JPS6112385B2 - - Google Patents
Info
- Publication number
- JPS6112385B2 JPS6112385B2 JP52154821A JP15482177A JPS6112385B2 JP S6112385 B2 JPS6112385 B2 JP S6112385B2 JP 52154821 A JP52154821 A JP 52154821A JP 15482177 A JP15482177 A JP 15482177A JP S6112385 B2 JPS6112385 B2 JP S6112385B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- solder
- semiconductor
- semi
- solder paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15482177A JPS5486275A (en) | 1977-12-21 | 1977-12-21 | Manufacture of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15482177A JPS5486275A (en) | 1977-12-21 | 1977-12-21 | Manufacture of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5486275A JPS5486275A (en) | 1979-07-09 |
| JPS6112385B2 true JPS6112385B2 (enExample) | 1986-04-08 |
Family
ID=15592600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15482177A Granted JPS5486275A (en) | 1977-12-21 | 1977-12-21 | Manufacture of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5486275A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61267355A (ja) * | 1985-05-21 | 1986-11-26 | Fuji Plant Kogyo Kk | 半導体パツケ−ジ組立工程での外装処理方法 |
| JPS63142841A (ja) * | 1986-12-05 | 1988-06-15 | Fuji Plant Kogyo Kk | リ−ドフレ−ムへの半田外装処理方法 |
| JPS63148669A (ja) * | 1986-12-12 | 1988-06-21 | Fuji Plant Kogyo Kk | リ−ドフレ−ムへの半田外装方法 |
-
1977
- 1977-12-21 JP JP15482177A patent/JPS5486275A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5486275A (en) | 1979-07-09 |
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