CA1203640A - Apparatus for cooling integrated circuit chips - Google Patents
Apparatus for cooling integrated circuit chipsInfo
- Publication number
- CA1203640A CA1203640A CA000428435A CA428435A CA1203640A CA 1203640 A CA1203640 A CA 1203640A CA 000428435 A CA000428435 A CA 000428435A CA 428435 A CA428435 A CA 428435A CA 1203640 A CA1203640 A CA 1203640A
- Authority
- CA
- Canada
- Prior art keywords
- film
- contact
- paste
- integrated circuit
- mat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Abstract of the Disclosure The invention is intended to cool integrated circuit packages carried on substrates. As is known, to achieve such cooling, the substrates are mounted to a cold plate via a compliant mat acting as interface. In the invention the mat comprises a paste film in contact with the cold plate, a metallic film in contact with the paste and a third film in contact with the metallic film. Both the paste and the third film are heat conductive and electrically insulative. The metallic film acts to spread the heat generated by the circuit packages more uniformly. To render the mat more compliant the metallic film is etched to remove portions leaving an array of contact pads in respective alignment with the circuit packages. The contact pads of the array may be interconnected by unetched branch portions of the metallic film to spread the heat flux.
Description
~3~
This invention relates generally to heat exchange of an electrical article and more particularly to coollng an integrated circuit chip.
The temperature of integrated circuit chips mus~ be ]cept below speci-fied limits to ensure proper function, reliability and useul life. The trend in integrated circuit technology is toward large scale integration which results in increased functions per chip. Also, system designers are molmting chips closer together (high density packaging) to minimize propagation delays in the circuit interconnections. As a result of the foregoing, heat is not only in-creased for each chip but is also concentrated due to the closely mounted chips.
Cooling of these chips is a problem.
Cooling of high density packaging has been achieved by placing a liquid cooled~ cold plate in direct contact with a circuit package. A limita-tion of this is that the circuit componen*s have various heights and shapes.
A compliant interface has been used between the cold plate and the circuit com-ponents to accommodate these variations. The interface is heat conductive and electrically insulative and comprises a paste and film.
A limitation of this compliant interface is that it has high thermal resistance and does not spread *he heat uniformly. ~oreover, if the paste breaks down ~chemically), the temperature of the components may rise to unde-sirable levels.
The foregoing illustrates limitations of the known prior art. Thus, it is apparent that it would be advantageous to provide an alternative directed to overcoming one or more of the limitations as set forth above. Accordingly~
a suitable alternative is provided including features more fully disclosed here-inafter.
In one aspect of the present invention, this is accomplished by pro-\ viding an apparatus for cooling integrated circuit chips comprising a cold plate;
,:
- 1 - ~' ~2~3~
a first film of paste in contact with said plate, said first film being heat conduc-tive and elecL~rically insula.tive; a second film in ~ontact with said firs-t film, said second fil.m haviny a pre determined array of interconnected me~.allic pads; a third film in contact with said second filml said third film being heat conductive and el.ectrically insulative, said first, second and third films to~ether comprising a compliant mat; a substrate having a plurality of circuit packages including integrated cir-cuit chips in a predetermined array corresponding to said array of metallic pads; and each of said circuit packages being in con~
tact with said third film adjacent an associa-ted metallic pad.
The invention will now be described in greater detail with reference to the accompanying drawings, in which:
Figure 1 is a perspective view diagrammatically illus-trating apparatus for cooling integrated circuit packages carried by substrates;
Figure 2 is a side view illustrating an embodiment of the invention;
Figure 3 is a plan view illustrating an e-tched configur-~0 ation of a metallic film used in the invention;
E`igure 4 is a perspective view to an enlarged scaleillustrating a portion of the etched film of Figure 3 and a por-tion of an associated substrate;
Figure 5 is a cross-sectional side view illustrating an embodimen~ of the various layers of this invention and an asso-ciated substrate; and 36~
Figure 6 is plan view illustrating an embodiment of a substrate and a predetermined array of integra-ted circuit packages includi~g a superimposed correspondin~ array of pads formed on the etched film.
Apparatus for use in coolin~ integrated circuit chips is generally designated 10 in Figure 1, and includes a well-known cold plate 12 of a suitable material such as aluminum having a ~irst portion 12a connected and sealed to a second opposed portion 12b. An inlet port 14 is connected to an ou-tlet port 16 by an exemplary conduit 18, extending through cold plate 12 in a manner suitable for conducting a fluid, such as cold water, -therethrough so as to avoid leakage within cold plate 12. A pair of openings 20 forme~ through cold plate 12, are provided to accommodate electrical connectors between a pair o~ well-known substrates mounted on opposite portions of cold plate 12. The substrates and known associated integrated circuit packages connected thereto, appear in the following discussion in greater detail.
A compliant mat 21 r Figures 1 and 2, is in contac-t with side each 12a and 12b. Each mat 21 comprises a first film of paste 26, which adheres to portions12a, 12b. Paste 26 is a com-mercially available heat conductive paste. A second, metallic film 28 which may be aluminum but is preferabl~ a ~ilm of copper adheres to paste ~6 and is laminated to a third film 30 by a well-known process called *MICR~CLAD. Third film 30 is a commercially available plastic material and may be the product *TEDLAR/ a polyvinylfluoride, but is preferably the product *KAPTON, a poly-amide. The laminated second and third films 28, 30, respectively, * Trade Mark 3 ~36~
are sold by Fortin Laminating Co. of Sylmar, California, U.S.A.
The thickness of the paste 26 is about .040 inches, the thickness of the copper 28 is about .001 inches, and the thickness o~ the polyamide 30 is about .001 inches.
A well-known substrate 32 associated with por-tions 12a, 12b of cold plate 12 is shown in Figure 2. Each substrate 32 includes a plurali-ty of co~nercially available integrated circuit packages 34 which may be of varying shapes and sizes. As it is well known, such substrates 32 are urged into contact with cold plate 12 for cooling packages 34. Substrates 32 are maintained connected to plate 12 by bolts or some suitable means and are electrically interconnected by connections extending through open-ings 20.
Since mat 21 is compliant, the various shaped and sl~ed packages 34 are able to make contact with a portion of mat 21 at film 30 and therefore the~mal conducti~ity via mat 21 is assured. In order to limit stiffness of mat 21, metallic film 28 is etched, by a suitable process, to a prede-termined array having a plurality of metallic pads 36 interconnected by metallic ~0 branches 38, see Figure 3. The invention contempla-tes that the array of interconnected pads 36 may vary from that shown in the drawings. Also, it is anticipated that it may be desired to i interconnect less than all the pads 36~ In this manner, as illus-trated in Figure 4, metallic portions 40 of film 28 are etched away to e~pose film 30 thus substantially reducing the stiffness of mat 21. As a result of the etched removal of metallic portions 40, pads 36 and interconnecting arms 38 of ~ilm ~8 remain to provide an arra~ suitable for improving a spread of heat Elux through mat 21.
Packages 34 are usually Eoxmed of an insula-tor material such as Alumina or Berylia and include integrated circuit chips 42 imbedded therein, as is well known. These packages 34 are provided on substrate 32 in a predetermined array corresponding to the array of pads 36, see Figures 4, 5 and 6. In this manner, a metallic pad 36 is adjacent a respective package 34. I'hus, heat generated by a chip ~2 is conducted through packa~e 34, film 30, film 28, paste 26, cold plate 12 and is eventually carried from cold plate 12 by fluid such as cold water being forced -through conduit 18.
Si~nificantly, heat may vary between each package 34, therefore, the interconnecting branches 38, aid in spreading heat between various pads 36 thus promoting uniform thermal distribu-tion of mat 21.
In addition to removing stiffness -from mat 21, etching exposes portions of film 28 thus permit-ting visual inspection for bubbles, or air pockets, in paste 26 which are not desired since they are insulative rather than conductive. The copper branches 38 which interconnect the copper pads 36 offer an al-ternat~ ther-mal path between packages 34~ The alternate pa-th concep-t is bene-ficial especially where all of the chips ~2 are not dissipating similar power. Temperature distribution will be substantially unified in paste 26 and the life of paste 26 will therefore be prolonged.
6~V
The foregoing has described apparatus for cooling inte-grated circuit chips which are in contact with a compliant mat including a thermal paste, a metallic film for promoting -the even distribution of heat flux through film 21 and another film for making contact with the integrated circuit packages.
This invention relates generally to heat exchange of an electrical article and more particularly to coollng an integrated circuit chip.
The temperature of integrated circuit chips mus~ be ]cept below speci-fied limits to ensure proper function, reliability and useul life. The trend in integrated circuit technology is toward large scale integration which results in increased functions per chip. Also, system designers are molmting chips closer together (high density packaging) to minimize propagation delays in the circuit interconnections. As a result of the foregoing, heat is not only in-creased for each chip but is also concentrated due to the closely mounted chips.
Cooling of these chips is a problem.
Cooling of high density packaging has been achieved by placing a liquid cooled~ cold plate in direct contact with a circuit package. A limita-tion of this is that the circuit componen*s have various heights and shapes.
A compliant interface has been used between the cold plate and the circuit com-ponents to accommodate these variations. The interface is heat conductive and electrically insulative and comprises a paste and film.
A limitation of this compliant interface is that it has high thermal resistance and does not spread *he heat uniformly. ~oreover, if the paste breaks down ~chemically), the temperature of the components may rise to unde-sirable levels.
The foregoing illustrates limitations of the known prior art. Thus, it is apparent that it would be advantageous to provide an alternative directed to overcoming one or more of the limitations as set forth above. Accordingly~
a suitable alternative is provided including features more fully disclosed here-inafter.
In one aspect of the present invention, this is accomplished by pro-\ viding an apparatus for cooling integrated circuit chips comprising a cold plate;
,:
- 1 - ~' ~2~3~
a first film of paste in contact with said plate, said first film being heat conduc-tive and elecL~rically insula.tive; a second film in ~ontact with said firs-t film, said second fil.m haviny a pre determined array of interconnected me~.allic pads; a third film in contact with said second filml said third film being heat conductive and el.ectrically insulative, said first, second and third films to~ether comprising a compliant mat; a substrate having a plurality of circuit packages including integrated cir-cuit chips in a predetermined array corresponding to said array of metallic pads; and each of said circuit packages being in con~
tact with said third film adjacent an associa-ted metallic pad.
The invention will now be described in greater detail with reference to the accompanying drawings, in which:
Figure 1 is a perspective view diagrammatically illus-trating apparatus for cooling integrated circuit packages carried by substrates;
Figure 2 is a side view illustrating an embodiment of the invention;
Figure 3 is a plan view illustrating an e-tched configur-~0 ation of a metallic film used in the invention;
E`igure 4 is a perspective view to an enlarged scaleillustrating a portion of the etched film of Figure 3 and a por-tion of an associated substrate;
Figure 5 is a cross-sectional side view illustrating an embodimen~ of the various layers of this invention and an asso-ciated substrate; and 36~
Figure 6 is plan view illustrating an embodiment of a substrate and a predetermined array of integra-ted circuit packages includi~g a superimposed correspondin~ array of pads formed on the etched film.
Apparatus for use in coolin~ integrated circuit chips is generally designated 10 in Figure 1, and includes a well-known cold plate 12 of a suitable material such as aluminum having a ~irst portion 12a connected and sealed to a second opposed portion 12b. An inlet port 14 is connected to an ou-tlet port 16 by an exemplary conduit 18, extending through cold plate 12 in a manner suitable for conducting a fluid, such as cold water, -therethrough so as to avoid leakage within cold plate 12. A pair of openings 20 forme~ through cold plate 12, are provided to accommodate electrical connectors between a pair o~ well-known substrates mounted on opposite portions of cold plate 12. The substrates and known associated integrated circuit packages connected thereto, appear in the following discussion in greater detail.
A compliant mat 21 r Figures 1 and 2, is in contac-t with side each 12a and 12b. Each mat 21 comprises a first film of paste 26, which adheres to portions12a, 12b. Paste 26 is a com-mercially available heat conductive paste. A second, metallic film 28 which may be aluminum but is preferabl~ a ~ilm of copper adheres to paste ~6 and is laminated to a third film 30 by a well-known process called *MICR~CLAD. Third film 30 is a commercially available plastic material and may be the product *TEDLAR/ a polyvinylfluoride, but is preferably the product *KAPTON, a poly-amide. The laminated second and third films 28, 30, respectively, * Trade Mark 3 ~36~
are sold by Fortin Laminating Co. of Sylmar, California, U.S.A.
The thickness of the paste 26 is about .040 inches, the thickness of the copper 28 is about .001 inches, and the thickness o~ the polyamide 30 is about .001 inches.
A well-known substrate 32 associated with por-tions 12a, 12b of cold plate 12 is shown in Figure 2. Each substrate 32 includes a plurali-ty of co~nercially available integrated circuit packages 34 which may be of varying shapes and sizes. As it is well known, such substrates 32 are urged into contact with cold plate 12 for cooling packages 34. Substrates 32 are maintained connected to plate 12 by bolts or some suitable means and are electrically interconnected by connections extending through open-ings 20.
Since mat 21 is compliant, the various shaped and sl~ed packages 34 are able to make contact with a portion of mat 21 at film 30 and therefore the~mal conducti~ity via mat 21 is assured. In order to limit stiffness of mat 21, metallic film 28 is etched, by a suitable process, to a prede-termined array having a plurality of metallic pads 36 interconnected by metallic ~0 branches 38, see Figure 3. The invention contempla-tes that the array of interconnected pads 36 may vary from that shown in the drawings. Also, it is anticipated that it may be desired to i interconnect less than all the pads 36~ In this manner, as illus-trated in Figure 4, metallic portions 40 of film 28 are etched away to e~pose film 30 thus substantially reducing the stiffness of mat 21. As a result of the etched removal of metallic portions 40, pads 36 and interconnecting arms 38 of ~ilm ~8 remain to provide an arra~ suitable for improving a spread of heat Elux through mat 21.
Packages 34 are usually Eoxmed of an insula-tor material such as Alumina or Berylia and include integrated circuit chips 42 imbedded therein, as is well known. These packages 34 are provided on substrate 32 in a predetermined array corresponding to the array of pads 36, see Figures 4, 5 and 6. In this manner, a metallic pad 36 is adjacent a respective package 34. I'hus, heat generated by a chip ~2 is conducted through packa~e 34, film 30, film 28, paste 26, cold plate 12 and is eventually carried from cold plate 12 by fluid such as cold water being forced -through conduit 18.
Si~nificantly, heat may vary between each package 34, therefore, the interconnecting branches 38, aid in spreading heat between various pads 36 thus promoting uniform thermal distribu-tion of mat 21.
In addition to removing stiffness -from mat 21, etching exposes portions of film 28 thus permit-ting visual inspection for bubbles, or air pockets, in paste 26 which are not desired since they are insulative rather than conductive. The copper branches 38 which interconnect the copper pads 36 offer an al-ternat~ ther-mal path between packages 34~ The alternate pa-th concep-t is bene-ficial especially where all of the chips ~2 are not dissipating similar power. Temperature distribution will be substantially unified in paste 26 and the life of paste 26 will therefore be prolonged.
6~V
The foregoing has described apparatus for cooling inte-grated circuit chips which are in contact with a compliant mat including a thermal paste, a metallic film for promoting -the even distribution of heat flux through film 21 and another film for making contact with the integrated circuit packages.
Claims
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. Apparatus for use in cooling integrated circuit chips comprising: a cold plate; a first film of paste in contact with said plate, said first film being heat conductive and electrically insulative; a second film in contact with said first film, said second film having a predetermined array of interconnected metal-lic pads; a third film in contact with said second film, said third film being heat conductive and electrically insulative, said first, second and third films together comprising a compliant mat; a substrate having a plurality of circuit packages including integrated circuit chips in a predetermined array corresponding to said array of metallic pads; and each of said circuit packages being in contact with said third film adjacent an associated metallic pad.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46429483A | 1983-02-07 | 1983-02-07 | |
| US464,294 | 1983-02-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1203640A true CA1203640A (en) | 1986-04-22 |
Family
ID=23843332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000428435A Expired CA1203640A (en) | 1983-02-07 | 1983-05-18 | Apparatus for cooling integrated circuit chips |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS6057139U (en) |
| CA (1) | CA1203640A (en) |
| DE (1) | DE3404027A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4312057A1 (en) * | 1993-04-13 | 1993-10-14 | Siegmund Maettig | Arrangement for cooling highly integrated multi=chip modules for data processing systems with high computing power - contains cooling plate and mechanical heat transfer devices, covering and sealing elastic plate |
| JP4626082B2 (en) * | 2001-04-16 | 2011-02-02 | 株式会社日立製作所 | Electric device with cooling channel |
| AU2003240418A1 (en) * | 2002-05-22 | 2003-12-02 | Curamik Electronics Gmbh | Cooling devices for cooling electric components, module consisting of a cooling device and electric components and assembly comprising a cooling device or module and a support |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4092697A (en) * | 1976-12-06 | 1978-05-30 | International Business Machines Corporation | Heat transfer mechanism for integrated circuit package |
-
1983
- 1983-05-18 CA CA000428435A patent/CA1203640A/en not_active Expired
-
1984
- 1984-01-27 JP JP921984U patent/JPS6057139U/en active Granted
- 1984-02-06 DE DE19843404027 patent/DE3404027A1/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6057139U (en) | 1985-04-20 |
| DE3404027A1 (en) | 1984-08-16 |
| JPH0135484Y2 (en) | 1989-10-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |