JPS6089944A - 立体配線の形成方法 - Google Patents
立体配線の形成方法Info
- Publication number
- JPS6089944A JPS6089944A JP19859483A JP19859483A JPS6089944A JP S6089944 A JPS6089944 A JP S6089944A JP 19859483 A JP19859483 A JP 19859483A JP 19859483 A JP19859483 A JP 19859483A JP S6089944 A JPS6089944 A JP S6089944A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- wiring
- power supply
- forming
- photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 abstract description 12
- 229910052751 metal Inorganic materials 0.000 abstract description 12
- 125000006850 spacer group Chemical group 0.000 abstract description 8
- 238000007747 plating Methods 0.000 abstract description 4
- 238000000059 patterning Methods 0.000 abstract description 3
- 238000000206 photolithography Methods 0.000 abstract description 2
- 238000000992 sputter etching Methods 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000005530 etching Methods 0.000 description 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 239000010931 gold Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19859483A JPS6089944A (ja) | 1983-10-24 | 1983-10-24 | 立体配線の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19859483A JPS6089944A (ja) | 1983-10-24 | 1983-10-24 | 立体配線の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6089944A true JPS6089944A (ja) | 1985-05-20 |
| JPH0226386B2 JPH0226386B2 (enrdf_load_stackoverflow) | 1990-06-08 |
Family
ID=16393780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19859483A Granted JPS6089944A (ja) | 1983-10-24 | 1983-10-24 | 立体配線の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6089944A (enrdf_load_stackoverflow) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54115065A (en) * | 1978-02-28 | 1979-09-07 | Mitsubishi Electric Corp | Semiconductor device |
-
1983
- 1983-10-24 JP JP19859483A patent/JPS6089944A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54115065A (en) * | 1978-02-28 | 1979-09-07 | Mitsubishi Electric Corp | Semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0226386B2 (enrdf_load_stackoverflow) | 1990-06-08 |
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