JPS6059747A - 半導体ウエ−ハの処理装置 - Google Patents
半導体ウエ−ハの処理装置Info
- Publication number
- JPS6059747A JPS6059747A JP16958383A JP16958383A JPS6059747A JP S6059747 A JPS6059747 A JP S6059747A JP 16958383 A JP16958383 A JP 16958383A JP 16958383 A JP16958383 A JP 16958383A JP S6059747 A JPS6059747 A JP S6059747A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- cassette
- wafer
- receiving
- rotating frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims description 41
- 235000012431 wafers Nutrition 0.000 claims abstract description 107
- 238000005406 washing Methods 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000012545 processing Methods 0.000 claims description 22
- 210000000078 claw Anatomy 0.000 claims description 19
- 230000018044 dehydration Effects 0.000 claims description 9
- 238000006297 dehydration reaction Methods 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 6
- 230000000737 periodic effect Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 12
- 208000005156 Dehydration Diseases 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 238000001035 drying Methods 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 241001330002 Bambuseae Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 238000012993 chemical processing Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 210000000936 intestine Anatomy 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16958383A JPS6059747A (ja) | 1983-09-12 | 1983-09-12 | 半導体ウエ−ハの処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16958383A JPS6059747A (ja) | 1983-09-12 | 1983-09-12 | 半導体ウエ−ハの処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6059747A true JPS6059747A (ja) | 1985-04-06 |
| JPS633455B2 JPS633455B2 (enrdf_load_stackoverflow) | 1988-01-23 |
Family
ID=15889166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16958383A Granted JPS6059747A (ja) | 1983-09-12 | 1983-09-12 | 半導体ウエ−ハの処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6059747A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6327025A (ja) * | 1986-07-18 | 1988-02-04 | Nec Kansai Ltd | 半導体ウエ−ハの洗浄方法 |
| JPH01104022U (enrdf_load_stackoverflow) * | 1987-12-28 | 1989-07-13 | ||
| CN111092036A (zh) * | 2020-03-23 | 2020-05-01 | 杭州众硅电子科技有限公司 | 一种晶圆清洗干燥装置 |
-
1983
- 1983-09-12 JP JP16958383A patent/JPS6059747A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6327025A (ja) * | 1986-07-18 | 1988-02-04 | Nec Kansai Ltd | 半導体ウエ−ハの洗浄方法 |
| JPH01104022U (enrdf_load_stackoverflow) * | 1987-12-28 | 1989-07-13 | ||
| CN111092036A (zh) * | 2020-03-23 | 2020-05-01 | 杭州众硅电子科技有限公司 | 一种晶圆清洗干燥装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS633455B2 (enrdf_load_stackoverflow) | 1988-01-23 |
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