JPS61154196A - アウタ−リ−ドボンデイング装置 - Google Patents
アウタ−リ−ドボンデイング装置Info
- Publication number
- JPS61154196A JPS61154196A JP59273748A JP27374884A JPS61154196A JP S61154196 A JPS61154196 A JP S61154196A JP 59273748 A JP59273748 A JP 59273748A JP 27374884 A JP27374884 A JP 27374884A JP S61154196 A JPS61154196 A JP S61154196A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- outer lead
- printed circuit
- lead
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59273748A JPS61154196A (ja) | 1984-12-27 | 1984-12-27 | アウタ−リ−ドボンデイング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP59273748A JPS61154196A (ja) | 1984-12-27 | 1984-12-27 | アウタ−リ−ドボンデイング装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61139291A Division JPS6284529A (ja) | 1986-06-17 | 1986-06-17 | キヤリヤテ−プ打抜装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61154196A true JPS61154196A (ja) | 1986-07-12 |
JPH0466118B2 JPH0466118B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-10-22 |
Family
ID=17532022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP59273748A Granted JPS61154196A (ja) | 1984-12-27 | 1984-12-27 | アウタ−リ−ドボンデイング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61154196A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01135738U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1988-03-08 | 1989-09-18 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5986287A (ja) * | 1982-11-08 | 1984-05-18 | 株式会社新川 | アウタ−リ−ドボンデイング装置 |
JPS59175132A (ja) * | 1983-03-23 | 1984-10-03 | Nec Corp | テ−プキヤリア方式による半導体装置の製造方法 |
-
1984
- 1984-12-27 JP JP59273748A patent/JPS61154196A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5986287A (ja) * | 1982-11-08 | 1984-05-18 | 株式会社新川 | アウタ−リ−ドボンデイング装置 |
JPS59175132A (ja) * | 1983-03-23 | 1984-10-03 | Nec Corp | テ−プキヤリア方式による半導体装置の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01135738U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1988-03-08 | 1989-09-18 |
Also Published As
Publication number | Publication date |
---|---|
JPH0466118B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-10-22 |