JPS6057139U - 集積回路チツプ冷却装置 - Google Patents

集積回路チツプ冷却装置

Info

Publication number
JPS6057139U
JPS6057139U JP921984U JP921984U JPS6057139U JP S6057139 U JPS6057139 U JP S6057139U JP 921984 U JP921984 U JP 921984U JP 921984 U JP921984 U JP 921984U JP S6057139 U JPS6057139 U JP S6057139U
Authority
JP
Japan
Prior art keywords
integrated circuit
film
circuit chip
cooling equipment
chip cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP921984U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0135484Y2 (enrdf_load_stackoverflow
Inventor
フアクイアー・シー・ミツタル
チヤールス・アール・ソリス
Original Assignee
スペリー・コーポレーシヨン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スペリー・コーポレーシヨン filed Critical スペリー・コーポレーシヨン
Publication of JPS6057139U publication Critical patent/JPS6057139U/ja
Application granted granted Critical
Publication of JPH0135484Y2 publication Critical patent/JPH0135484Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP921984U 1983-02-07 1984-01-27 集積回路チツプ冷却装置 Granted JPS6057139U (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46429483A 1983-02-07 1983-02-07
US464294 1983-02-07

Publications (2)

Publication Number Publication Date
JPS6057139U true JPS6057139U (ja) 1985-04-20
JPH0135484Y2 JPH0135484Y2 (enrdf_load_stackoverflow) 1989-10-30

Family

ID=23843332

Family Applications (1)

Application Number Title Priority Date Filing Date
JP921984U Granted JPS6057139U (ja) 1983-02-07 1984-01-27 集積回路チツプ冷却装置

Country Status (3)

Country Link
JP (1) JPS6057139U (enrdf_load_stackoverflow)
CA (1) CA1203640A (enrdf_load_stackoverflow)
DE (1) DE3404027A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002314281A (ja) * 2001-04-16 2002-10-25 Hitachi Ltd 冷却水路を備えた電気装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4312057A1 (de) * 1993-04-13 1993-10-14 Siegmund Maettig Vorrichtung zum Kühlen hochintegrierter Multi-Chip-Moduls für Datenverarbeitungsanlagen mit hoher Rechnerleistung
US7187545B2 (en) 2002-05-22 2007-03-06 Siemens Aktiengesellschaft Cooling devices for cooling electric components, module including cooling device and electric components, and assembly of cooling device or module and support

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002314281A (ja) * 2001-04-16 2002-10-25 Hitachi Ltd 冷却水路を備えた電気装置

Also Published As

Publication number Publication date
DE3404027A1 (de) 1984-08-16
CA1203640A (en) 1986-04-22
JPH0135484Y2 (enrdf_load_stackoverflow) 1989-10-30

Similar Documents

Publication Publication Date Title
JPS6057139U (ja) 集積回路チツプ冷却装置
JPS58188684U (ja) 電子表示装置
JPS5887340U (ja) 半導体装置の製造装置
JPS6134750U (ja) 半導体装置
JPS5846460U (ja) 混成集積回路装置
JPS6045494U (ja) 混成集積回路装置
JPS6052656U (ja) 回路基板
JPS6127255U (ja) ボンデイングパツドに表示を付けた半導体素子
JPS58189593U (ja) 回路素子集合体
JPS5978637U (ja) 混成集積回路装置
JPS5967943U (ja) 半導体素子の冷却構造
JPS5812955U (ja) 樹脂封止半導体装置
JPS6054331U (ja) 半導体装置の実装基板
JPS58182435U (ja) 半導体素子の外付け端子構造
JPS6170938U (enrdf_load_stackoverflow)
JPS60109354U (ja) 混成集積回路装置
JPS5866650U (ja) 集積回路素子冷却装置
JPS6138954U (ja) 半導体装置
JPS58133940U (ja) 電子機器の放熱装置
JPS5942982U (ja) 半導体パツケ−ジ試験用基板
JPS5954951U (ja) 半導体装置
JPS58168134U (ja) 加圧接触型半導体装置
JPS59164238U (ja) 混成集積回路装置
JPS60144245U (ja) 半導体装置
JPS59117161U (ja) 半導体装置