AU559896B2 - Electrolytic copper depositing processes - Google Patents

Electrolytic copper depositing processes

Info

Publication number
AU559896B2
AU559896B2 AU29034/84A AU2903484A AU559896B2 AU 559896 B2 AU559896 B2 AU 559896B2 AU 29034/84 A AU29034/84 A AU 29034/84A AU 2903484 A AU2903484 A AU 2903484A AU 559896 B2 AU559896 B2 AU 559896B2
Authority
AU
Australia
Prior art keywords
electrolytic copper
depositing processes
copper depositing
processes
electrolytic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU29034/84A
Other languages
English (en)
Other versions
AU2903484A (en
Inventor
Daniel J. Combs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of AU2903484A publication Critical patent/AU2903484A/en
Application granted granted Critical
Publication of AU559896B2 publication Critical patent/AU559896B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU29034/84A 1983-06-10 1984-06-04 Electrolytic copper depositing processes Ceased AU559896B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50121283A 1983-06-10 1983-06-10
US501212 1983-06-10

Publications (2)

Publication Number Publication Date
AU2903484A AU2903484A (en) 1984-12-13
AU559896B2 true AU559896B2 (en) 1987-03-26

Family

ID=23992566

Family Applications (1)

Application Number Title Priority Date Filing Date
AU29034/84A Ceased AU559896B2 (en) 1983-06-10 1984-06-04 Electrolytic copper depositing processes

Country Status (10)

Country Link
JP (1) JPS609891A (fr)
AU (1) AU559896B2 (fr)
BR (1) BR8402812A (fr)
CA (1) CA1255622A (fr)
DE (1) DE3421017A1 (fr)
ES (1) ES8601337A1 (fr)
FR (1) FR2547836A1 (fr)
GB (1) GB2141141B (fr)
IT (1) IT1177790B (fr)
NL (1) NL8401842A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7556722B2 (en) 1996-11-22 2009-07-07 Metzger Hubert F Electroplating apparatus
US8298395B2 (en) 1999-06-30 2012-10-30 Chema Technology, Inc. Electroplating apparatus
DE10261852B3 (de) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
JP4644447B2 (ja) * 2004-06-25 2011-03-02 株式会社日立製作所 プリント配線板の製造方法
ES2361500T3 (es) * 2006-01-06 2011-06-17 Enthone, Incorporated Electrolíto y procedimiento para la precipitación de una capa metálica mate.
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (fr) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
ZA708430B (en) * 1970-02-12 1971-09-29 Udylite Corp Electrodeposition of copper from acidic baths
DE2028803C3 (de) * 1970-06-06 1980-08-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Polymere Phenazoniumverbindungen
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
NL7510771A (nl) * 1975-03-11 1976-09-14 Oxy Metal Industries Corp Werkwijze voor het elektrolytisch neerslaan van koper uit waterige zure galvaniseerbaden.
CA1105045A (fr) * 1977-05-04 1981-07-14 Hans G. Creutz (Deceased) Traduction non-disponible
DE2746938A1 (de) * 1977-10-17 1979-04-19 Schering Ag Saures galvanisches kupferbad
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
GB2141141B (en) 1987-01-07
DE3421017A1 (de) 1984-12-13
GB8414863D0 (en) 1984-07-18
AU2903484A (en) 1984-12-13
JPS6112037B2 (fr) 1986-04-05
ES533253A0 (es) 1985-10-16
CA1255622A (fr) 1989-06-13
IT1177790B (it) 1987-08-26
DE3421017C2 (fr) 1987-08-27
NL8401842A (nl) 1985-01-02
FR2547836A1 (fr) 1984-12-28
JPS609891A (ja) 1985-01-18
ES8601337A1 (es) 1985-10-16
IT8448356A0 (it) 1984-06-08
GB2141141A (en) 1984-12-12
BR8402812A (pt) 1985-05-21

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