JPS61101520A - 封止用樹脂組成物 - Google Patents
封止用樹脂組成物Info
- Publication number
- JPS61101520A JPS61101520A JP22136284A JP22136284A JPS61101520A JP S61101520 A JPS61101520 A JP S61101520A JP 22136284 A JP22136284 A JP 22136284A JP 22136284 A JP22136284 A JP 22136284A JP S61101520 A JPS61101520 A JP S61101520A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- molding
- sealing resin
- inorganic filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 16
- 238000007789 sealing Methods 0.000 title claims abstract description 16
- 239000003822 epoxy resin Substances 0.000 claims abstract description 12
- 229920003986 novolac Polymers 0.000 claims abstract description 12
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 12
- 239000011256 inorganic filler Substances 0.000 claims abstract description 10
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 10
- 239000005011 phenolic resin Substances 0.000 claims abstract description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 7
- 229920000233 poly(alkylene oxides) Polymers 0.000 claims abstract description 7
- 229920002545 silicone oil Polymers 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 6
- 229920001577 copolymer Polymers 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 10
- 238000000465 moulding Methods 0.000 abstract description 7
- 239000000203 mixture Substances 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 5
- 239000000377 silicon dioxide Substances 0.000 abstract description 5
- 238000001721 transfer moulding Methods 0.000 abstract description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 239000003921 oil Substances 0.000 abstract description 3
- 239000003086 colorant Substances 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 3
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 239000010703 silicon Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 description 26
- 239000011347 resin Substances 0.000 description 26
- 239000012778 molding material Substances 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- -1 esters or paraffins Chemical class 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000010680 novolac-type phenolic resin Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- QSSXJPIWXQTSIX-UHFFFAOYSA-N 1-bromo-2-methylbenzene Chemical compound CC1=CC=CC=C1Br QSSXJPIWXQTSIX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000004901 spalling Methods 0.000 description 1
- 125000005480 straight-chain fatty acid group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22136284A JPS61101520A (ja) | 1984-10-23 | 1984-10-23 | 封止用樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22136284A JPS61101520A (ja) | 1984-10-23 | 1984-10-23 | 封止用樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61101520A true JPS61101520A (ja) | 1986-05-20 |
| JPS6261215B2 JPS6261215B2 (enrdf_load_stackoverflow) | 1987-12-21 |
Family
ID=16765600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22136284A Granted JPS61101520A (ja) | 1984-10-23 | 1984-10-23 | 封止用樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61101520A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62187994A (ja) * | 1986-12-19 | 1987-08-17 | 三洋電機株式会社 | 飲料供給装置 |
| JPH01272620A (ja) * | 1988-04-25 | 1989-10-31 | Hitachi Chem Co Ltd | 電子部品封止用エポキシ樹脂成形材料 |
| JP2008007562A (ja) * | 2006-06-27 | 2008-01-17 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いて得られた半導体装置 |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5454168A (en) * | 1977-10-07 | 1979-04-28 | Hitachi Ltd | Epoxy resin composition |
| JPS56129246A (en) * | 1980-03-17 | 1981-10-09 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPS56136816A (en) * | 1980-03-31 | 1981-10-26 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPS5869244A (ja) * | 1981-10-21 | 1983-04-25 | Toray Silicone Co Ltd | 成形用エポキシ樹脂組成物 |
| JPS5933319A (ja) * | 1982-08-20 | 1984-02-23 | Shin Etsu Chem Co Ltd | 難燃性エポキシ樹脂組成物 |
| JPS6013841A (ja) * | 1983-07-04 | 1985-01-24 | Toray Silicone Co Ltd | 成形用エポキシ樹脂組成物 |
| JPS6058425A (ja) * | 1983-09-07 | 1985-04-04 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| JPS6173275A (ja) * | 1984-09-17 | 1986-04-15 | Pioneer Electronic Corp | 記録デイスク情報再生装置 |
| JPS6173725A (ja) * | 1984-09-20 | 1986-04-15 | Denki Kagaku Kogyo Kk | エポキシ樹脂組成物 |
-
1984
- 1984-10-23 JP JP22136284A patent/JPS61101520A/ja active Granted
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5454168A (en) * | 1977-10-07 | 1979-04-28 | Hitachi Ltd | Epoxy resin composition |
| JPS56129246A (en) * | 1980-03-17 | 1981-10-09 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPS56136816A (en) * | 1980-03-31 | 1981-10-26 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
| JPS5869244A (ja) * | 1981-10-21 | 1983-04-25 | Toray Silicone Co Ltd | 成形用エポキシ樹脂組成物 |
| JPS5933319A (ja) * | 1982-08-20 | 1984-02-23 | Shin Etsu Chem Co Ltd | 難燃性エポキシ樹脂組成物 |
| JPS6013841A (ja) * | 1983-07-04 | 1985-01-24 | Toray Silicone Co Ltd | 成形用エポキシ樹脂組成物 |
| JPS6058425A (ja) * | 1983-09-07 | 1985-04-04 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
| JPS6173275A (ja) * | 1984-09-17 | 1986-04-15 | Pioneer Electronic Corp | 記録デイスク情報再生装置 |
| JPS6173725A (ja) * | 1984-09-20 | 1986-04-15 | Denki Kagaku Kogyo Kk | エポキシ樹脂組成物 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62187994A (ja) * | 1986-12-19 | 1987-08-17 | 三洋電機株式会社 | 飲料供給装置 |
| JPH01272620A (ja) * | 1988-04-25 | 1989-10-31 | Hitachi Chem Co Ltd | 電子部品封止用エポキシ樹脂成形材料 |
| JP2008007562A (ja) * | 2006-06-27 | 2008-01-17 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびそれを用いて得られた半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6261215B2 (enrdf_load_stackoverflow) | 1987-12-21 |
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