JPS6095927A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6095927A
JPS6095927A JP58203984A JP20398483A JPS6095927A JP S6095927 A JPS6095927 A JP S6095927A JP 58203984 A JP58203984 A JP 58203984A JP 20398483 A JP20398483 A JP 20398483A JP S6095927 A JPS6095927 A JP S6095927A
Authority
JP
Japan
Prior art keywords
solder
semiconductor chip
chip
grooves
mesa
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58203984A
Other languages
English (en)
Inventor
Masanobu Shin
新　政信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58203984A priority Critical patent/JPS6095927A/ja
Publication of JPS6095927A publication Critical patent/JPS6095927A/ja
Pending legal-status Critical Current

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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 （発明の技術分野） 本発明はメサ型半導体装置の製造方法に関するものであ
る。
（従来技術） 従来、樹脂封止型半導体装置は、一般に次のように製造
されていた。
即ち、先ず第１図（Ａｌ　、　（Ｂ）　、　（Ｑに示す
如く、金属板を所定の形状に加工したリードフレーム１
のアイランド部１′に半田３を載せ、その上方から半導
体チップ２をあて、半導体チップ２に適当表荷重を与え
ることによって半導体チップ２を半田３にてアイランド
部１′に固定させ、半導体チップ２上の電極とリードフ
レーム１のリードとの間に全組ｗＭ４等によシ必畳な電
気接続を行なう。しかる後に第３図に示す如く樹脂８で
半導体チップ２および金細線４等を封止し、リードフレ
ーム固定板９しかしながら、このような従来の半導体装
置では、半導体チップ２１＆：、リードフレーム１に半
田３を用い固定させる際、第１図（Ｂ）　、　（Ｃ）に
示すようにある程度の荷重をチップ２に加える為、半導
体チップ２の断面５−への半田塵シ上シは避けられない
ことであった。半導体チップ２のメサ溝部はガラス６に
よシ保護がなされているが、半田３の量のバラツキ及び
半導体チップ２のセンターズレ並びに半導体チップ２の
取付は時の傾きによシメサ溝部のガラス保護膜６を通シ
越し半導体“チップ２のシリコン基板露出断面５にまで
半田３が付着し、半導体素子の特性歩留及び信頼性を著
しく低下させる原因になっている。
（本発明の目的） 従って、本発明の目的は、前記半導体チップのメサ溝へ
の半田盛上シを減少させ、特性歩留及び信頼性を大幅に
向上した半導体装置を提供することにある。
（発明の構成） 本発明によれば、リードフレームの半導体素子載置部に
は半導体素子の接触する部分の外周に溝を有し、この溝
内に囲まれた部分の＃１＃Ｘ全体に半導体素子を半田も
しくはロー材で取シ付けた半導体装置を得る。
（発明の実施例） 以下、本発明の一実施例について図面を用いて説明する
。第２図四、　（Ｂｌ　、　（Ｑおよび第３図、第４図
は本発明の一実施例の製造工程を示したもので、まず、
リードフレーム１１が作られる。リードフレーム１１は
金属板を打ち抜いて外部へ電極′ｆｔｓ出するリードと
半導体チップ１２を取９付けるアイランド１１′との組
を複数組固定板１９で一体化するように形成される。ア
イランド１１′では半導２図の）に示すように半田１３
ｔ−ＩＩ状溝１７の内側に載せその上に表裏両面がメサ
カットされメサカット部にガラスの保護被膜１６のなさ
れた半導体チップ１２を載せる。次に、第２図（ＣＪに
示すように、半導体チップ１２の上方から適当な荷重を
与えることによって、半導体チップ１２を環状溝１７の
内側に取シ付ける。この時、半田１３は半導体チップ１
２の下から外側に逃けるが、溝１７内に留る。このため
、半田１７が半導体チップ１２の側面にはい上ることは
ない。その後、第２図体）に示すように、半導体チップ
１２表面の電極とリード間が金細線１４等によって配線
がなされるの更に、第３図に示すよりに、半導体チップ
１２と金細線１４とを少くとも封止するように樹Ｗ！Ｉ
８がモールド等で暴君せられ、第４図に示すように、リ
ードフレーム１１の固定板１９が切断除去されて個々の
半導体装置１０に分離される。
このように、本実施例によれば、半導体チップ１２を取
シ付ける半田１３は溝１７内に逃げるので、半導体チッ
プ１２の側面には一上ることはなく素子特性の劣化がな
く信頼性の高い半導体装置を得ることができる。
【図面の簡単な説明】
第１口内は、従来のメサ型半導体装置の平面図、同図の
）および（Ｃ）は半導体チップを取シ付ける工程を示す
断面図である０第２図囚は、本発明の一実施例による半
導体装置の平面図、同図■）および（ｑは半導体チップ
を取シ付ける工程を示す断面図である。第３図社樹脂封
止工程後を示す平面図、第４口拡固定板切断後を示す平
面図である。 １．１１・・・・・・リードフレーム、”１’、１１’
・・・・・・アイランド、２，１２・・・・・・半導体
チップ、３．１３・・・・・・半田、４．１４・・・・
・・金細線、５・・・・・・半導体チップ側面、ら−１
ｇ・・・・・・ガラス侵Ｓ魔、７・・・・・・溝、８・
・・・・・樹脂、９・・・・・・フレーム固定板、１０
・・・・・・半導体装置Ｏ１、〜−−二′ 乃を閃 （Ａ） 第２国 ｖ、ｌγ

Claims (1)

    【特許請求の範囲】
  1. 半導体素子載置部には半導体素子の接触する部分の外周
    に溝を有し、この溝内に囲まれた部分に半導体素子を半
    田もしくはロー材で取シ付けたことを特徴とする半導体
    装置。
JP58203984A 1983-10-31 1983-10-31 半導体装置 Pending JPS6095927A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58203984A JPS6095927A (ja) 1983-10-31 1983-10-31 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58203984A JPS6095927A (ja) 1983-10-31 1983-10-31 半導体装置

Publications (1)

Publication Number Publication Date
JPS6095927A true JPS6095927A (ja) 1985-05-29

Family

ID=16482861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58203984A Pending JPS6095927A (ja) 1983-10-31 1983-10-31 半導体装置

Country Status (1)

Country Link
JP (1) JPS6095927A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019145743A (ja) * 2018-02-23 2019-08-29 日立オートモティブシステムズ株式会社 イグナイタ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019145743A (ja) * 2018-02-23 2019-08-29 日立オートモティブシステムズ株式会社 イグナイタ

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