JPS61148704A - 印刷回路基板 - Google Patents
印刷回路基板Info
- Publication number
- JPS61148704A JPS61148704A JP27129884A JP27129884A JPS61148704A JP S61148704 A JPS61148704 A JP S61148704A JP 27129884 A JP27129884 A JP 27129884A JP 27129884 A JP27129884 A JP 27129884A JP S61148704 A JPS61148704 A JP S61148704A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- ink
- core material
- resins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011162 core material Substances 0.000 claims description 21
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 238000009751 slip forming Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 22
- 239000011347 resin Substances 0.000 description 22
- 230000001070 adhesive effect Effects 0.000 description 8
- 239000010410 layer Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000004745 nonwoven fabric Substances 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000001035 drying Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- -1 woven Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 5
- 239000000835 fiber Substances 0.000 description 4
- 229920001225 polyester resin Polymers 0.000 description 4
- 239000004645 polyester resin Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000004760 aramid Substances 0.000 description 3
- 229920003235 aromatic polyamide Polymers 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000011231 conductive filler Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000002759 woven fabric Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- 241001523558 Hyale Species 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Non-Insulated Conductors (AREA)
- Windings For Motors And Generators (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27129884A JPS61148704A (ja) | 1984-12-22 | 1984-12-22 | 印刷回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27129884A JPS61148704A (ja) | 1984-12-22 | 1984-12-22 | 印刷回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61148704A true JPS61148704A (ja) | 1986-07-07 |
| JPH0441443B2 JPH0441443B2 (enrdf_load_stackoverflow) | 1992-07-08 |
Family
ID=17498091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27129884A Granted JPS61148704A (ja) | 1984-12-22 | 1984-12-22 | 印刷回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61148704A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05175649A (ja) * | 1991-12-25 | 1993-07-13 | Tokuyama Soda Co Ltd | 回路基板の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5784582A (en) * | 1980-11-14 | 1982-05-26 | Shinetsu Polymer Co | Method of producing step type cnnector |
| JPS60131709A (ja) * | 1983-12-19 | 1985-07-13 | 松下電器産業株式会社 | 熱圧着シ−ト |
-
1984
- 1984-12-22 JP JP27129884A patent/JPS61148704A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5784582A (en) * | 1980-11-14 | 1982-05-26 | Shinetsu Polymer Co | Method of producing step type cnnector |
| JPS60131709A (ja) * | 1983-12-19 | 1985-07-13 | 松下電器産業株式会社 | 熱圧着シ−ト |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05175649A (ja) * | 1991-12-25 | 1993-07-13 | Tokuyama Soda Co Ltd | 回路基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0441443B2 (enrdf_load_stackoverflow) | 1992-07-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW410534B (en) | Wiring board and production process for the same | |
| JP2524138B2 (ja) | 電気ケ―ブル | |
| JPH0634473B2 (ja) | 電磁波遮蔽付フレキシブルプリント回路形成体 | |
| WO2008047718A1 (fr) | Tableau de connexions imprimées multicouche et procédé de fabrication de celui-ci | |
| JP3434021B2 (ja) | シ−ルドフレキシブルプリント配線板 | |
| JPS61148704A (ja) | 印刷回路基板 | |
| JPS61107792A (ja) | 回路基布の形成方法 | |
| JP2644717B2 (ja) | シート状異方導電性接着剤 | |
| CN207671977U (zh) | 一种与金属高结合力的导电胶膜及其产品 | |
| JP2779649B2 (ja) | 印刷配線板の製造方法 | |
| JPH0416037B2 (enrdf_load_stackoverflow) | ||
| JP3510834B2 (ja) | 導電性接着剤組成物、導電性接着剤シート、電磁波シールド材料及びそれを使用したフレキシブルプリント基板 | |
| JPH049396B2 (enrdf_load_stackoverflow) | ||
| CN107613628A (zh) | 电磁波屏蔽材料 | |
| JPH0342714B2 (enrdf_load_stackoverflow) | ||
| JPS5818993A (ja) | プリント回路基板上にヒ−トシ−ルコネクタとの接触端子部を製造する方法 | |
| JPH01194209A (ja) | 熱接着性可撓性配線部材 | |
| JPS61224393A (ja) | メッキ回路基板の製法 | |
| JP3474895B2 (ja) | 電気接続装置とその製造方法ならびにプリント配線板とその製造方法 | |
| JP2696403B2 (ja) | 射出成形印刷配線体の製造方法 | |
| JPS61195568A (ja) | フイルムコネクタ | |
| JPS5866385A (ja) | 印刷配線用基板の製造方法 | |
| JPH02852Y2 (enrdf_load_stackoverflow) | ||
| JP2005109311A (ja) | 配線基板およびその製造方法 | |
| JPS61239525A (ja) | メンブレンスイツチ |