JPS5486275A - Manufacture of semiconductor - Google Patents

Manufacture of semiconductor

Info

Publication number
JPS5486275A
JPS5486275A JP15482177A JP15482177A JPS5486275A JP S5486275 A JPS5486275 A JP S5486275A JP 15482177 A JP15482177 A JP 15482177A JP 15482177 A JP15482177 A JP 15482177A JP S5486275 A JPS5486275 A JP S5486275A
Authority
JP
Japan
Prior art keywords
frame
lead
solvent
approximate
solder paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15482177A
Other languages
Japanese (ja)
Other versions
JPS6112385B2 (en
Inventor
Eikichi Wakamatsu
Tomoichi Oku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15482177A priority Critical patent/JPS5486275A/en
Publication of JPS5486275A publication Critical patent/JPS5486275A/en
Publication of JPS6112385B2 publication Critical patent/JPS6112385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To obtain a device which suits to mass-production by stabilizing its quality and by reducing its cost, by burning solder paste applied onto an external lead constituting a lead frame.
CONSTITUTION: Lead frame 1 of copal or the like is washed by using a trichloroethylene solvent or alkali solvent first and then washed again by using an acid solvent of HCl. On external lead 4 of frame 1, solder paste 6 of 38% of fine grains Pb-Sn and approximate 70% of resin, antimony chloride, soft petroleum, wax, etc., is screen-printed and burned at approximate 170°C to be adhered completely. Then, semiconductor device 3 sealed by epoxy resin is fixed onto frame 1 and after the device is separated into pieces, lead 4 is lent to obtain products.
COPYRIGHT: (C)1979,JPO&Japio
JP15482177A 1977-12-21 1977-12-21 Manufacture of semiconductor Granted JPS5486275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15482177A JPS5486275A (en) 1977-12-21 1977-12-21 Manufacture of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15482177A JPS5486275A (en) 1977-12-21 1977-12-21 Manufacture of semiconductor

Publications (2)

Publication Number Publication Date
JPS5486275A true JPS5486275A (en) 1979-07-09
JPS6112385B2 JPS6112385B2 (en) 1986-04-08

Family

ID=15592600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15482177A Granted JPS5486275A (en) 1977-12-21 1977-12-21 Manufacture of semiconductor

Country Status (1)

Country Link
JP (1) JPS5486275A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61267355A (en) * 1985-05-21 1986-11-26 Fuji Plant Kogyo Kk Cladding process at semiconductor package assembly process
JPS63142841A (en) * 1986-12-05 1988-06-15 Fuji Plant Kogyo Kk Method of solder sheathing treating to lead frame
JPS63148669A (en) * 1986-12-12 1988-06-21 Fuji Plant Kogyo Kk Solder cladding for lead frame

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61267355A (en) * 1985-05-21 1986-11-26 Fuji Plant Kogyo Kk Cladding process at semiconductor package assembly process
JPS63142841A (en) * 1986-12-05 1988-06-15 Fuji Plant Kogyo Kk Method of solder sheathing treating to lead frame
JPH0312780B2 (en) * 1986-12-05 1991-02-21 Fuji Plant Kogyo Kk
JPS63148669A (en) * 1986-12-12 1988-06-21 Fuji Plant Kogyo Kk Solder cladding for lead frame

Also Published As

Publication number Publication date
JPS6112385B2 (en) 1986-04-08

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