JPS6092691A - フィルムベ−ス印刷配線板 - Google Patents

フィルムベ−ス印刷配線板

Info

Publication number
JPS6092691A
JPS6092691A JP58201618A JP20161883A JPS6092691A JP S6092691 A JPS6092691 A JP S6092691A JP 58201618 A JP58201618 A JP 58201618A JP 20161883 A JP20161883 A JP 20161883A JP S6092691 A JPS6092691 A JP S6092691A
Authority
JP
Japan
Prior art keywords
resin
resin layer
printing
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58201618A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0433154B2 (enExample
Inventor
瑛一 綱島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58201618A priority Critical patent/JPS6092691A/ja
Publication of JPS6092691A publication Critical patent/JPS6092691A/ja
Publication of JPH0433154B2 publication Critical patent/JPH0433154B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/90—
    • H10W72/283—
    • H10W90/754—

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Wire Bonding (AREA)
JP58201618A 1983-10-27 1983-10-27 フィルムベ−ス印刷配線板 Granted JPS6092691A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58201618A JPS6092691A (ja) 1983-10-27 1983-10-27 フィルムベ−ス印刷配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58201618A JPS6092691A (ja) 1983-10-27 1983-10-27 フィルムベ−ス印刷配線板

Publications (2)

Publication Number Publication Date
JPS6092691A true JPS6092691A (ja) 1985-05-24
JPH0433154B2 JPH0433154B2 (enExample) 1992-06-02

Family

ID=16444040

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58201618A Granted JPS6092691A (ja) 1983-10-27 1983-10-27 フィルムベ−ス印刷配線板

Country Status (1)

Country Link
JP (1) JPS6092691A (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49108564A (enExample) * 1973-02-20 1974-10-16
JPS51123241A (en) * 1975-04-18 1976-10-27 Matsushita Electric Ind Co Ltd Method of coating conductive material on insulators
JPS5348462A (en) * 1976-10-15 1978-05-01 Hitachi Ltd Wire bonding method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49108564A (enExample) * 1973-02-20 1974-10-16
JPS51123241A (en) * 1975-04-18 1976-10-27 Matsushita Electric Ind Co Ltd Method of coating conductive material on insulators
JPS5348462A (en) * 1976-10-15 1978-05-01 Hitachi Ltd Wire bonding method

Also Published As

Publication number Publication date
JPH0433154B2 (enExample) 1992-06-02

Similar Documents

Publication Publication Date Title
US6038133A (en) Circuit component built-in module and method for producing the same
KR100713333B1 (ko) 다층 이방성 도전 필름
WO2000049655A1 (fr) Dispositif a semi-conducteur, carte a circuit, procede de fabrication de carte a circuit et dispositif electronique
US6013417A (en) Process for fabricating circuitry on substrates having plated through-holes
JP3560996B2 (ja) 実装用配線板およびこれを用いた実装方法
JPS6092691A (ja) フィルムベ−ス印刷配線板
JPH0345909B2 (enExample)
JPS6092690A (ja) ガラスエポキシベ−ス印刷配線板
JPS60120588A (ja) 印刷配線板
JP4181239B2 (ja) 接続部材
JPH1146056A (ja) 電子部品装置
JPH01232792A (ja) 回路基板
JPS60165790A (ja) 電子回路基板の製造方法
JP2001068815A (ja) 配線板とその製造方法
JPH091969A (ja) Ｉｃカード及びその製造方法
JP2007191674A (ja) 配線付き接着剤
JPS6346592B2 (enExample)
JP3016923B2 (ja) 導体回路板の製造方法
JPS6293993A (ja) 電子回路装置とその実装方法
JPH02304945A (ja) 半導体素子の実装方法
JPS6255883A (ja) 電気的接続方法
JPS63305592A (ja) プリント配線基板の製法
JPH10219213A (ja) 導電性接着剤および回路基板に電気部品を実装する方法
JPH0923054A (ja) プリント配線板の製造方法
JPH05297398A (ja) 電極接続構造