JPS6091656A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS6091656A
JPS6091656A JP58199369A JP19936983A JPS6091656A JP S6091656 A JPS6091656 A JP S6091656A JP 58199369 A JP58199369 A JP 58199369A JP 19936983 A JP19936983 A JP 19936983A JP S6091656 A JPS6091656 A JP S6091656A
Authority
JP
Japan
Prior art keywords
metal
semiconductor element
electrode
bonding
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58199369A
Other languages
English (en)
Japanese (ja)
Other versions
JPS644342B2 (enrdf_load_stackoverflow
Inventor
Kenzo Hatada
畑田　賢造
Minoru Hirai
平井　稔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58199369A priority Critical patent/JPS6091656A/ja
Publication of JPS6091656A publication Critical patent/JPS6091656A/ja
Publication of JPS644342B2 publication Critical patent/JPS644342B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58199369A 1983-10-25 1983-10-25 半導体装置の製造方法 Granted JPS6091656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58199369A JPS6091656A (ja) 1983-10-25 1983-10-25 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58199369A JPS6091656A (ja) 1983-10-25 1983-10-25 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6091656A true JPS6091656A (ja) 1985-05-23
JPS644342B2 JPS644342B2 (enrdf_load_stackoverflow) 1989-01-25

Family

ID=16406607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58199369A Granted JPS6091656A (ja) 1983-10-25 1983-10-25 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6091656A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6290937A (ja) * 1985-10-17 1987-04-25 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH01146337A (ja) * 1987-12-03 1989-06-08 Matsushita Electric Ind Co Ltd 半導体の組立方法
US5456003A (en) * 1992-06-18 1995-10-10 Matsushita Electric Industrial Co., Ltd. Method for packaging a semiconductor device having projected electrodes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6290937A (ja) * 1985-10-17 1987-04-25 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JPH01146337A (ja) * 1987-12-03 1989-06-08 Matsushita Electric Ind Co Ltd 半導体の組立方法
US5456003A (en) * 1992-06-18 1995-10-10 Matsushita Electric Industrial Co., Ltd. Method for packaging a semiconductor device having projected electrodes

Also Published As

Publication number Publication date
JPS644342B2 (enrdf_load_stackoverflow) 1989-01-25

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