ATA179684A - METHOD FOR ELECTRICALLY DEPOSITING METALS - Google Patents

METHOD FOR ELECTRICALLY DEPOSITING METALS

Info

Publication number
ATA179684A
ATA179684A AT841796A AT179684A ATA179684A AT A179684 A ATA179684 A AT A179684A AT 841796 A AT841796 A AT 841796A AT 179684 A AT179684 A AT 179684A AT A179684 A ATA179684 A AT A179684A
Authority
AT
Austria
Prior art keywords
depositing metals
electrically depositing
electrically
metals
depositing
Prior art date
Application number
AT841796A
Other languages
German (de)
Original Assignee
Suisse Horlogerie Rech Lab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suisse Horlogerie Rech Lab filed Critical Suisse Horlogerie Rech Lab
Publication of ATA179684A publication Critical patent/ATA179684A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
AT841796A 1983-07-21 1984-05-30 METHOD FOR ELECTRICALLY DEPOSITING METALS ATA179684A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH3992/83A CH656401A5 (en) 1983-07-21 1983-07-21 METHOD FOR ELECTRICALLY DEPOSITING METALS.

Publications (1)

Publication Number Publication Date
ATA179684A true ATA179684A (en) 1986-12-15

Family

ID=4267786

Family Applications (1)

Application Number Title Priority Date Filing Date
AT841796A ATA179684A (en) 1983-07-21 1984-05-30 METHOD FOR ELECTRICALLY DEPOSITING METALS

Country Status (7)

Country Link
JP (1) JPS6026668A (en)
AT (1) ATA179684A (en)
CH (1) CH656401A5 (en)
DE (1) DE3422731A1 (en)
FR (1) FR2549497A1 (en)
GB (1) GB2143853A (en)
IT (1) IT1177814B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5242713A (en) * 1988-12-23 1993-09-07 International Business Machines Corporation Method for conditioning an organic polymeric material
US5318803A (en) * 1990-11-13 1994-06-07 International Business Machines Corporation Conditioning of a substrate for electroless plating thereon
JP4636236B2 (en) * 2003-10-16 2011-02-23 Ｊｓｒ株式会社 Composition for forming silicon / cobalt film and method for forming silicon / cobalt film
CN100423199C (en) * 2003-10-16 2008-10-01 Jsr株式会社 Composition for forming silicon-cobalt film, silicon-cobalt film, and forming method therefor
AT500782B8 (en) * 2004-11-19 2007-02-15 Plansee Se METHOD FOR SEPARATING LAYERS FROM IONIC LIQUIDS

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635761A (en) * 1970-05-05 1972-01-18 Mobil Oil Corp Electroless deposition of metals
FR2264892B2 (en) * 1972-04-24 1976-12-17 Rhone Poulenc Textile
FR2196394A1 (en) * 1972-08-19 1974-03-15 Metallgesellschaft Ag Plating inner walls of chemical appts - by chemical reduction or organo-metal cpds dissolved in hydrocarbons
AT322940B (en) * 1972-10-31 1975-06-10 Siemens Ag BATHROOMS FOR ELECTRICALLY NICKEL-PLATING METAL, PLASTIC AND CERAMICS
FR2239539B1 (en) * 1973-08-01 1976-04-30 Rhone Poulenc Textile
US3993491A (en) * 1973-12-07 1976-11-23 Surface Technology, Inc. Electroless plating
DE2409251C3 (en) * 1974-02-22 1979-03-15 Kollmorgen Corp., Hartford, Conn. (V.St.A.) Process for the catalytic seeding of non-metallic surfaces for a subsequent, electroless metallization and bath solutions for carrying out the process
US3993799A (en) * 1974-10-04 1976-11-23 Surface Technology, Inc. Electroless plating process employing non-noble metal hydrous oxide catalyst
GB1468973A (en) * 1975-07-18 1977-03-30 Atomic Energy Authority Uk Microcircuit packages
GB1473223A (en) * 1975-09-04 1977-05-11 Welwyn Electric Ltd Circuit board blanks
US4265943A (en) * 1978-11-27 1981-05-05 Macdermid Incorporated Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating

Also Published As

Publication number Publication date
JPS6026668A (en) 1985-02-09
FR2549497A1 (en) 1985-01-25
IT8448429A0 (en) 1984-06-20
GB8418549D0 (en) 1984-08-22
GB2143853A (en) 1985-02-20
IT1177814B (en) 1987-08-26
DE3422731A1 (en) 1985-01-31
CH656401A5 (en) 1986-06-30

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Legal Events

Date Code Title Description
A1J Withdrawal paragraph 166 lit. 6
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee