JPS61168934A - ウエハハンドリング方法 - Google Patents

ウエハハンドリング方法

Info

Publication number
JPS61168934A
JPS61168934A JP60010616A JP1061685A JPS61168934A JP S61168934 A JPS61168934 A JP S61168934A JP 60010616 A JP60010616 A JP 60010616A JP 1061685 A JP1061685 A JP 1061685A JP S61168934 A JPS61168934 A JP S61168934A
Authority
JP
Japan
Prior art keywords
wafers
cassette
stocker
disk
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60010616A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0374506B2 (enrdf_load_stackoverflow
Inventor
Tsukasa Nogami
野上　司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissin Electric Co Ltd
Original Assignee
Nissin Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissin Electric Co Ltd filed Critical Nissin Electric Co Ltd
Priority to JP60010616A priority Critical patent/JPS61168934A/ja
Priority to US06/819,253 priority patent/US4759681A/en
Publication of JPS61168934A publication Critical patent/JPS61168934A/ja
Publication of JPH0374506B2 publication Critical patent/JPH0374506B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Specific Conveyance Elements (AREA)
JP60010616A 1985-01-22 1985-01-22 ウエハハンドリング方法 Granted JPS61168934A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP60010616A JPS61168934A (ja) 1985-01-22 1985-01-22 ウエハハンドリング方法
US06/819,253 US4759681A (en) 1985-01-22 1986-01-16 End station for an ion implantation apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60010616A JPS61168934A (ja) 1985-01-22 1985-01-22 ウエハハンドリング方法

Publications (2)

Publication Number Publication Date
JPS61168934A true JPS61168934A (ja) 1986-07-30
JPH0374506B2 JPH0374506B2 (enrdf_load_stackoverflow) 1991-11-27

Family

ID=11755164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60010616A Granted JPS61168934A (ja) 1985-01-22 1985-01-22 ウエハハンドリング方法

Country Status (1)

Country Link
JP (1) JPS61168934A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0265252A (ja) * 1988-08-31 1990-03-05 Nec Kyushu Ltd 半導体製造装置
JPH0496217A (ja) * 1990-08-03 1992-03-27 Kokusai Electric Co Ltd ウェーハ移載制御装置及び半導体製造装置
JPH065099U (ja) * 1992-06-25 1994-01-21 日新電機株式会社 イオン注入装置
JP2014225707A (ja) * 2014-09-01 2014-12-04 東京エレクトロン株式会社 基板処理装置
JP2022011591A (ja) * 2020-06-30 2022-01-17 三菱電機株式会社 イオン注入装置および半導体装置の製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0265252A (ja) * 1988-08-31 1990-03-05 Nec Kyushu Ltd 半導体製造装置
JPH0496217A (ja) * 1990-08-03 1992-03-27 Kokusai Electric Co Ltd ウェーハ移載制御装置及び半導体製造装置
JPH065099U (ja) * 1992-06-25 1994-01-21 日新電機株式会社 イオン注入装置
JP2014225707A (ja) * 2014-09-01 2014-12-04 東京エレクトロン株式会社 基板処理装置
JP2022011591A (ja) * 2020-06-30 2022-01-17 三菱電機株式会社 イオン注入装置および半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0374506B2 (enrdf_load_stackoverflow) 1991-11-27

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