JPS61154044A - プロ−バ−のプロ−ブカ−ド - Google Patents

プロ−バ−のプロ−ブカ−ド

Info

Publication number
JPS61154044A
JPS61154044A JP28061684A JP28061684A JPS61154044A JP S61154044 A JPS61154044 A JP S61154044A JP 28061684 A JP28061684 A JP 28061684A JP 28061684 A JP28061684 A JP 28061684A JP S61154044 A JPS61154044 A JP S61154044A
Authority
JP
Japan
Prior art keywords
probe card
electrodes
substrate
probe
elasticity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28061684A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0515068B2 (ko
Inventor
Masataka Oba
正隆 大場
Masaya Fukushima
正也 福島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Electric Manufacturing Ltd
Original Assignee
Toyo Electric Manufacturing Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Electric Manufacturing Ltd filed Critical Toyo Electric Manufacturing Ltd
Priority to JP28061684A priority Critical patent/JPS61154044A/ja
Publication of JPS61154044A publication Critical patent/JPS61154044A/ja
Publication of JPH0515068B2 publication Critical patent/JPH0515068B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP28061684A 1984-12-26 1984-12-26 プロ−バ−のプロ−ブカ−ド Granted JPS61154044A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28061684A JPS61154044A (ja) 1984-12-26 1984-12-26 プロ−バ−のプロ−ブカ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28061684A JPS61154044A (ja) 1984-12-26 1984-12-26 プロ−バ−のプロ−ブカ−ド

Publications (2)

Publication Number Publication Date
JPS61154044A true JPS61154044A (ja) 1986-07-12
JPH0515068B2 JPH0515068B2 (ko) 1993-02-26

Family

ID=17627522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28061684A Granted JPS61154044A (ja) 1984-12-26 1984-12-26 プロ−バ−のプロ−ブカ−ド

Country Status (1)

Country Link
JP (1) JPS61154044A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03504657A (ja) * 1988-05-16 1991-10-09 リーディ，グレン　ジェイ． 集積回路の製作および試験方法、ならびに集積回路用試験装置
WO2004015432A1 (en) * 2002-07-15 2004-02-19 Formfactor, Inc. Fiducial alignment marks on microelectronic spring contacts
US6933738B2 (en) 2001-07-16 2005-08-23 Formfactor, Inc. Fiducial alignment marks on microelectronic spring contacts

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5811739A (ja) * 1981-07-15 1983-01-22 Nippon Kokan Kk <Nkk> 低Ｍｎ−低Ａｌスラブの表面欠陥の発生防止法
JPS59144142A (ja) * 1983-02-08 1984-08-18 Nec Corp プロ−ブカ−ド
JPS59214235A (ja) * 1983-05-20 1984-12-04 Ibiden Co Ltd 半導体ウエハ−の検査方法及びその装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5811739A (ja) * 1981-07-15 1983-01-22 Nippon Kokan Kk <Nkk> 低Ｍｎ−低Ａｌスラブの表面欠陥の発生防止法
JPS59144142A (ja) * 1983-02-08 1984-08-18 Nec Corp プロ−ブカ−ド
JPS59214235A (ja) * 1983-05-20 1984-12-04 Ibiden Co Ltd 半導体ウエハ−の検査方法及びその装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03504657A (ja) * 1988-05-16 1991-10-09 リーディ，グレン　ジェイ． 集積回路の製作および試験方法、ならびに集積回路用試験装置
US6933738B2 (en) 2001-07-16 2005-08-23 Formfactor, Inc. Fiducial alignment marks on microelectronic spring contacts
WO2004015432A1 (en) * 2002-07-15 2004-02-19 Formfactor, Inc. Fiducial alignment marks on microelectronic spring contacts
CN100447573C (zh) * 2002-07-15 2008-12-31 佛姆费克托公司 微电子弹簧触点上的基准对准标记

Also Published As

Publication number Publication date
JPH0515068B2 (ko) 1993-02-26

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term