JPS61181816A - 変性エポキシ樹脂の製造方法 - Google Patents
変性エポキシ樹脂の製造方法Info
- Publication number
- JPS61181816A JPS61181816A JP60020102A JP2010285A JPS61181816A JP S61181816 A JPS61181816 A JP S61181816A JP 60020102 A JP60020102 A JP 60020102A JP 2010285 A JP2010285 A JP 2010285A JP S61181816 A JPS61181816 A JP S61181816A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- compound
- parts
- modified epoxy
- reaction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 15
- 239000000460 chlorine Substances 0.000 claims abstract description 15
- -1 diisocyanate compound Chemical class 0.000 claims abstract description 13
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims abstract description 13
- 150000001875 compounds Chemical class 0.000 claims abstract description 12
- 239000007809 chemical reaction catalyst Substances 0.000 claims abstract description 4
- 230000001588 bifunctional effect Effects 0.000 claims description 19
- 239000004593 Epoxy Substances 0.000 claims description 10
- 239000012948 isocyanate Substances 0.000 claims description 8
- 238000003756 stirring Methods 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 abstract description 12
- 230000035939 shock Effects 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 238000007789 sealing Methods 0.000 abstract description 3
- MTZUIIAIAKMWLI-UHFFFAOYSA-N 1,2-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC=C1N=C=O MTZUIIAIAKMWLI-UHFFFAOYSA-N 0.000 abstract description 2
- 239000003054 catalyst Substances 0.000 abstract description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 abstract 1
- 238000013019 agitation Methods 0.000 abstract 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 abstract 1
- 239000011541 reaction mixture Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 238000002844 melting Methods 0.000 description 11
- 230000008018 melting Effects 0.000 description 11
- WDGCBNTXZHJTHJ-UHFFFAOYSA-N 2h-1,3-oxazol-2-id-4-one Chemical group O=C1CO[C-]=N1 WDGCBNTXZHJTHJ-UHFFFAOYSA-N 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000002329 infrared spectrum Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- 239000000499 gel Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- WMTLVUCMBWBYSO-UHFFFAOYSA-N N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 Chemical compound N=C=O.N=C=O.C=1C=CC=CC=1OC1=CC=CC=C1 WMTLVUCMBWBYSO-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010534 mechanism of action Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 239000012261 resinous substance Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60020102A JPS61181816A (ja) | 1985-02-06 | 1985-02-06 | 変性エポキシ樹脂の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60020102A JPS61181816A (ja) | 1985-02-06 | 1985-02-06 | 変性エポキシ樹脂の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61181816A true JPS61181816A (ja) | 1986-08-14 |
| JPH058729B2 JPH058729B2 (enrdf_load_stackoverflow) | 1993-02-03 |
Family
ID=12017749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60020102A Granted JPS61181816A (ja) | 1985-02-06 | 1985-02-06 | 変性エポキシ樹脂の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61181816A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3260481A1 (de) * | 2016-06-20 | 2017-12-27 | Henkel AG & Co. KGaA | Gehärtete zusammensetzung mit hoher schlagfestigkeit und temperaturbeständigkeit, basierend auf einem epoxidharz und einem polyisocyanat |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4937999A (enrdf_load_stackoverflow) * | 1972-08-15 | 1974-04-09 | ||
| JPS4993493A (enrdf_load_stackoverflow) * | 1972-11-09 | 1974-09-05 | ||
| JPS5048100A (enrdf_load_stackoverflow) * | 1973-08-31 | 1975-04-28 | ||
| JPS5626926A (en) * | 1979-08-10 | 1981-03-16 | Toshiba Corp | Epoxy resin molding material for sealing electronic part |
| JPS5956748A (ja) * | 1983-08-29 | 1984-04-02 | Toshiba Corp | 樹脂封止型半導体装置の |
-
1985
- 1985-02-06 JP JP60020102A patent/JPS61181816A/ja active Granted
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4937999A (enrdf_load_stackoverflow) * | 1972-08-15 | 1974-04-09 | ||
| JPS4993493A (enrdf_load_stackoverflow) * | 1972-11-09 | 1974-09-05 | ||
| JPS5048100A (enrdf_load_stackoverflow) * | 1973-08-31 | 1975-04-28 | ||
| JPS5626926A (en) * | 1979-08-10 | 1981-03-16 | Toshiba Corp | Epoxy resin molding material for sealing electronic part |
| JPS5956748A (ja) * | 1983-08-29 | 1984-04-02 | Toshiba Corp | 樹脂封止型半導体装置の |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3260481A1 (de) * | 2016-06-20 | 2017-12-27 | Henkel AG & Co. KGaA | Gehärtete zusammensetzung mit hoher schlagfestigkeit und temperaturbeständigkeit, basierend auf einem epoxidharz und einem polyisocyanat |
| WO2017220437A1 (de) * | 2016-06-20 | 2017-12-28 | Henkel Ag & Co. Kgaa | Gehärtete zusammensetzung mit hoher schlagfestigkeit und temperaturbeständigkeit, basierend auf einem epoxidharz und einem polyisocyanat |
| US11566113B2 (en) | 2016-06-20 | 2023-01-31 | Henkel Ag & Co. Kgaa | Cured composition having high impact strength and temperature resistance, based on an epoxy resin and a polyisocyanate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH058729B2 (enrdf_load_stackoverflow) | 1993-02-03 |
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