JPS61187237A - パタ−ン形成方法 - Google Patents
パタ−ン形成方法Info
- Publication number
- JPS61187237A JPS61187237A JP60025229A JP2522985A JPS61187237A JP S61187237 A JPS61187237 A JP S61187237A JP 60025229 A JP60025229 A JP 60025229A JP 2522985 A JP2522985 A JP 2522985A JP S61187237 A JPS61187237 A JP S61187237A
- Authority
- JP
- Japan
- Prior art keywords
- light
- gas
- etching
- pattern
- forming method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0041—Photosensitive materials providing an etching agent upon exposure
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
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- H10P34/42—
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- H10P50/242—
-
- H10P50/266—
-
- H10P50/268—
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- H10P50/283—
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- H10P50/73—
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- H10P14/687—
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60025229A JPS61187237A (ja) | 1985-02-14 | 1985-02-14 | パタ−ン形成方法 |
| US06/826,379 US4698238A (en) | 1985-02-14 | 1986-02-05 | Pattern-forming method |
| DE19863604342 DE3604342A1 (de) | 1985-02-14 | 1986-02-12 | Verfahren zur erzeugung eines musters |
| GB08603417A GB2172246B (en) | 1985-02-14 | 1986-02-12 | Pattern-forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60025229A JPS61187237A (ja) | 1985-02-14 | 1985-02-14 | パタ−ン形成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61187237A true JPS61187237A (ja) | 1986-08-20 |
Family
ID=12160139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60025229A Pending JPS61187237A (ja) | 1985-02-14 | 1985-02-14 | パタ−ン形成方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4698238A (OSRAM) |
| JP (1) | JPS61187237A (OSRAM) |
| DE (1) | DE3604342A1 (OSRAM) |
| GB (1) | GB2172246B (OSRAM) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3826046A1 (de) * | 1987-08-17 | 1989-03-02 | Asea Brown Boveri | Verfahren zur herstellung von metallischen schichten |
| US5310624A (en) * | 1988-01-29 | 1994-05-10 | Massachusetts Institute Of Technology | Integrated circuit micro-fabrication using dry lithographic processes |
| GB8806800D0 (en) * | 1988-03-22 | 1988-04-20 | British Telecomm | Etching methods |
| JP2918892B2 (ja) * | 1988-10-14 | 1999-07-12 | 株式会社日立製作所 | プラズマエッチング処理方法 |
| GB8927377D0 (en) * | 1989-12-04 | 1990-01-31 | Univ Edinburgh | Improvements in and relating to amperometric assays |
| EP0436812B1 (en) * | 1989-12-20 | 1994-08-31 | Texas Instruments Incorporated | Copper etch process and printed circuit formed thereby |
| US5318662A (en) * | 1989-12-20 | 1994-06-07 | Texas Instruments Incorporated | Copper etch process using halides |
| DE69133169D1 (de) * | 1990-05-09 | 2003-01-16 | Canon Kk | Verfahren zur Erzeugung einer Struktur und Verfahren zum Vorbereiten einer halbleitenden Anordnung mit Hilfe dieses Verfahrens |
| EP0908781A3 (en) * | 1990-09-26 | 1999-04-21 | Canon Kabushiki Kaisha | Photolithographic processing method and apparatus |
| US5296271A (en) * | 1991-06-13 | 1994-03-22 | Motorola, Inc. | Microwave treatment of photoresist on a substrate |
| CA2222595A1 (en) * | 1995-06-07 | 1996-12-19 | The Regents Of The University Of California | Therapeutic microdevices and methods of making and using same |
| US6107102A (en) * | 1995-06-07 | 2000-08-22 | Regents Of The University Of California | Therapeutic microdevices and methods of making and using same |
| NZ516848A (en) * | 1997-06-20 | 2004-03-26 | Ciphergen Biosystems Inc | Retentate chromatography apparatus with applications in biology and medicine |
| DE19860179A1 (de) * | 1998-12-24 | 2000-06-29 | Audi Ag | Verfahren zur Erzeugung einer strukturierten Maskierung |
| SG115381A1 (en) * | 2001-06-20 | 2005-10-28 | Univ Singapore | Removal of organic layers from organic electronic devices |
| US8993221B2 (en) | 2012-02-10 | 2015-03-31 | Pixelligent Technologies, Llc | Block co-polymer photoresist |
| WO2005008321A1 (en) * | 2003-07-17 | 2005-01-27 | Koninklijke Philips Electronics N.V. | Method of manufacturing a reflector, and liquid crystal display device including such a reflector |
| WO2008008275A2 (en) * | 2006-07-10 | 2008-01-17 | Pixelligent Technologies Llc | Resists for photolithography |
| US8420978B2 (en) * | 2007-01-18 | 2013-04-16 | The Board Of Trustees Of The University Of Illinois | High throughput, low cost dual-mode patterning method for large area substrates |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59194437A (ja) * | 1983-04-18 | 1984-11-05 | Mitsubishi Electric Corp | パタ−ン加工装置 |
| JPS59194440A (ja) * | 1983-04-18 | 1984-11-05 | Mitsubishi Electric Corp | パタ−ン形成装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4107349A (en) * | 1977-08-12 | 1978-08-15 | The United States Of America As Represented By The Secretary Of The Army | Method of adjusting the frequency of piezoelectric resonators |
| US4414059A (en) * | 1982-12-09 | 1983-11-08 | International Business Machines Corporation | Far UV patterning of resist materials |
| US4595601A (en) * | 1984-05-25 | 1986-06-17 | Kabushiki Kaisha Toshiba | Method of selectively forming an insulation layer |
-
1985
- 1985-02-14 JP JP60025229A patent/JPS61187237A/ja active Pending
-
1986
- 1986-02-05 US US06/826,379 patent/US4698238A/en not_active Expired - Lifetime
- 1986-02-12 DE DE19863604342 patent/DE3604342A1/de active Granted
- 1986-02-12 GB GB08603417A patent/GB2172246B/en not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59194437A (ja) * | 1983-04-18 | 1984-11-05 | Mitsubishi Electric Corp | パタ−ン加工装置 |
| JPS59194440A (ja) * | 1983-04-18 | 1984-11-05 | Mitsubishi Electric Corp | パタ−ン形成装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2172246B (en) | 1988-12-21 |
| DE3604342C2 (OSRAM) | 1991-09-12 |
| GB2172246A (en) | 1986-09-17 |
| DE3604342A1 (de) | 1986-08-14 |
| GB8603417D0 (en) | 1986-03-19 |
| US4698238A (en) | 1987-10-06 |
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