JPS6097629A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6097629A
JPS6097629A JP20481083A JP20481083A JPS6097629A JP S6097629 A JPS6097629 A JP S6097629A JP 20481083 A JP20481083 A JP 20481083A JP 20481083 A JP20481083 A JP 20481083A JP S6097629 A JPS6097629 A JP S6097629A
Authority
JP
Japan
Prior art keywords
pellet
gel
substrate
semiconductor device
package base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20481083A
Other languages
English (en)
Inventor
Takashi Miwa
孝志 三輪
Kanji Otsuka
寛治 大塚
Atsushi Honda
厚 本多
Masayuki Shirai
優之 白井
Yasuyuki Yamazaki
康行 山崎
Ken Okuya
謙 奥谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP20481083A priority Critical patent/JPS6097629A/ja
Publication of JPS6097629A publication Critical patent/JPS6097629A/ja
Pending legal-status Critical Current

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    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 〔技術分野〕 本発明は、半導体装置に係り、特に、ＬＳＩ（旦°″°
　且°°１°工”°ゞｒ　ａ　ｔ　ｅ。
ｄ　Ｃ１ｒｃｕｉｔ）等の半導体素子を有するペレット
（以下、単にペレットという）を基板上に接着する技術
に適用して有効な技術に関するものである。
［背景技術〕 ＬＳＩ等のペレットを外部環境の悪条件、例えば、埃、
水蒸気、イオン等から保護するためにセラミックパッケ
ージが使用されているが、パッケージのコストを低減す
るためにガラスエポキシ樹脂等からなるパッケージが本
願出願人により開発されている（特願昭５７−１６２３
０号）。
このパッケージを用いた半導体装置は、ガラスエポキシ
樹脂等からなるパッケージのベース上の中央部に半導体
素子を有するペレット（以下、単にペレットという）を
適宜の接着剤で接着した後、ペレットとリードとをボン
ディングワイヤで電気的に接続したものである。
しかしながら、本発明者の検討によればこのようなパッ
ケージを用いた半導体装置では、次の問題があることが
わかった。すなわち、第１図に示すように、封止熱処理
、温度サイクル等の熱によってパッケージベース１が捩
れたり、湾曲したりして変形することがある。前記接着
剤として銀ぺ−スト２を用いると、銀ペースト２が弾性
の乏しい接着剤であるために前記のようにパッケージベ
ースｌが変形する。これによりペレット３に過大な応力
が加わり、ペレット３にクラック４を発生したり、ペレ
ット３がパッケージベース１から剥れたりする（第１図
の符号５で示す部分）欠点がある。
〔発明の目的〕
本発明の目的は、半導体装置において、基板にペレット
付を行う際に、基板が変形してもペレットに加わる応力
を低減させる技術を提供することにある。
本発明の前記ならびにその他の目的と新規な特徴は、本
明細書の記述及び添付図面によって明らかになるであろ
う。
〔発明の概要〕
本願において開示される発明のうち、代表的なものの概
要を説明すれば、下記のとおりである。
すなわち、ガラスエポキシ樹脂等からなる基板に弾性体
若しくはゲル状の接着剤でペレッ１〜を接着することに
より、前記基板が変形してもペレットに加わる応力を低
減し、ペレットのクラックや剥れを防止することである
。
〔実施例〕
第２図は、本発明の半導体装置の一実施例の構成を示す
断面図である。
第２図において、１０はガラスエポキシ樹脂等からなる
パッケージベース、１１はペレット、１２はペレット１
１をパッケージベース１ｏに取り付けるための弾性体若
しくはゲル状の接着剤である。この接着剤１２としては
、例えば、シリコンゴム又はシリコンゲル、フィラーを
添加して硬度を調整したフィラー人すシリコンゴム又は
フィラー人すシリコンゲルを使用する。１３はペレット
外部装置を電気的に接続するためのリード、１４はリー
ド１３とペレット１１とを電気的に接続するためのボン
ディングワイヤである。１５はペレット１１．ボンディ
ングワイヤ１４等を封止するゲル状シリコンレジン、１
６はゲル状シリコンレジン１５が流出しな’＆Ｎように
するためのダムである。１７はガラスエポキシ樹脂等か
らなるパッケージキャップであり、パッケージベース１
０に封止材によって接着される。
前記のように、本実施例は、パッケージベース１０とペ
レット１１をシリコンゴム又はシリコンゲル等の弾性体
若しくはゲル状の接着剤を使用して固定しているため１
例えば、基板となるパッケージベース１０が温度サイク
ル、熱処理時の熱によって、第３図に示すように変形し
たとすると、その変形させるのに加わった応力が、ペレ
ット１１に接着剤１２を介して加わることになる。この
とき、接着剤１２は弾性又は温性を有しているので、そ
の弾性又は温性によって前記応力を吸収して緩和するこ
とができる。
これにより、パッケージベース１０が変形しても、ペレ
ット１１はパッケージベース１０から剥れたり、ペレッ
ト１１にクラックを生じたりはしない。
また、ペレット１１とボンディングワイヤ１４を超音波
でワイヤボンディングを行っても、シリコンペレットの
重量で共振を防止することができ。
十分超音波ワイヤボンディングが可能である。これは、
実験によって問題のないことを確認している。
また、基板とペレット１１等の熱膨張係数の差は接着剤
１２に弾性を有しているので問題にする必要はない。
〔効果〕
以上説明したように、本願で開示した新規な技術手段に
よれば、次のような効果を得ることができる。
（１）基板とペレットを接着する接着剤として弾性体若
しくは、ゲル状接着剤を用いることにより、基板が変形
してもそれに伴う応力を緩和できるので、基板からペレ
ットが剥れたり、ペレットにクラックが生じるのを防止
できる。特に、これにより熱ストレス、機械的ストレス
により変形し易いガラスエポキシ基板を用いることがで
きるので、信頼性の高い半導体装置が安価に得られる。
（２）基板とペレットの間に弾性を有する接着剤を介在
しているので、半導体装置を誤まって落したりすること
等があっても、その衝撃によるペレットへの応力を緩和
することができる。
以上、本発明を実施例にもとすき具体的に説明したが、
本発明は、前記実施例に限定されるものでなく、その要
旨を逸脱しない範囲で変更可能であることはいうまでも
ない。たとえば、本発明は第２図に示したデュアルイン
ライン型のパッケージ以外でもリード付き又はリードの
ないチップキャリア型パッケージ、ピンクリッドアレイ
型パッケージ等種々のものに適用できる。
【図面の簡単な説明】
第１図は、プラチックパッケージを用いた半導体装置の
問題点を説明するための図、 第２図は、本発明の半導体装置の一実施例の構成を示す
図、 第３図は、第２図に示す実施例の作用を説明するための
図である。 ｌＯ・・・パッケージベース、１１・・・ペレット、１
２・・・弾性体若しくはゲル状の接着剤、１３・・・リ
ード、１４・・・ボンディングワイヤ、１５・・・ゲル
状シリコンレジン、１６・・・ダム、１７・・・パッケ
ージキャップ。

Claims (1)

  1. 【特許請求の範囲】 １、半導体素子を有するペレットを基板に弾性体若しく
    はゲル状の接着剤によって接着したことを特徴とする半
    導体装置。 ２、前記弾性を有する接着剤として、シリコンゲル、シ
    リコンゴム、フィラー人すシリコンゴム等を用いたこと
    を特徴とする特許請求の範囲第１項記載の半導体装置。 ３、前記基板はガラスエポキシ材料からなることを特徴
    とする特許請求の範囲第１項又は第２項に記載の半導体
    装置。
JP20481083A 1983-11-02 1983-11-02 半導体装置 Pending JPS6097629A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20481083A JPS6097629A (ja) 1983-11-02 1983-11-02 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20481083A JPS6097629A (ja) 1983-11-02 1983-11-02 半導体装置

Publications (1)

Publication Number Publication Date
JPS6097629A true JPS6097629A (ja) 1985-05-31

Family

ID=16496740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20481083A Pending JPS6097629A (ja) 1983-11-02 1983-11-02 半導体装置

Country Status (1)

Country Link
JP (1) JPS6097629A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS644029A (en) * 1987-06-26 1989-01-09 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS644029A (en) * 1987-06-26 1989-01-09 Hitachi Ltd Semiconductor device

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