GB8418549D0 - Deposition - Google Patents

Deposition

Info

Publication number
GB8418549D0
GB8418549D0 GB848418549A GB8418549A GB8418549D0 GB 8418549 D0 GB8418549 D0 GB 8418549D0 GB 848418549 A GB848418549 A GB 848418549A GB 8418549 A GB8418549 A GB 8418549A GB 8418549 D0 GB8418549 D0 GB 8418549D0
Authority
GB
United Kingdom
Prior art keywords
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB848418549A
Other versions
GB2143853A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre Suisse dElectronique et Microtechnique SA CSEM
Original Assignee
Laboratoire Suisse de Recherches Horlogeres
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laboratoire Suisse de Recherches Horlogeres filed Critical Laboratoire Suisse de Recherches Horlogeres
Publication of GB8418549D0 publication Critical patent/GB8418549D0/en
Publication of GB2143853A publication Critical patent/GB2143853A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
GB08418549A 1983-07-21 1984-07-20 Deposition Withdrawn GB2143853A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH3992/83A CH656401A5 (en) 1983-07-21 1983-07-21 METHOD FOR ELECTRICALLY DEPOSITING METALS.

Publications (2)

Publication Number Publication Date
GB8418549D0 true GB8418549D0 (en) 1984-08-22
GB2143853A GB2143853A (en) 1985-02-20

Family

ID=4267786

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08418549A Withdrawn GB2143853A (en) 1983-07-21 1984-07-20 Deposition

Country Status (7)

Country Link
JP (1) JPS6026668A (en)
AT (1) ATA179684A (en)
CH (1) CH656401A5 (en)
DE (1) DE3422731A1 (en)
FR (1) FR2549497A1 (en)
GB (1) GB2143853A (en)
IT (1) IT1177814B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
JP4636236B2 (en) * 2003-10-16 2011-02-23 Ｊｓｒ株式会社 Composition for forming silicon / cobalt film and method for forming silicon / cobalt film
KR101064799B1 (en) * 2003-10-16 2011-09-14 제이에스알 가부시끼가이샤 Composition for forming silicon-cobalt film, silicon-cobalt film and method for forming same
AT500782B8 (en) * 2004-11-19 2007-02-15 Plansee Se METHOD FOR SEPARATING LAYERS FROM IONIC LIQUIDS

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635761A (en) * 1970-05-05 1972-01-18 Mobil Oil Corp Electroless deposition of metals
FR2264892B2 (en) * 1972-04-24 1976-12-17 Rhone Poulenc Textile
FR2196394A1 (en) * 1972-08-19 1974-03-15 Metallgesellschaft Ag Plating inner walls of chemical appts - by chemical reduction or organo-metal cpds dissolved in hydrocarbons
AT322940B (en) * 1972-10-31 1975-06-10 Siemens Ag BATHROOMS FOR ELECTRICALLY NICKEL-PLATING METAL, PLASTIC AND CERAMICS
FR2239539B1 (en) * 1973-08-01 1976-04-30 Rhone Poulenc Textile
US3993491A (en) * 1973-12-07 1976-11-23 Surface Technology, Inc. Electroless plating
DE2409251C3 (en) * 1974-02-22 1979-03-15 Kollmorgen Corp., Hartford, Conn. (V.St.A.) Process for the catalytic seeding of non-metallic surfaces for a subsequent, electroless metallization and bath solutions for carrying out the process
US3993799A (en) * 1974-10-04 1976-11-23 Surface Technology, Inc. Electroless plating process employing non-noble metal hydrous oxide catalyst
GB1468973A (en) * 1975-07-18 1977-03-30 Atomic Energy Authority Uk Microcircuit packages
GB1473223A (en) * 1975-09-04 1977-05-11 Welwyn Electric Ltd Circuit board blanks
US4265943A (en) * 1978-11-27 1981-05-05 Macdermid Incorporated Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating

Also Published As

Publication number Publication date
GB2143853A (en) 1985-02-20
JPS6026668A (en) 1985-02-09
CH656401A5 (en) 1986-06-30
IT1177814B (en) 1987-08-26
DE3422731A1 (en) 1985-01-31
IT8448429A0 (en) 1984-06-20
ATA179684A (en) 1986-12-15
FR2549497A1 (en) 1985-01-25

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)