JPS6112373B2 - - Google Patents
Info
- Publication number
- JPS6112373B2 JPS6112373B2 JP10092074A JP10092074A JPS6112373B2 JP S6112373 B2 JPS6112373 B2 JP S6112373B2 JP 10092074 A JP10092074 A JP 10092074A JP 10092074 A JP10092074 A JP 10092074A JP S6112373 B2 JPS6112373 B2 JP S6112373B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- cutting
- dicing
- cleaning water
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 claims description 73
- 239000004065 semiconductor Substances 0.000 claims description 66
- 238000005520 cutting process Methods 0.000 claims description 47
- 238000004140 cleaning Methods 0.000 claims description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 25
- 239000000498 cooling water Substances 0.000 claims description 13
- 239000002699 waste material Substances 0.000 claims description 6
- 238000011010 flushing procedure Methods 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 11
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 238000005336 cracking Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D59/00—Accessories specially designed for sawing machines or sawing devices
- B23D59/02—Devices for lubricating or cooling circular saw blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10092074A JPS6112373B2 (US06491871-20021210-M00006.png) | 1974-09-04 | 1974-09-04 | |
US05/608,733 US4016855A (en) | 1974-09-04 | 1975-08-28 | Grinding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10092074A JPS6112373B2 (US06491871-20021210-M00006.png) | 1974-09-04 | 1974-09-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5128754A JPS5128754A (US06491871-20021210-M00006.png) | 1976-03-11 |
JPS6112373B2 true JPS6112373B2 (US06491871-20021210-M00006.png) | 1986-04-08 |
Family
ID=14286769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10092074A Expired JPS6112373B2 (US06491871-20021210-M00006.png) | 1974-09-04 | 1974-09-04 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4016855A (US06491871-20021210-M00006.png) |
JP (1) | JPS6112373B2 (US06491871-20021210-M00006.png) |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2730130C2 (de) * | 1976-09-14 | 1987-11-12 | Mitsubishi Denki K.K., Tokyo | Verfahren zum Herstellen von Halbleiterbauelementen |
US4091580A (en) * | 1977-06-29 | 1978-05-30 | Timex Corporation | Process for holding and cutting sheet glass |
US4279102A (en) * | 1978-07-24 | 1981-07-21 | Magnetic Peripherals Inc. | Method of manufacturing narrow track ferrite head cores |
JPS55112761A (en) * | 1979-02-20 | 1980-08-30 | Disco Abrasive Sys Ltd | Dry type cutting method |
CH635769A5 (fr) * | 1980-03-10 | 1983-04-29 | Far Fab Assortiments Reunies | Installation pour le sciage de plaques et dispositif de manutention pour une telle installation. |
JPS599926A (ja) * | 1982-07-08 | 1984-01-19 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
US4501258A (en) * | 1982-10-04 | 1985-02-26 | Texas Instruments Incorporated | Kerf loss reduction in internal diameter sawing |
US4502459A (en) * | 1982-10-04 | 1985-03-05 | Texas Instruments Incorporated | Control of internal diameter saw blade tension in situ |
JPS59122209U (ja) * | 1983-02-07 | 1984-08-17 | 株式会社デイスコ | 切断機 |
US4564000A (en) * | 1984-07-06 | 1986-01-14 | The United States Of America As Represented By The Secretary Of The Army | Precision cutting of millimeter wave ferrite materials |
US4914866A (en) * | 1984-11-29 | 1990-04-10 | American Telephone And Telegraph Co. | Apparatus for adjusting optical fiber connector components |
US4738055A (en) * | 1984-11-29 | 1988-04-19 | American Telephone And Telegraph Company, At&T Bell Laboratories | Methods of adjusting optical fiber connector components |
JPH0429966Y2 (US06491871-20021210-M00006.png) * | 1986-03-06 | 1992-07-20 | ||
US4976072A (en) * | 1989-03-10 | 1990-12-11 | Hicks Thomas W | Fluid directing method and apparatus for aiding the shaping, polishing and smoothing of work piece by sanding |
US5143854A (en) * | 1989-06-07 | 1992-09-01 | Affymax Technologies N.V. | Large scale photolithographic solid phase synthesis of polypeptides and receptor binding screening thereof |
US5547839A (en) * | 1989-06-07 | 1996-08-20 | Affymax Technologies N.V. | Sequencing of surface immobilized polymers utilizing microflourescence detection |
DE69132843T2 (de) * | 1990-12-06 | 2002-09-12 | Affymetrix, Inc. (N.D.Ges.D.Staates Delaware) | Identifizierung von Nukleinsäuren in Proben |
US6849462B1 (en) | 1991-11-22 | 2005-02-01 | Affymetrix, Inc. | Combinatorial strategies for polymer synthesis |
US6943034B1 (en) * | 1991-11-22 | 2005-09-13 | Affymetrix, Inc. | Combinatorial strategies for polymer synthesis |
US20030017081A1 (en) * | 1994-02-10 | 2003-01-23 | Affymetrix, Inc. | Method and apparatus for imaging a sample on a device |
US6090555A (en) * | 1997-12-11 | 2000-07-18 | Affymetrix, Inc. | Scanned image alignment systems and methods |
US5631734A (en) * | 1994-02-10 | 1997-05-20 | Affymetrix, Inc. | Method and apparatus for detection of fluorescently labeled materials |
US6741344B1 (en) * | 1994-02-10 | 2004-05-25 | Affymetrix, Inc. | Method and apparatus for detection of fluorescently labeled materials |
US6287850B1 (en) * | 1995-06-07 | 2001-09-11 | Affymetrix, Inc. | Bioarray chip reaction apparatus and its manufacture |
DE69527585T2 (de) * | 1994-06-08 | 2003-04-03 | Affymetrix, Inc. | Verfahren und Vorrichtung zum Verpacken von Chips |
JP3566417B2 (ja) * | 1994-10-31 | 2004-09-15 | 株式会社荏原製作所 | ポリッシング装置 |
US5599695A (en) * | 1995-02-27 | 1997-02-04 | Affymetrix, Inc. | Printing molecular library arrays using deprotection agents solely in the vapor phase |
US6239273B1 (en) | 1995-02-27 | 2001-05-29 | Affymetrix, Inc. | Printing molecular library arrays |
US5959098A (en) | 1996-04-17 | 1999-09-28 | Affymetrix, Inc. | Substrate preparation process |
US6720149B1 (en) * | 1995-06-07 | 2004-04-13 | Affymetrix, Inc. | Methods for concurrently processing multiple biological chip assays |
JP3778594B2 (ja) * | 1995-07-18 | 2006-05-24 | 株式会社荏原製作所 | ドレッシング方法 |
JPH0955362A (ja) * | 1995-08-09 | 1997-02-25 | Cypress Semiconductor Corp | スクラッチを減少する集積回路の製造方法 |
US6706875B1 (en) * | 1996-04-17 | 2004-03-16 | Affyemtrix, Inc. | Substrate preparation process |
WO1997043611A1 (en) | 1996-05-16 | 1997-11-20 | Affymetrix, Inc. | Systems and methods for detection of labeled materials |
US5832585A (en) * | 1996-08-13 | 1998-11-10 | National Semiconductor Corporation | Method of separating micro-devices formed on a substrate |
US5923995A (en) * | 1997-04-18 | 1999-07-13 | National Semiconductor Corporation | Methods and apparatuses for singulation of microelectromechanical systems |
US6425972B1 (en) * | 1997-06-18 | 2002-07-30 | Calipher Technologies Corp. | Methods of manufacturing microfabricated substrates |
JP3497071B2 (ja) * | 1997-11-20 | 2004-02-16 | 東芝機械株式会社 | 輪郭加工方法および加工機械 |
US5920769A (en) * | 1997-12-12 | 1999-07-06 | Micron Technology, Inc. | Method and apparatus for processing a planar structure |
US5827111A (en) * | 1997-12-15 | 1998-10-27 | Micron Technology, Inc. | Method and apparatus for grinding wafers |
US5827112A (en) * | 1997-12-15 | 1998-10-27 | Micron Technology, Inc. | Method and apparatus for grinding wafers |
JP3482331B2 (ja) * | 1997-12-17 | 2003-12-22 | 東芝機械株式会社 | 仕上げ加工方法 |
US20040265838A1 (en) * | 1998-02-06 | 2004-12-30 | Affymetrix, Inc. | Method of manufacturing |
US7612020B2 (en) * | 1998-12-28 | 2009-11-03 | Illumina, Inc. | Composite arrays utilizing microspheres with a hybridization chamber |
TW440494B (en) * | 1999-05-13 | 2001-06-16 | Sumitomo Spec Metals | Machining method of rare earth alloy and manufacture of rare earth magnet using it |
DE10027086B4 (de) * | 1999-06-01 | 2009-04-16 | Hitachi Metals, Ltd. | Magnetelement-Schneidverfahren und Magnetelement-Schneidvorrichtung |
JP3444536B2 (ja) * | 1999-10-25 | 2003-09-08 | 松下電器産業株式会社 | 半導体レーザー素子の製造方法および劈開装置 |
US6420206B1 (en) | 2001-01-30 | 2002-07-16 | Axsun Technologies, Inc. | Optical membrane singulation process utilizing backside and frontside protective coating during die saw |
US20040241659A1 (en) * | 2003-05-30 | 2004-12-02 | Applera Corporation | Apparatus and method for hybridization and SPR detection |
US20060246576A1 (en) * | 2005-04-06 | 2006-11-02 | Affymetrix, Inc. | Fluidic system and method for processing biological microarrays in personal instrumentation |
JP4777072B2 (ja) * | 2006-01-11 | 2011-09-21 | 株式会社東京精密 | ダイシング装置 |
US9445025B2 (en) | 2006-01-27 | 2016-09-13 | Affymetrix, Inc. | System, method, and product for imaging probe arrays with small feature sizes |
US8055098B2 (en) * | 2006-01-27 | 2011-11-08 | Affymetrix, Inc. | System, method, and product for imaging probe arrays with small feature sizes |
US20070254255A1 (en) * | 2006-03-28 | 2007-11-01 | Neville James E | System, apparatus and methods for board cooling |
US20080003667A1 (en) * | 2006-05-19 | 2008-01-03 | Affymetrix, Inc. | Consumable elements for use with fluid processing and detection systems |
US7572990B2 (en) * | 2007-03-30 | 2009-08-11 | Intermec Ip Corp. | Keypad overlay membrane |
US8425279B2 (en) * | 2008-09-30 | 2013-04-23 | Misubishi Polycrystalline Silicon America Corporation (MIPSA) | Apparatus for manufacturing seeds for polycrystalline silicon manufacture |
US8602845B2 (en) * | 2011-09-23 | 2013-12-10 | United Technologies Corporation | Strengthening by machining |
US20130217310A1 (en) * | 2012-02-21 | 2013-08-22 | Chih-hao Chen | Wafer Processing Equipment |
JP6417227B2 (ja) | 2015-01-27 | 2018-10-31 | 株式会社ディスコ | 切削ブレード及び切削装置並びにウエーハの加工方法 |
JP6462422B2 (ja) * | 2015-03-03 | 2019-01-30 | 株式会社ディスコ | 切削装置及びウエーハの加工方法 |
US20180043504A1 (en) * | 2016-08-12 | 2018-02-15 | United Technologies Corporation | Machining a cooled region of a body |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1063904A (en) * | 1963-07-13 | 1967-04-05 | Waldrich Werkzeugmasch | Method and apparatus for cooling machine tools |
JPS4917988A (US06491871-20021210-M00006.png) * | 1972-06-06 | 1974-02-16 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2911773A (en) * | 1957-06-18 | 1959-11-10 | Itt | Method of cutting semiconductive material |
US3672099A (en) * | 1970-09-03 | 1972-06-27 | Univ California | Automatic rock thinsectioning machine |
US3831576A (en) * | 1971-11-22 | 1974-08-27 | Motorola Inc | Machine and method for cutting brittle materials using a reciprocating cutting wire |
JPS48104255U (US06491871-20021210-M00006.png) * | 1972-03-11 | 1973-12-05 |
-
1974
- 1974-09-04 JP JP10092074A patent/JPS6112373B2/ja not_active Expired
-
1975
- 1975-08-28 US US05/608,733 patent/US4016855A/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1063904A (en) * | 1963-07-13 | 1967-04-05 | Waldrich Werkzeugmasch | Method and apparatus for cooling machine tools |
JPS4917988A (US06491871-20021210-M00006.png) * | 1972-06-06 | 1974-02-16 |
Also Published As
Publication number | Publication date |
---|---|
US4016855A (en) | 1977-04-12 |
JPS5128754A (US06491871-20021210-M00006.png) | 1976-03-11 |
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