JPH0433154B2 - - Google Patents
Info
- Publication number
- JPH0433154B2 JPH0433154B2 JP58201618A JP20161883A JPH0433154B2 JP H0433154 B2 JPH0433154 B2 JP H0433154B2 JP 58201618 A JP58201618 A JP 58201618A JP 20161883 A JP20161883 A JP 20161883A JP H0433154 B2 JPH0433154 B2 JP H0433154B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin layer
- paste
- curing
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W72/90—
-
- H10W72/283—
-
- H10W90/754—
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58201618A JPS6092691A (ja) | 1983-10-27 | 1983-10-27 | フィルムベ−ス印刷配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58201618A JPS6092691A (ja) | 1983-10-27 | 1983-10-27 | フィルムベ−ス印刷配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6092691A JPS6092691A (ja) | 1985-05-24 |
| JPH0433154B2 true JPH0433154B2 (enExample) | 1992-06-02 |
Family
ID=16444040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58201618A Granted JPS6092691A (ja) | 1983-10-27 | 1983-10-27 | フィルムベ−ス印刷配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6092691A (enExample) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49108564A (enExample) * | 1973-02-20 | 1974-10-16 | ||
| JPS51123241A (en) * | 1975-04-18 | 1976-10-27 | Matsushita Electric Ind Co Ltd | Method of coating conductive material on insulators |
| JPS5348462A (en) * | 1976-10-15 | 1978-05-01 | Hitachi Ltd | Wire bonding method |
-
1983
- 1983-10-27 JP JP58201618A patent/JPS6092691A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6092691A (ja) | 1985-05-24 |
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