JPS5480073A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS5480073A JPS5480073A JP14707777A JP14707777A JPS5480073A JP S5480073 A JPS5480073 A JP S5480073A JP 14707777 A JP14707777 A JP 14707777A JP 14707777 A JP14707777 A JP 14707777A JP S5480073 A JPS5480073 A JP S5480073A
- Authority
- JP
- Japan
- Prior art keywords
- grooves
- corners
- center
- silver paste
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To increase the adhesive intensity by providing the grooves connecting the center and the four corners on the surface of the square tab part to extend the adhesive over the entire surface.
CONSTITUTION: Guide grooves 4 are formed from center 5 to the four corners on the surface of tab 3, and thus the silver paste dropped down to the centr is extended to the corner parts along the grooves at the scrubbing time. Thus, the connection is secured in the state under which the silver paste sticks to the entire back surface of the pellet, increasing the adhesive intensity.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14707777A JPS5480073A (en) | 1977-12-09 | 1977-12-09 | Lead frame |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14707777A JPS5480073A (en) | 1977-12-09 | 1977-12-09 | Lead frame |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5480073A true JPS5480073A (en) | 1979-06-26 |
Family
ID=15421941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14707777A Pending JPS5480073A (en) | 1977-12-09 | 1977-12-09 | Lead frame |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5480073A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59201451A (en) * | 1983-04-28 | 1984-11-15 | Rohm Co Ltd | Lead frame |
JPS63239967A (en) * | 1987-03-27 | 1988-10-05 | Toshiba Corp | Resin sealed semiconductor device and manufacture thereof |
JP2007096042A (en) * | 2005-09-29 | 2007-04-12 | Rohm Co Ltd | Semiconductor device |
JP2008159742A (en) * | 2006-12-22 | 2008-07-10 | Fujitsu Component Ltd | Mounting structure of semiconductor element |
EP2605278A1 (en) * | 2011-12-15 | 2013-06-19 | Nxp B.V. | Lead Frame with Die Attach Bleeding Control Features |
JP2015153877A (en) * | 2014-02-13 | 2015-08-24 | セイコーインスツル株式会社 | Lead frame and method of manufacturing semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5029415U (en) * | 1973-07-10 | 1975-04-03 |
-
1977
- 1977-12-09 JP JP14707777A patent/JPS5480073A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5029415U (en) * | 1973-07-10 | 1975-04-03 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59201451A (en) * | 1983-04-28 | 1984-11-15 | Rohm Co Ltd | Lead frame |
JPS63239967A (en) * | 1987-03-27 | 1988-10-05 | Toshiba Corp | Resin sealed semiconductor device and manufacture thereof |
JP2007096042A (en) * | 2005-09-29 | 2007-04-12 | Rohm Co Ltd | Semiconductor device |
JP2008159742A (en) * | 2006-12-22 | 2008-07-10 | Fujitsu Component Ltd | Mounting structure of semiconductor element |
EP2605278A1 (en) * | 2011-12-15 | 2013-06-19 | Nxp B.V. | Lead Frame with Die Attach Bleeding Control Features |
JP2015153877A (en) * | 2014-02-13 | 2015-08-24 | セイコーインスツル株式会社 | Lead frame and method of manufacturing semiconductor device |
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