JPS5480073A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS5480073A
JPS5480073A JP14707777A JP14707777A JPS5480073A JP S5480073 A JPS5480073 A JP S5480073A JP 14707777 A JP14707777 A JP 14707777A JP 14707777 A JP14707777 A JP 14707777A JP S5480073 A JPS5480073 A JP S5480073A
Authority
JP
Japan
Prior art keywords
grooves
corners
center
silver paste
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14707777A
Other languages
Japanese (ja)
Inventor
Tatsuo Sugimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14707777A priority Critical patent/JPS5480073A/en
Publication of JPS5480073A publication Critical patent/JPS5480073A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To increase the adhesive intensity by providing the grooves connecting the center and the four corners on the surface of the square tab part to extend the adhesive over the entire surface.
CONSTITUTION: Guide grooves 4 are formed from center 5 to the four corners on the surface of tab 3, and thus the silver paste dropped down to the centr is extended to the corner parts along the grooves at the scrubbing time. Thus, the connection is secured in the state under which the silver paste sticks to the entire back surface of the pellet, increasing the adhesive intensity.
COPYRIGHT: (C)1979,JPO&Japio
JP14707777A 1977-12-09 1977-12-09 Lead frame Pending JPS5480073A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14707777A JPS5480073A (en) 1977-12-09 1977-12-09 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14707777A JPS5480073A (en) 1977-12-09 1977-12-09 Lead frame

Publications (1)

Publication Number Publication Date
JPS5480073A true JPS5480073A (en) 1979-06-26

Family

ID=15421941

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14707777A Pending JPS5480073A (en) 1977-12-09 1977-12-09 Lead frame

Country Status (1)

Country Link
JP (1) JPS5480073A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201451A (en) * 1983-04-28 1984-11-15 Rohm Co Ltd Lead frame
JPS63239967A (en) * 1987-03-27 1988-10-05 Toshiba Corp Resin sealed semiconductor device and manufacture thereof
JP2007096042A (en) * 2005-09-29 2007-04-12 Rohm Co Ltd Semiconductor device
JP2008159742A (en) * 2006-12-22 2008-07-10 Fujitsu Component Ltd Mounting structure of semiconductor element
EP2605278A1 (en) * 2011-12-15 2013-06-19 Nxp B.V. Lead Frame with Die Attach Bleeding Control Features
JP2015153877A (en) * 2014-02-13 2015-08-24 セイコーインスツル株式会社 Lead frame and method of manufacturing semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029415U (en) * 1973-07-10 1975-04-03

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5029415U (en) * 1973-07-10 1975-04-03

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201451A (en) * 1983-04-28 1984-11-15 Rohm Co Ltd Lead frame
JPS63239967A (en) * 1987-03-27 1988-10-05 Toshiba Corp Resin sealed semiconductor device and manufacture thereof
JP2007096042A (en) * 2005-09-29 2007-04-12 Rohm Co Ltd Semiconductor device
JP2008159742A (en) * 2006-12-22 2008-07-10 Fujitsu Component Ltd Mounting structure of semiconductor element
EP2605278A1 (en) * 2011-12-15 2013-06-19 Nxp B.V. Lead Frame with Die Attach Bleeding Control Features
JP2015153877A (en) * 2014-02-13 2015-08-24 セイコーインスツル株式会社 Lead frame and method of manufacturing semiconductor device

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