JPS61183998A - フレキシブル印刷配線基板の製造方法 - Google Patents
フレキシブル印刷配線基板の製造方法Info
- Publication number
- JPS61183998A JPS61183998A JP60023569A JP2356985A JPS61183998A JP S61183998 A JPS61183998 A JP S61183998A JP 60023569 A JP60023569 A JP 60023569A JP 2356985 A JP2356985 A JP 2356985A JP S61183998 A JPS61183998 A JP S61183998A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- conductive
- resin film
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000004840 adhesive resin Substances 0.000 claims description 25
- 229920006223 adhesive resin Polymers 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 229920003002 synthetic resin Polymers 0.000 claims description 11
- 239000000057 synthetic resin Substances 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 4
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000011888 foil Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- UPZFLZYXYGBAPL-UHFFFAOYSA-N 2-ethyl-2-methyl-1,3-dioxolane Chemical compound CCC1(C)OCCO1 UPZFLZYXYGBAPL-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 241000238413 Octopus Species 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Landscapes
- Laminated Bodies (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60023569A JPS61183998A (ja) | 1985-02-12 | 1985-02-12 | フレキシブル印刷配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60023569A JPS61183998A (ja) | 1985-02-12 | 1985-02-12 | フレキシブル印刷配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61183998A true JPS61183998A (ja) | 1986-08-16 |
| JPH0255958B2 JPH0255958B2 (enExample) | 1990-11-28 |
Family
ID=12114168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60023569A Granted JPS61183998A (ja) | 1985-02-12 | 1985-02-12 | フレキシブル印刷配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61183998A (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62120382U (enExample) * | 1986-01-21 | 1987-07-30 | ||
| US6210518B1 (en) * | 1998-09-11 | 2001-04-03 | Lg Electronics Inc. | Method and fixture for manufacturing flexible printed circuit board |
| JP2005286337A (ja) * | 2004-03-30 | 2005-10-13 | General Electric Co <Ge> | 多重回路板間の高密度接続 |
| US7036214B2 (en) | 2002-03-07 | 2006-05-02 | Denso Corporation | Manufacturing method of rigid-flexible printed circuit board and structure thereof |
| JP2007080857A (ja) * | 2005-09-09 | 2007-03-29 | Fujikura Ltd | 多層プリント配線板、多層プリント配線板の製造方法、及び電子装置 |
| AT13229U1 (de) * | 2011-12-05 | 2013-08-15 | Austria Tech & System Tech | Verfahren zum herstellen einer leiterplatte unter entfernung eines teilbereichs derselben sowie verwendung eines derartigen verfahrens |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5890796A (ja) * | 1981-11-25 | 1983-05-30 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
-
1985
- 1985-02-12 JP JP60023569A patent/JPS61183998A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5890796A (ja) * | 1981-11-25 | 1983-05-30 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62120382U (enExample) * | 1986-01-21 | 1987-07-30 | ||
| US6210518B1 (en) * | 1998-09-11 | 2001-04-03 | Lg Electronics Inc. | Method and fixture for manufacturing flexible printed circuit board |
| US7036214B2 (en) | 2002-03-07 | 2006-05-02 | Denso Corporation | Manufacturing method of rigid-flexible printed circuit board and structure thereof |
| DE10309188B4 (de) * | 2002-03-07 | 2011-07-14 | DENSO CORPORATION, Aichi-pref. | Steif-flexible Leiterplatte und Verfahren zu deren Herstellung |
| JP2005286337A (ja) * | 2004-03-30 | 2005-10-13 | General Electric Co <Ge> | 多重回路板間の高密度接続 |
| JP2007080857A (ja) * | 2005-09-09 | 2007-03-29 | Fujikura Ltd | 多層プリント配線板、多層プリント配線板の製造方法、及び電子装置 |
| AT13229U1 (de) * | 2011-12-05 | 2013-08-15 | Austria Tech & System Tech | Verfahren zum herstellen einer leiterplatte unter entfernung eines teilbereichs derselben sowie verwendung eines derartigen verfahrens |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0255958B2 (enExample) | 1990-11-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |