JPS607741A - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS607741A
JPS607741A JP58115513A JP11551383A JPS607741A JP S607741 A JPS607741 A JP S607741A JP 58115513 A JP58115513 A JP 58115513A JP 11551383 A JP11551383 A JP 11551383A JP S607741 A JPS607741 A JP S607741A
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit device
resin container
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58115513A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0354470B2 (Sortimente
Inventor
Yoshiaki Matsumae
松前　義昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP58115513A priority Critical patent/JPS607741A/ja
Publication of JPS607741A publication Critical patent/JPS607741A/ja
Publication of JPH0354470B2 publication Critical patent/JPH0354470B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP58115513A 1983-06-27 1983-06-27 混成集積回路装置 Granted JPS607741A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58115513A JPS607741A (ja) 1983-06-27 1983-06-27 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58115513A JPS607741A (ja) 1983-06-27 1983-06-27 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS607741A true JPS607741A (ja) 1985-01-16
JPH0354470B2 JPH0354470B2 (Sortimente) 1991-08-20

Family

ID=14664378

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58115513A Granted JPS607741A (ja) 1983-06-27 1983-06-27 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS607741A (Sortimente)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0209642A3 (en) * 1985-07-25 1987-04-15 Hewlett-Packard Company Ceramic microcircuit package
US5791164A (en) * 1996-06-17 1998-08-11 Milliken Research Corporation Outdoor sporting fabric
US7002803B2 (en) 2002-02-27 2006-02-21 Nec Compound Semiconductor Devices, Ltd. Electronic product with heat radiating plate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6692700B2 (en) 2001-02-14 2004-02-17 Handylab, Inc. Heat-reduction methods and systems related to microfluidic devices

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0209642A3 (en) * 1985-07-25 1987-04-15 Hewlett-Packard Company Ceramic microcircuit package
US5791164A (en) * 1996-06-17 1998-08-11 Milliken Research Corporation Outdoor sporting fabric
US7002803B2 (en) 2002-02-27 2006-02-21 Nec Compound Semiconductor Devices, Ltd. Electronic product with heat radiating plate

Also Published As

Publication number Publication date
JPH0354470B2 (Sortimente) 1991-08-20

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