome parameter. Inks which may be stored as long as possible in the pot without suffering a loss of quality or consistency and which set or dry immediately after the printing are desired.

Claims (8)

1. A casing for integrated semiconductor circuitry comprising a body and terminal contacts wherein a surface of the body has edge zone delimitation means and a part of the surface arranged for inscription is of sunken configuration in relation to the edge zone delimitation means.
2. A casing according to claim 1, wherein the edge zone delimitation means are arranged on said surface symmetrically to the longitudinal axis of the body.
3. A casing according to claim 1 or 2, wherein the edge zone delimitation means are arranged on said surface symmetrically of the mid-point thereof.
4. A casing according to any preceding claim, wherein the edge zone delimitation means are of prismatic, strip-shaped, block-shaped or beadshaped construction.
5. A casing according to any of claims 1 to 3, wherein said part of the surface is of concave construction.
6. A casing substantially as herein described with reference to Figures 1, 2 or 4 of the accompanying drawings.
7. A method of manufacturing and storing a printed body comprising providing a surface of an unprinted body with edge zone delimitation means so that the remaining part of the surface is of relatively sunken configuration, printing an inscription on said remaining part, and before the printing medium is dry inserting the printed body into a storage magazine.
8. A method of manufacturing and storing a printed body substantially as herein described with reference to the accompanying drawings.
GB8604332A 1985-02-22 1986-02-21 Printing component casing for integrating semiconductor circuit and inserting in storage magazine Withdrawn GB2171359A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19853506172 DE3506172A1 (en) 1985-02-22 1985-02-22 COMPONENT HOUSING

Publications (2)

Publication Number Publication Date
GB8604332D0 GB8604332D0 (en) 1986-03-26
GB2171359A true GB2171359A (en) 1986-08-28

Family

ID=6263253

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8604332A Withdrawn GB2171359A (en) 1985-02-22 1986-02-21 Printing component casing for integrating semiconductor circuit and inserting in storage magazine

Country Status (4)

Country Link
JP (1) JPS61194853A (en)
DE (1) DE3506172A1 (en)
FR (1) FR2578098A1 (en)
GB (1) GB2171359A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19523597A1 (en) * 1995-06-30 1997-01-02 Hans Damm Window of module housing opaque covering method for UV-EPROM
DE112008001923B4 (en) 2007-09-05 2017-07-27 Mitsubishi Electric Corp. Device for an optical disk

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE760031A (en) * 1969-12-11 1971-05-17 Rca Corp HOUSING FOR SEMICONDUCTOR HYBRID POWER MODULE
JPS5823457A (en) * 1981-08-03 1983-02-12 Mitsubishi Electric Corp Semiconductor device
JPS59228738A (en) * 1983-06-10 1984-12-22 Matsushita Electronics Corp Semiconductor device
JPS6018937A (en) * 1983-07-13 1985-01-31 Hitachi Ltd Electronic part

Also Published As

Publication number Publication date
FR2578098A1 (en) 1986-08-29
DE3506172A1 (en) 1986-09-04
JPS61194853A (en) 1986-08-29
GB8604332D0 (en) 1986-03-26

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)