JPS609891A - 銅の電着方法 - Google Patents

銅の電着方法

Info

Publication number
JPS609891A
JPS609891A JP59119716A JP11971684A JPS609891A JP S609891 A JPS609891 A JP S609891A JP 59119716 A JP59119716 A JP 59119716A JP 11971684 A JP11971684 A JP 11971684A JP S609891 A JPS609891 A JP S609891A
Authority
JP
Japan
Prior art keywords
copper
copper plating
substrate
electrodeposition
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59119716A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6112037B2 (fr
Inventor
ダニエル・ジエイ・コウムス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of JPS609891A publication Critical patent/JPS609891A/ja
Publication of JPS6112037B2 publication Critical patent/JPS6112037B2/ja
Granted legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP59119716A 1983-06-10 1984-06-11 銅の電着方法 Granted JPS609891A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50121283A 1983-06-10 1983-06-10
US501212 1983-06-10

Publications (2)

Publication Number Publication Date
JPS609891A true JPS609891A (ja) 1985-01-18
JPS6112037B2 JPS6112037B2 (fr) 1986-04-05

Family

ID=23992566

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59119716A Granted JPS609891A (ja) 1983-06-10 1984-06-11 銅の電着方法

Country Status (10)

Country Link
JP (1) JPS609891A (fr)
AU (1) AU559896B2 (fr)
BR (1) BR8402812A (fr)
CA (1) CA1255622A (fr)
DE (1) DE3421017A1 (fr)
ES (1) ES533253A0 (fr)
FR (1) FR2547836A1 (fr)
GB (1) GB2141141B (fr)
IT (1) IT1177790B (fr)
NL (1) NL8401842A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006009079A (ja) * 2004-06-25 2006-01-12 Hitachi Ltd プリント配線板の製造方法

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7556722B2 (en) 1996-11-22 2009-07-07 Metzger Hubert F Electroplating apparatus
US8298395B2 (en) 1999-06-30 2012-10-30 Chema Technology, Inc. Electroplating apparatus
DE10261852B3 (de) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
PL1969160T3 (pl) * 2006-01-06 2011-09-30 Enthone Incorporated Elektrolit i sposób osadzania matowej warstwy metalu
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (fr) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
DE2028803C3 (de) * 1970-06-06 1980-08-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Polymere Phenazoniumverbindungen
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
GB1526076A (en) * 1975-03-11 1978-09-27 Oxy Metal Industries Corp Electrodeposition of copper
CA1105045A (fr) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Traduction non-disponible
DE2746938A1 (de) * 1977-10-17 1979-04-19 Schering Ag Saures galvanisches kupferbad
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006009079A (ja) * 2004-06-25 2006-01-12 Hitachi Ltd プリント配線板の製造方法
JP4644447B2 (ja) * 2004-06-25 2011-03-02 株式会社日立製作所 プリント配線板の製造方法

Also Published As

Publication number Publication date
BR8402812A (pt) 1985-05-21
CA1255622A (fr) 1989-06-13
IT1177790B (it) 1987-08-26
GB2141141B (en) 1987-01-07
DE3421017A1 (de) 1984-12-13
DE3421017C2 (fr) 1987-08-27
AU2903484A (en) 1984-12-13
AU559896B2 (en) 1987-03-26
GB2141141A (en) 1984-12-12
ES8601337A1 (es) 1985-10-16
FR2547836A1 (fr) 1984-12-28
IT8448356A0 (it) 1984-06-08
JPS6112037B2 (fr) 1986-04-05
ES533253A0 (es) 1985-10-16
GB8414863D0 (en) 1984-07-18
NL8401842A (nl) 1985-01-02

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